PRODUCT DESCRIPTION

Hysol® OS2800 is a fast curing, water-white epoxy casting system designed specifically for the encapsulation of seven segment displays. This new system will cure rapidly at temperature above 100°C and can be colored by the addition of specific dye concentrates, AC7113 red, AC7044 green and AC7112 yellow. AC7117 is recommended as a standard diffusant for OS2800.

TYPICAL APPLICATIONS

Optoelectronic Liquid Encapsulant

PROPERTIES OF UNCURED MATERIAL

OS2800 OS2800

Part A Part B

Color Clear Blue Clear

Lt. Yellow

Specific Gravity @ 25°C, (77°F) 1.15 1.18

Gm/cc ASTM D1475

Shelf Life @ 25°C, (77°F), months 12 6

Typical Value

Viscosity @ 25°C, (77°F)

ASTM D2393

Brookfield RVF , cP 6,500 225

PHYSICAL PROPERTIES, CURED MATERIAL

OS2800

Color Water-white

Coefficient of Thermal Expansion, in/in/°C

ASTM D3386 70 x 10-6

Glass Transition, T(g),°C 130

Moisture Absorption, % (ASTM D570)

24 hours @ 115°C 1.88

7 days @ 25°C 0.45

Hardness, Shore D, (ASTM D2240) 90

Tensile Strength, psi, (ASTM D790) 10,000

Flexural Strength, psi (ASTM D790) 20,000

Cured Electrical Properties

25°C

K D

100 Hz 3.17 0.006

1 kHz 3.13 0.011

10 kHz 3.05 0.014

100 kHz 2.96 0.012

K = Dielectric constant by ASTM D150

D = Dissipation Factor by ASTM D150

Performance Properties

T-Cycles (55°C-+100°C)

<1% failures 1,000 cycles

Light Transmittance 400 nm 800 nm

Initial 75% 90%

After 500 hours @ 121°C 56% 90%

Handling

(Recommended mix ratio and typical mixed properties)

Mix Ratio, parts by weight* 100/106

Pot Life, Hours 5-6

Initial Mixed Viscosity @ 25°C, cP 1100

*Mix ratio of these materials is fixed by their chemistry. Any attempt to increase or decrease the cure rate by adding more or less hardener will result in degraded materials.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or their strong oxidizing materials

Cure Schedule

(Recommended for optimum properties)

Recommended Cure 4 hours @ 105°C

Note: Larger parts may require 2 hours @ 85°C pre-cure to minimize exotherm. If exotherm temperature exceeds 140°C, severe yellowing will occur. Typical cured properties were determined using the recommended cure schedule. Some differences in properties may occur with the alternate or other cure schedules.

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol OS2800 TDS (32.3 KB, 125 次)

大年初八开工，没什么紧急的事情要处理，在网上找到了汉高公司新发行的《汉高电子部 电子组装解决方案》，去年曾找到过此份资料的英文版《Henkel Electronics Assembly Solutions》，大约6~7M，今天很偶然的找到了一份中文版，但文件却有大概60M。这里面基本上涵盖了汉高电子胶粘剂所有的行业和相关型号，有兴趣的朋友可以下载学习一下，下面简要的列明一下目录：

组装市场解决方案
汽车电子设备 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 – 7
消费与工业电子设备. . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 9
国防和航空电子设备. . . . . . . . . . . . . . . . . . . . . . . . 10 – 11
手持式通信和计算设备. . . . . . . . . . . . . . . . . . . . . . 12 – 13
绿色和便携式能源 (GAPE) . . . . . . . . . . . . . . . . . . . . . . . 14
LED照明 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
医疗电子设备 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 – 17
射频识别 (RFID) . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 – 19
无线电信设施 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 – 21
组装材料
粘合剂. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 – 31
显示器材料 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 – 35
油墨和涂料 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 – 37
微电子灌封材料(CSP底部填充剂). . . . . . . . . . . . . . . 38 – 39
微电子灌封材料(COB包封材料) . . . . . . . . . . . . . . . . 40 – 42
线路板保护 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 – 51
焊接材料. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 – 57
贴片胶 (Chipbonder™). . . . . . . . . . . . . . . . . . . . . . . 58 – 59
导热材料. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 – 63
附录 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
索引 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 – 68

