Product Description
Hernon Polycure 744 is a single component, 100% solid system formulated for use on printed circuit boards. This coating can be cured in seconds by high intensity UV light. Low heat (10 minutes at 250ºF) can be used for curing the shaded area. The component may be removed for repair using conventional repair methods of abrasion or localized heat. The repaired part may be recoated off-line using an inexpensive UV light.
Product Benefits
- • Easy to use.
- • Cost effective.
- • Single component, no mixing.
- • 100% solid system (no solvents).
- • Short cure cycles.
- • Dual curing mechanism for shaded area.
《【扒一扒】日本高纯球形硅微粉材料生产商》： 作为一种无机非金属矿物功能性粉体材料，硅微粉广泛应用于电子材料、电工绝缘材料、胶黏剂、特种陶瓷、精密铸造、油漆涂料、油墨、硅橡胶等领域。 目前，世界上只有中国、日本、韩国、美国等少数国家具备硅微粉生产能力... 全文 ?