《Patent Issued for Adhesive Application Apparatus and Control Method of the Same》：
By a News Reporter-Staff News Editor at Journal of Engineering — A patent by the inventor Hoshino, Masaru (Fujimi-machi, JP), filed on February 9, 2012, was published online on December 31, 2013, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.
Patent number 8616151 is assigned to Seiko Epson Corporation (Tokyo, JP).
The following quote was obtained by the news editors from the background information supplied by the inventors: “The present invention relates to an adhesive application apparatus which discharges an adhesive from a discharge head onto adhesion surfaces of media, which are pasted to each other, so as to apply the adhesive thereto in dot-pattern form and a control method of the same.
“As an adhesive application apparatus of this type, an adhesive application apparatus which discharges liquid droplets containing an adhesive with an ink jet system so as to apply the adhesive to an adhesion surface of a medium has been proposed (for example, see JP-A-2009-279538). In the apparatus, an adhesive application amount per unit area on a contour portion is made smaller than that on a center portion of the adhesion surface in order to suppress the adhesive from running off from the contour portion when the adhesion surface is adhered.
“As described above, it is considered that what the adhesive application amount is made smaller while ensuring an adhesive force is an important object in the adhesive application apparatus. Note that a case where the adhesive is applied to both surfaces of media so as to paste them to each other is considered. In this case, the adhesive application amount tends to be larger in comparison with a case where the adhesive is applied to an adhesion surface of one medium only and the medium is pasted to a target medium. Therefore, the above object is considered to be more important in that case.”
In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventor’s summary information for this patent: “An advantage of some aspects of the invention is to provide an adhesive application apparatus and a control method of the same, which suppress an adhesive application amount while ensuring an appropriate adhesive force when adhesion surfaces of media are pasted to each other.
“The adhesive application apparatus and the control method of the same according to some aspects of the invention employ the following means for realizing the above-described advantage.
“An adhesive application apparatus according to an aspect of the invention which discharges an adhesive from a discharge head onto adhesion surfaces of media, which are pasted to each other, so as to apply the adhesive in dot-pattern form, includes a dot pattern setting unit that sets a first dot pattern on which dot groups each of which is formed by a plurality of dots are arranged in an island form and a second dot pattern on which dot groups each of which is formed by a plurality of dots are arranged at opposing positions to the dot groups on the first dot pattern in an island form, and a control unit that controls the discharge head such that the set first dot pattern is formed on one adhesion surface of the adhesion surfaces and controls the discharge head such that the set second dot pattern is formed on the other adhesion surface of the adhesion surfaces.
“In the adhesive application apparatus according to the aspect of the invention, the first dot pattern on which dot groups each of which is formed by a plurality of dots are arranged in an island form and the second dot pattern on which dot groups each of which is formed by a plurality of dots are arranged at opposing positions to the dot groups on the first dot pattern in an island form are set. Further, the discharge head is controlled such that the set first dot pattern is formed on one adhesion surface of the adhesion surfaces and the discharge head is controlled such that the set second dot pattern is formed on the other adhesion surface of the adhesion surfaces. With this, application regions to which adhesive is applied are formed on both the adhesion surfaces in an island form. Therefore, an adhesive application amount can be suppressed in comparison with a case where the adhesive is uniformly applied to the entire of both the adhesion surfaces. The opposing positions indicate positions at which centers of the respective dot groups are identical to each other when the adhesion surface on which dot groups of the first dot pattern are formed and the adhesion surface on which dot groups of the second dot pattern are formed are pasted to each other. Therefore, if the dot groups on the first dot pattern and the dot groups on the second dot pattern are arranged at the opposing positions, the application regions formed on one adhesion surface in an island form and the application regions formed on the other adhesion surface in an island form can be overlapped with one another. Accordingly, a sufficient adhesive force can be obtained even if the adhesive application amount is suppressed. As a result, the adhesive application amount can be also suppressed while ensuring an appropriate adhesive force when the adhesion surfaces of media are pasted to each other.
