《Bergquist’s New Bond-Ply® LMS-HD Attaches Electronic Components Without the Need for Fasteners》：
Thermally conductive, heat curable laminating adhesive offers excellent dielectric performance and adhesive strength over a wide continuous use temp range.
The Bergquist Company is excited to introduce the newest product in our Bond-Ply® silicone laminate adhesive line: Bond-Ply® LMS-HD. This thermally conductive, heat curable laminate material was designed to structurally adhere power components and PCB’s to a heat sink without the need for mechanical fasteners, such as clips and screws. Bond-Ply® LMS-HD is made up of a high performance, thermally loaded low modulus silicone compound coated on a cured core and double lined with protective films. Its intrinsic isolation core provides high thermal performance and exceptional dielectric isolation. The low modulus silicone design effectively absorbs the mechanical stresses induced by assembly-level CTE mismatch, shock and vibration, while providing excellent thermal and dielectric performance plus adhesive strength.
Dispensing For The Future Ahead
The Bergquist Company is a leading global manufacturer of thermal materials and technologies used to dissipate heat and keep electronic components cool. Headquartered in Chanhassen, MN, it brings high standards and focused leadership, supplying such well recognized names as Gap Pad®, Gap Filler, Sil-Pad®, Bond-Ply®, Hi-Flow® and Thermal Clad® to the electronic industry. Bergquist builds on its innovative abilities to bring new solutions to market, radically helping to shape the growing thermal market with highly-filled liquids and high-performance polymer materials. Using its advanced technology, skilled teams of Bergquist chemists, scientists and engineers collaborate with customers worldwide to create and provide the crucial support and solutions necessary for next-generation products. The current portfolio includes a vast range of products in consumer, computer, automotive, lighting, telecom, medical and military applications.
《Bergquist’s New Bond-Ply® LMS-HD Attaches Electronic Components Without the Need for Fasteners》：
Thermally conductive, heat curable laminating adhesive offers excellent dielectric performance and adhesive strength over a wide continuous use temp range.
The Bergquist Company is excited to introduce the newest product in our Bond-Ply® silicone laminate adhesive line: Bond-Ply® LMS-HD. This thermally conductive, heat curable laminate material was designed to structurally adhere power components and PCB’s to a heat sink without the need for mechanical fasteners, such as clips and screws. Bond-Ply® LMS-HD is made up of a high performance, thermally loaded low modulus silicone compound coated on a cured core and double lined with protective films. Its intrinsic isolation core provides high thermal performance and exceptional dielectric isolation. The low modulus silicone design effectively absorbs the mechanical stresses induced by assembly-level CTE mismatch, shock and vibration, while providing excellent thermal and dielectric performance plus adhesive strength.
Dispensing For The Future Ahead
The Bergquist Company is a leading global manufacturer of thermal materials and technologies used to dissipate heat and keep electronic components cool. Headquartered in Chanhassen, MN, it brings high standards and focused leadership, supplying such well recognized names as Gap Pad®, Gap Filler, Sil-Pad®, Bond-Ply®, Hi-Flow® and Thermal Clad® to the electronic industry. Bergquist builds on its innovative abilities to bring new solutions to market, radically helping to shape the growing thermal market with highly-filled liquids and high-performance polymer materials. Using its advanced technology, skilled teams of Bergquist chemists, scientists and engineers collaborate with customers worldwide to create and provide the crucial support and solutions necessary for next-generation products. The current portfolio includes a vast range of products in consumer, computer, automotive, lighting, telecom, medical and military applications.