Assembly Market Solutions
Automotive Electronics 6 – 7
Consumer & Industrial Electronics 8 – 9
Defense & Aerospace Electronics . 10 – 11
Handheld Communications & Computing 12 – 13
Green and Portable Energy (GAPE) . 14
LED Lighting 15
Medical Electronics . 16 – 17
Radio Frequency Identification (RFID) 18 – 19
Wireless DataCom Infrastructure 20 – 21
Assembly Materials
Adhesives . 22 – 31
Display Materials . 32 – 35
Inks & Coatings . 36 – 37
Micro-Encapsulants (CSP Underfills) 38 – 39
Micro-Encapsulants (COB Encapsulants) . . . . . .40 – 42
PCB Protection 43 – 51
Solder Materials 52 – 57
Surface Mount Adhesives (Chipbonder™) 58 – 59
Thermal Management Materials 60 – 63
Appendix 64
Index . 65 – 68

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  汉高电子用胶彩页 (4.7 MB, 49 次)
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昨日在电子胶水论坛上有网友问到hysol的UF3800产品的TDS和MSDS资料，正好有空于是在其官网上找到了这两份资料，顺便从其他资讯网站也了解到了该产品的一些信息，以下报道摘自EMS 007 China：Hysol® UF3800™荣获2009年度美国IPC创新奖，具体内容如下：

“作为底部填充胶的业内领导者，汉高集团不断推新，其中Hysol® UF3800™就是一款新型用于CSP/BGA的可维修底部填充胶，专为手持通讯及娱乐设备应用而设计。

Hysol® UF3800™可室温快速流动，低温快速固化，从而降低能源损耗，减少加热装置等固定成本的投入，提高生产速度。Hysol® UF3800™与多种无铅以及无卤型焊锡膏兼容，适合各种工艺要求并具有出色的可靠性能。在可维修的同时，Hysol® UF3800™还具有相对较高的Tg温度，是市场上唯一一款同时具备室温快速流动，低温快速固化，高Tg点，可维修，以及出色的热、电性能的底部填充胶。

Hysol® UF3800™凭借诸多优点和在客户端的优良表现，Hysol® UF3800™荣获2009年度美国IPC协会创新奖。”

其实作为电子胶水的领先公司汉高乐泰是在不断推出一些新的产品来适合电子封装和组装行业的快速发展的，此款产品的基本TDS参数如下： 全文 »

近日去宇龙公司探讨其UNDERFILL材料认证的事情，了解到其以前使用的为LOCTITE  3536 UNDERFILL材料，以前接触到在手机行业使用多的是loctite 3513型号，这款型号倒是首次看到有厂家在使用。后来查证了一下，此款产品是loctite公司在2007年初推出的一款新产品，可同时用于BGA及CSP封装下面。但是我去loctite官方网站（好像和HENKEL的已经合在一起了）却没有找到其TDS资料，MSDS资料也找不到，或许还没有在其官网上发布。后来通过google搜索了一下，也只找出来了一篇2007年2月汉高的一篇新闻稿关于3536的，还找了一篇乐泰公司的产品彩页中有相对比较详细的技术说明。技术参数大致摘录如下：

Loctite 3536 adhesive is a fast flow,low temperature cure,reworkable epoxy underfill for BGA and CSP devices.It exhibits high adhesion to flexible and rigid circuit substrates.Loctite 3536 adhesive,when fully cured,provides excellent protoction for the solder joints against induced stresses,increasing both the drop test and the temperature cycle performance of the device.

基本技术参数如图： 全文 »

         这几天拜读了乐泰公司的Darryl J. Small和Brian Eisenach所写的《Electrically Conductive Adhesives  Characteristics and Applications》，看完后查阅了一下文章属性，这篇文章应该是在约1999年左右写的。其实当时乐泰公司应该就在关注此项应用，曾经听过一个传闻，乐泰公司当时花了上亿的资金来开发导电胶和导电材料，或许确有其事。

文中提到的几项应用就目前现状而言分析如下：

1、 芯片的粘接可能是现在运用最广泛的，当初设计替代焊锡也只有在一些特殊场合才能用到，不过这个领域几乎是被以前的国民淀粉下的Ablestick所垄断，所以今年听说汉高乐泰将其收购了，只怕也是以此机会来垄断导电银胶的市场。

2、  另外一块关于各向异性导电胶ACA/ACP的预计也是如其所言，不过目前LCD行业在FPC软板与GLASS连接时使用的依旧是ACF材料，此材料目前应该基本还是日立化成和索尼化学垄断。至于ACA在RFID这个新兴领域中的应用目前似乎是德国DELO公司的产品占有较大的市场份额，但是包括象日本三键，黑铅等公司都有类似的产品。汉高收购了Ablestick及EMERSONCUMING后似乎也开始推广其一款用于RFID的ACA产品，看来虽然RFID的发展没有预期的那么快，但大家对其市场前景的期望似乎一直没有降低。 全文 »