“Further, in the adhesive application apparatus according to the aspect of the invention, it is preferable that the dot pattern setting unit form each dot group on the second dot pattern so as to be one size smaller than each dot group on the first dot pattern. With this, the adhesive application amount can be further suppressed while overlapping the application regions formed on one adhesion surface in an island form and the application regions formed on the other adhesion surface in an island form with one another. Further, in the adhesive application apparatus according to the aspect of the invention, it is preferable that the dot pattern setting unit arrange each dot group in which dots positioned at an outer-most circumference among dots forming each dot group on the first dot pattern are not formed as each dot group on the second dot pattern.
“Further, in the adhesive application apparatus according to the aspect of the invention, it is preferable that the dot pattern setting unit set the second dot pattern such that each dot group on the second dot pattern is arranged at an opposing position to each dot group on the first dot pattern under a condition that a predetermined type of media is used as the media. With this, the application regions formed on one adhesion surface and the application regions formed on the other adhesion surface can be overlapped with one another only when a predetermined type of media is used. In the adhesive application apparatus according to the aspect of the invention, it is preferable that the dot pattern setting unit set the second dot pattern such that each dot group on the second dot pattern is arranged at a non-opposing position deviated from the opposing position to each dot group on the first dot pattern when media of which type is different from the predetermined type are used as the media. This makes it possible to appropriately cope with media of which type is different from the predetermined type.
“A control method of an adhesive application apparatus which discharges an adhesive from a discharge head onto adhesion surfaces of media, which are pasted to each other, so as to apply the adhesive in a dot-pattern form according to another aspect of the invention, includes; setting a first dot pattern on which dot groups each of which is formed by a plurality of dots are arranged in an island form and a second dot pattern on which dot groups each of which is formed by a plurality of dots are arranged at opposing positions to the dot groups on the first dot pattern in an island form; and controlling the discharge head such that the set first dot pattern is formed on one adhesion surface of the adhesion surfaces and controlling the discharge head such that the set second dot pattern is formed on the other adhesion surface of the adhesion surfaces.
“In the control method of the adhesive application apparatus according to the aspect of the invention, the first dot pattern on which dot groups each of which is formed by a plurality of dots are arranged in an island form and the second dot pattern on which dot groups each of which is formed by a plurality of dots are arranged at opposing positions to the dot groups on the first dot pattern in an island form are set. Further, the discharge head is controlled such that the set first dot pattern is formed on one adhesion surface of the adhesion surfaces and the discharge head is controlled such that the set second dot pattern is formed on the other adhesion surface of the adhesion surfaces. With this, application regions to which adhesive is applied are formed on both the adhesion surfaces in an island form. Therefore, an adhesive application amount can be suppressed in comparison with a case where the adhesive is uniformly applied to the entire of both the adhesion surfaces. Further, if the dot groups on the first dot pattern and the dot groups on the second dot pattern are arranged at the opposing positions, the application regions formed on one adhesion surface in an island form and the application regions formed on the other adhesion surface in an island form can be overlapped with one another. Accordingly, a sufficient adhesive force can be obtained even if the adhesive application amount is suppressed. As a result, the adhesive application amount can be also suppressed while ensuring an appropriate adhesive force when the adhesion surfaces of media are pasted to each other. Note that, in the control method of the adhesive application apparatus, various aspects of the adhesive application apparatuses described above may be employed, or a step that implements each of the functions of the adhesive application apparatuses described above may be added.”
URL and more information on this patent, see: Hoshino, Masaru. Adhesive Application Apparatus and Control Method of the Same. U.S. Patent Number 8616151, filed February 9, 2012, and published online onDecember 31, 2013. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=118&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=5851&f=G&l=50&co1=AND&d=PTXT&s1=20131231.PD.&OS=ISD/20131231&RS=ISD/20131231
Keywords for this news article include: Seiko Epson Corporation.
Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC
《Patent Issued for Adhesive Application Apparatus and Control Method of the Same》：
By a News Reporter-Staff News Editor at Journal of Engineering — A patent by the inventor Hoshino, Masaru (Fujimi-machi, JP), filed on February 9, 2012, was published online on December 31, 2013, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.
Patent number 8616151 is assigned to Seiko Epson Corporation (Tokyo, JP).
The following quote was obtained by the news editors from the background information supplied by the inventors: “The present invention relates to an adhesive application apparatus which discharges an adhesive from a discharge head onto adhesion surfaces of media, which are pasted to each other, so as to apply the adhesive thereto in dot-pattern form and a control method of the same.
“As an adhesive application apparatus of this type, an adhesive application apparatus which discharges liquid droplets containing an adhesive with an ink jet system so as to apply the adhesive to an adhesion surface of a medium has been proposed (for example, see JP-A-2009-279538). In the apparatus, an adhesive application amount per unit area on a contour portion is made smaller than that on a center portion of the adhesion surface in order to suppress the adhesive from running off from the contour portion when the adhesion surface is adhered.
“As described above, it is considered that what the adhesive application amount is made smaller while ensuring an adhesive force is an important object in the adhesive application apparatus. Note that a case where the adhesive is applied to both surfaces of media so as to paste them to each other is considered. In this case, the adhesive application amount tends to be larger in comparison with a case where the adhesive is applied to an adhesion surface of one medium only and the medium is pasted to a target medium. Therefore, the above object is considered to be more important in that case.”
In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventor’s summary information for this patent: “An advantage of some aspects of the invention is to provide an adhesive application apparatus and a control method of the same, which suppress an adhesive application amount while ensuring an appropriate adhesive force when adhesion surfaces of media are pasted to each other.
“The adhesive application apparatus and the control method of the same according to some aspects of the invention employ the following means for realizing the above-described advantage.
“An adhesive application apparatus according to an aspect of the invention which discharges an adhesive from a discharge head onto adhesion surfaces of media, which are pasted to each other, so as to apply the adhesive in dot-pattern form, includes a dot pattern setting unit that sets a first dot pattern on which dot groups each of which is formed by a plurality of dots are arranged in an island form and a second dot pattern on which dot groups each of which is formed by a plurality of dots are arranged at opposing positions to the dot groups on the first dot pattern in an island form, and a control unit that controls the discharge head such that the set first dot pattern is formed on one adhesion surface of the adhesion surfaces and controls the discharge head such that the set second dot pattern is formed on the other adhesion surface of the adhesion surfaces.
“In the adhesive application apparatus according to the aspect of the invention, the first dot pattern on which dot groups each of which is formed by a plurality of dots are arranged in an island form and the second dot pattern on which dot groups each of which is formed by a plurality of dots are arranged at opposing positions to the dot groups on the first dot pattern in an island form are set. Further, the discharge head is controlled such that the set first dot pattern is formed on one adhesion surface of the adhesion surfaces and the discharge head is controlled such that the set second dot pattern is formed on the other adhesion surface of the adhesion surfaces. With this, application regions to which adhesive is applied are formed on both the adhesion surfaces in an island form. Therefore, an adhesive application amount can be suppressed in comparison with a case where the adhesive is uniformly applied to the entire of both the adhesion surfaces. The opposing positions indicate positions at which centers of the respective dot groups are identical to each other when the adhesion surface on which dot groups of the first dot pattern are formed and the adhesion surface on which dot groups of the second dot pattern are formed are pasted to each other. Therefore, if the dot groups on the first dot pattern and the dot groups on the second dot pattern are arranged at the opposing positions, the application regions formed on one adhesion surface in an island form and the application regions formed on the other adhesion surface in an island form can be overlapped with one another. Accordingly, a sufficient adhesive force can be obtained even if the adhesive application amount is suppressed. As a result, the adhesive application amount can be also suppressed while ensuring an appropriate adhesive force when the adhesion surfaces of media are pasted to each other.
