Adhesive delivers low stress curing

《Adhesive delivers low stress curing》:

ELO INDUSTRIAL ADHESIVES DELOMONOPOX LT204 epoxy resin for temperature-sensitive parts provides full strength even at a curing temperatures as low as 60C. The multi-purpose, one component adhesive can be processed within 48-hours at room temperature and has enhanced adhesion to many plastics, including LCP, PA and PPS, as well as to metals and FR4 composites. Product can be dispensed through needles with a diameter as small as 200µm, which are common in consumer electronics and enable finest structures. Curing is possible from 60 °C, minimizing the thermal stress and resulting in reduced warpage of the components bonded and fewer tensions within the package.

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