《Henkel Develops New Suite of Encapsulant Materials for Maximum Device Protection》：
Today’s automotive and handheld applications are increasingly exposed to damaging environmental contaminants. Protecting devices within these products from chemicals, fluids and other environmental conditions is critical to ensuring long-term reliability. To this end, the Electronics Group of Henkel has developed and made commercially available three new encapsulant materials that offer exceptional protection for modern devices. LOCTITE ECCOBOND EN 3810T and LOCTITE ECCOBOND EN 3838T are novel encapsulant formulations that can be selectively applied to environmentally-susceptible components, delivering a barrier that is impervious to moisture and fluids. Both materials are ideal for handheld and automotive applications where exposure to various liquids, chemicals and fluids is common and potentially detrimental. The encapsulants cure quickly at moderate temperature, are well-suited for high-volume manufacturing operations with unique rheologies conducive to jet dispensing. LOCTITE ECCOBOND EN 3810T is a non-flexible material and LOCTITE ECCOBOND EN 3838T is a flexible, low Tg encapsulant. When evaluated in temperature/humidity/bias testing, both materials enabled physical protection and stable electronic performance of the encapsulated components.
《Henkel Develops New Suite of Encapsulant Materials for Maximum Device Protection》：
Today’s automotive and handheld applications are increasingly exposed to damaging environmental contaminants. Protecting devices within these products from chemicals, fluids and other environmental conditions is critical to ensuring long-term reliability. To this end, the Electronics Group of Henkel has developed and made commercially available three new encapsulant materials that offer exceptional protection for modern devices.
LOCTITE ECCOBOND EN 3810T and LOCTITE ECCOBOND EN 3838T are novel encapsulant formulations that can be selectively applied to environmentally-susceptible components, delivering a barrier that is impervious to moisture and fluids. Both materials are ideal for handheld and automotive applications where exposure to various liquids, chemicals and fluids is common and potentially detrimental. The encapsulants cure quickly at moderate temperature, are well-suited for high-volume manufacturing operations with unique rheologies conducive to jet dispensing. LOCTITE ECCOBOND EN 3810T is a non-flexible material and LOCTITE ECCOBOND EN 3838T is a flexible, low Tg encapsulant. When evaluated in temperature/humidity/bias testing, both materials enabled physical protection and stable electronic performance of the encapsulated components.