“Further, in the adhesive application apparatus according to the aspect of the invention, it is preferable that the dot pattern setting unit form each dot group on the second dot pattern so as to be one size smaller than each dot group on the first dot pattern. With this, the adhesive application amount can be further suppressed while overlapping the application regions formed on one adhesion surface in an island form and the application regions formed on the other adhesion surface in an island form with one another. Further, in the adhesive application apparatus according to the aspect of the invention, it is preferable that the dot pattern setting unit arrange each dot group in which dots positioned at an outer-most circumference among dots forming each dot group on the first dot pattern are not formed as each dot group on the second dot pattern.
“Further, in the adhesive application apparatus according to the aspect of the invention, it is preferable that the dot pattern setting unit set the second dot pattern such that each dot group on the second dot pattern is arranged at an opposing position to each dot group on the first dot pattern under a condition that a predetermined type of media is used as the media. With this, the application regions formed on one adhesion surface and the application regions formed on the other adhesion surface can be overlapped with one another only when a predetermined type of media is used. In the adhesive application apparatus according to the aspect of the invention, it is preferable that the dot pattern setting unit set the second dot pattern such that each dot group on the second dot pattern is arranged at a non-opposing position deviated from the opposing position to each dot group on the first dot pattern when media of which type is different from the predetermined type are used as the media. This makes it possible to appropriately cope with media of which type is different from the predetermined type.
“A control method of an adhesive application apparatus which discharges an adhesive from a discharge head onto adhesion surfaces of media, which are pasted to each other, so as to apply the adhesive in a dot-pattern form according to another aspect of the invention, includes; setting a first dot pattern on which dot groups each of which is formed by a plurality of dots are arranged in an island form and a second dot pattern on which dot groups each of which is formed by a plurality of dots are arranged at opposing positions to the dot groups on the first dot pattern in an island form; and controlling the discharge head such that the set first dot pattern is formed on one adhesion surface of the adhesion surfaces and controlling the discharge head such that the set second dot pattern is formed on the other adhesion surface of the adhesion surfaces.
“In the control method of the adhesive application apparatus according to the aspect of the invention, the first dot pattern on which dot groups each of which is formed by a plurality of dots are arranged in an island form and the second dot pattern on which dot groups each of which is formed by a plurality of dots are arranged at opposing positions to the dot groups on the first dot pattern in an island form are set. Further, the discharge head is controlled such that the set first dot pattern is formed on one adhesion surface of the adhesion surfaces and the discharge head is controlled such that the set second dot pattern is formed on the other adhesion surface of the adhesion surfaces. With this, application regions to which adhesive is applied are formed on both the adhesion surfaces in an island form. Therefore, an adhesive application amount can be suppressed in comparison with a case where the adhesive is uniformly applied to the entire of both the adhesion surfaces. Further, if the dot groups on the first dot pattern and the dot groups on the second dot pattern are arranged at the opposing positions, the application regions formed on one adhesion surface in an island form and the application regions formed on the other adhesion surface in an island form can be overlapped with one another. Accordingly, a sufficient adhesive force can be obtained even if the adhesive application amount is suppressed. As a result, the adhesive application amount can be also suppressed while ensuring an appropriate adhesive force when the adhesion surfaces of media are pasted to each other. Note that, in the control method of the adhesive application apparatus, various aspects of the adhesive application apparatuses described above may be employed, or a step that implements each of the functions of the adhesive application apparatuses described above may be added.”
URL and more information on this patent, see: Hoshino, Masaru. Adhesive Application Apparatus and Control Method of the Same. U.S. Patent Number 8616151, filed February 9, 2012, and published online onDecember 31, 2013. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=118&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=5851&f=G&l=50&co1=AND&d=PTXT&s1=20131231.PD.&OS=ISD/20131231&RS=ISD/20131231
Keywords for this news article include: Seiko Epson Corporation.
Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC