Henkel Loctite Hysol FP4549G(FP0100) TDS

PRODUCT DESCRIPTION

Hysol® FP4549G is a high purity, low stress, liquid epoxy designed for enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 90°C to 120°C with as little as a ½ mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extend thermal cycling performance. FP4549G also exhibits low moisture absorption for improved JEDEC performance.

 

TYPICAL APPLICATIONS

Flip chip on board applications with low moisture absorption for improved JEDEC performance.

 

PROPERTIES OF UNCURED MATERIAL

Value

Chemical Type Epoxy

Appearance Grey

Flow Rate 500 mil flow, 3 mil gap, 90°C) 15 seconds

Filler Content,% ignition, ITM3A 50

Shelf Life @ -40°F,(-40°C), months 9

Typical Range

Viscosity @ 25ºC, (77°F)

Cone & Plate , (Brookfield, cps)

CP52; speed 20 (ITM2A) 2,300

 

Work Life at Room Temperature

24 Hours, (Time required to double viscosity)

 

PHYSICAL PROPERTIES, CURED MATERIAL

Coefficient of Linear Thermal Expansion, ITM65B

Alpha 1, ppm/°C 45

Alpha 2, ppm/°C 143

Glass Transition Temperature (Tg) ºC ITM65B  TMA 140

Flexural Modulus, (Gpa), ASTM D790 5.6

Extractable Ionic Content, ITM107B

Chloride (Cl), ppm < 10

Potassium (K), ppm < 10

Adhesion

Die Shear Strength

Nitride passivated/FR4 substrate 100 mil x 100 mil die at 25°C, (77°F) 50±2Kg

Handling

Gel Time @ 121°C, (250°F), minutes, ITM10N 13.5

 

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

 

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or their strong oxidizing materials

 

Storage Conditions

Frozen storage at approximately –40°C, or lower is required for maximum shelf life. Frozen packages must be completely thawed before use. Warm at room temperature until no longer cool to the touch (normally 60-90 minutes). Do not thaw in an oven.

For best results in dispensing, a 22 gauge needle should be used at 10-20 psi pressure. For best flow rates, a substrate temperature of 90°-120°C is recommended.

 

Cure Schedule

Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results.

Recommended Cure ½ hour @ 165°C

 

With all fast cure systems, the minimum required time for cure depends on the rate of heating. Conditions where a hot plate or heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source.

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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