UNDERFILL EPO-TEK OE121 Black TDS

11年8月3日 10:32 | anndi | 1

双组分underfill产品，好像是用于一道底部填充工艺！

Product Information Sheet

MATERIAL ID:						EPO-TEK^®OE121 Black
Date: 08/2007						Per:
Rev: III
Material Description:				A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the electronics, medical, and optical industries. It is a black version of EPO-TEK^®OE121.
Number of Components:				Two
Mix Ratio by weight:				100:35
Cure Schedule (minimum)				90°C/1 Hour – 80°C/3 Hours – 23°C/2 Days
Specific Gravity:	—	Part A:	1.18		Part B:		0.96
Pot Life:				5 Hours
Shelf Life:				One year at room temperature

NOTE: Container(s) should be kept closed when not in use. Filled systems should be stirred thoroughly before mixing and prior to use

MATERIAL CHARACTERISTICS: To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: varies as required * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:
*Color (before cure):						Part A: BlackPart B: Clear/Colorless				Weight Loss:
*Consistency:				Pourable liquid				@ 200°C:		1.20 %
*Viscosity (23°C):						@ 250°C:				1.71 %
@ 100 rpm	300 – 500 cPs					@ 300°C:				3.91 %
Thixotropic Index:						N/A				Operating Temp:
*Glass Transition Temp:				≥ 55 °C (Dynamic Cure				Continuous:		– 55°C to + 200°C
20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min)								Intermittent:		– 55°C to + 275°C
Coefficient of Thermal Expansion (CTE):								Storage Modulus @ 23°C:		248,652 psi
Below Tg:			43 x 10^-6in/in°C						Ion Content:
Above Tg:	158 x 10^-6in/in°C					Cl^–:				62 ppm
Shore D Hardness:				81				NH₄⁺:		15 ppm
Lap Shear @ 23°C:				1,716 psi				Na⁺:		16 ppm
Die Shear @ 23°C:				≥ 15 Kg / 5,100 psi				K⁺:		1 ppm
Degradation Temp:			350 °C			*Particle Size:			≤ 20 microns
ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:			N/A			Dielectric Constant (1KHz):			3.67
Volume Resistivity @ 23°C:			≥ 1 x 10¹³Ohm-cm			Dissipation Factor (1KHz):			0.012
OPTICAL PROPERTIES @ 23°C:
Spectral Transmission:		< 1 % @ 340-1260 nm			Index of Refraction:		N/A

EPOXY TECHNOLOGY, INC.

14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782

WEB SITE: www.epotek.com

Document No. 43 Rev. D

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anndi

电子胶水达人！