PRODUCT DESCRIPTION
ABLEBOND 2030SC provides the following product
characteristics:
Technology Proprietary Hybrid Chemistry
Appearance Silver
Cure Heat cure
pH 4.5
Product Benefits • Snap curable
• Low stress
Application Die attach
Filler Type Silver
Key Substrates Most metals
ABLEBOND 2030SC die attach adhesive has been formulated
for use in high throughput die attach applications. This material
is designed to minimize stress and resulting warpage between
dissimilar surfaces. It can be used in a variety of package sizes
.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm) 4.6
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP):
Speed 5 rpm 11,600
Work Life @ 25°C, hours 24
Shelf Life @ -40°C (from date of manufacture), year 1
TYPICAL CURING PERFORMANCE
Cure Schedule
90 seconds @ 110°C
Alternative Cure Schedule
10 seconds @ 150°C
Weight Loss on Cure
10 x 10 mm Si die on glass slide, % 0.4
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on customers'
experience and their application requirements, as well as customer
curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Thermal Conductivity, W/mK 2.3

Tensile Modulus, DMTA :
@ -65 °C N/mm² 6,200
(psi) (900,000)
@ 25 °C N/mm² 3,300
(psi) (480,000)
@ 150 °C N/mm² 350
(psi) (50,000)
@ 250 °C N/mm² 450
(psi) (65,000)
Extractable Ionic Content, @ 100°C ppm:
Chloride (Cl-) <20
Sodium (Na+) <30
Potassium (K+) <5
Weight Loss After Cure, %:
16 hours Isothermal @ 125ºC 0.41
Ramp to 230ºC 0.5
Electrical Properties:
Volume Resistivity, ohms-cm:
cured 90 seconds @ 110ºC 0.0002
Bond Joint Resistance, ohms:
cured 90 seconds @ 110ºC, Cu/Cu, 25μm Bondline 0.008
TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength vs Substrate:
2 X 2 mm die, kg-f,
Die on Substrate: @ RT
Si die on Pd 1.90
Au die on SS 2.24
Au die on Au 2.11
Die Shear Strength vs Die Shear Temperature:
3 X 3 mm Si die, kg-f,
cured 90 seconds @ 110ºC
Substrate @25°C @150°C @200°C
PBGA-FR4 1.90 0.96 0.87
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
THAWING:
1. Allow container to reach room temperature before use.
2. After removing from the freezer, set the syringes to stand
vertically while thawing.
3. Refer to the Syringe Thaw time chart for the thaw time
recommendation.
4. DO NOT open the container before contents reach 25°C
temperature. Any moisture that collects on the thawed
container should be removed prior to opening the
container.

5. DO NOT re-freeze. Once thawed to -40°C, the adhesive
should not be re-frozen.
Temperature, °C
Syringe Thaw Time, Minutes
30
20
10
0
-10
-20
-30
-40
0 10 20 30 40 50
1cc
3cc 10cc 30cc
DIRECTIONS FOR USE
1. Thawed adhesive should be immediately placed on
dispense equipment for use.
2. If the adhesive is transferred to a final dispensing
reservoir, care must be exercised to avoid entrapment of
contaminants and/or air into the adhesive.
3. Adhesive must be completely used within the products
recommended work life of 24 hours.
4. Silver-resin separation may occur if the adhesive is left
out at 25°C beyond the recommended work life.
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C or
greater than minus (-)40 °C can adversely affect product
properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Henkel Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from
domination of patents owned by others or as a license under
any Henkel Corporation patents that may cover such
processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent
applications.

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  ABLEBOND 2030SC-EN (65.4 KB, 13 次)
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PRODUCT DESCRIPTION
3508™ provides the following product characteristics:
Technology Epoxy
Appearance Black
Components One component
Product Benefits • Reworkable
• Pb-free applications
• Eliminates post-reflow dispenses
and cure steps
• Improves mechanical reliability of
hand-held devices
Cure Reflow
Application Cornerfill
Typical Assembly
Applications
Chip scale packages and BGA
3508™ reworkable cornerfill is designed to cure during pb-free
reflow while allowing self-alignment of IC components. It can
be pre-applied to the board at the corners of the pad site
using a standard SMA dispenser.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate,@ 25 °C mPa∙s (cP) 50,000
Specific Gravity @ 25 °C 1.24
Pot Life @ 25ºC, days >30
Shelf Life @ 2 to 8°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
Pb-free solder reflow profile @ 245°C
(3 hours @ 180°C for Tg testing)
The above cure profile is a guideline recommendation. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion , ppm/°C:
Below Tg 55
Above Tg 175
Glass Transition Temperature (Tg) by TMA, °C 115
Shore Hardness, Durometer D 71
Storage Modulus, 25°C, GPa 2.48
Tensile Modulus N/mm² 1,130
(psi) (163,892)
Tensile Strength N/mm² 56.5
(psi) (8,190)

GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 to 8°C. Storage below 2°C or greater
than 8°C can adversely affect product properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Do not return products to refrigerated storage; any surplus
product should be discarded.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Henkel Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from
domination of patents owned by others or as a license under
any Henkel Corporation patents that may cover such
processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent
applications.

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  loctite 3508 TDS (55.9 KB, 8 次)
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PRODUCT DESCRIPTION

LOCTITE® 5939™ provides the following product characteristics:

Technology MS® – Polymer

Chemical Type Modified silane polymer

Appearance (uncured) Smooth grey liquidLMS

Components One part – requires no mixing

Viscosity Paste

Cure Atmospheric moisture

Application Sealing

 

LOCTITE® 5939™ is a high strength, high elongation adhesive used for elastic bonding and sealing on various substrates. It is a one component adhesive/sealant based on a modified silane polymer, which cures by reaction with moisture to an elastomeric thermoset product. The skin formation and curing times are dependent on humidity, temperature, and joint depth. By increasing the exposure to moisture these times can be reduced. LOCTITE® 5939™ is sag-resistant leading to high initial tack. It is non-corrosive and free of solvents, isocyanates, silicones, PVC, and is odorless. It demonstrates good adhesion without primer to a wide variety of substrates and is compatible with suitable paint systems. The adhesive/sealant also demonstrates good UV resistance and can therefore be used for interior and exterior applications.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL 全文 »

今日论坛有站友咨询到“乐泰3525胶水，合适的工作环境是多少？郁闷，因为车间温差有变化，经常会出现多胶少胶现象。”，到乐泰的官方网站下载了3525的TDS技术资料来看看，发现居然有中文版本、英文版本及西班牙语等版本。下载了英文版和中文版，不过看了一下中文版，居然出现了好几处非常明显的错误，虽然此份资料应该是3525的TDS，但在中文版本描述中居然出现了几个完全不同的型号（5182、3103、3493），但是阅读英文版本是却完全没有这个问题。后来查阅了一下前面那几个错误的型号，居然乐泰都有对应的产品，更搞笑的是3103、3493都有中文版本，但描述的第一句话却都将其称为5182，与3525的中文版如出一辙。估计乐泰的中文版资料也是有专门团队编写的，让如此明显的错误实属不该，好歹也是五百强下面的企业。正好公司前几天也在让品管和技术部将公司产品的TDS资料升级定稿，我当时给他们最底线的原则是同一份资料里面决不能出现前后不一致的数据，更别说把型号弄错了。 不过乐泰以上型号的英文版本TDS却完全没有出现中文版里面的错漏，估计也还是国人在翻译的过程中出的错误。

现将中文的TDS复制至此，有兴趣的朋友可以到后面下载查看之，也希望乐泰的技术团队能发现这个问题并纠正之，错漏的TDS原封不动的摘录如下： 全文 »

PRODUCT DESCRIPTION

LOCTITE® 3563™ provides the following product characteristics:

Technology Epoxy

Chemical Type Epoxy

Appearance (uncured) Off-white to beige liquidLMS

Components One component – requires no mixing

Cure Heat cure

Cure Benefit Production – high speed curing

Application Underfill for flip chip devices

Dispense Method Syringe

Key Substrates SMD components to PCB

Reworkable No

 

LOCTITE® 3563™ is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, such as CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 μm. When fully cured, it minimizes induced stress at solder joint and thus improves thermal cycling performance.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity@ 25 °C 1.52

Viscosity, Cone & Plate rheometer, 2 ° Cone, mPa·s (cP):

Temperature: 25 °C, Shear Rate: 5 s-1 5,000 to 12,000LMS

Temperature: 25 °C, Shear Rate: 20 s-1 5,000 to 12,000

Capillary Flow Rate, seconds:

Flow time, 100 °C, glass to glass, 25 μm:

6.35 mm flow ≤15

12.7 mm flow ≤45LMS

25.4 mm flow ≤150

VOC, ASTM D 3960, g/l <10

Moisture Content, ASTM D 4017, % 0.01

Total Volatile Content, ASTM D 2369, % <1

Filler Content, % 40

Particle Size, μm:

Average 1 to 2

Maximum <10

Pot life @ 22 °C, hours 8 to 12

Flash Point – See MSDS

 

Recommended Curing Conditions

>7 minutes @ 150 °C

>5 minutes @ 165 °C

 

Note: With all fast cure systems, the time required for cure depends on the rate of heating. Conditions where a hot plate or heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source. Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results. 全文 »

PRODUCT DESCRIPTION

Hysol® FP4549G is a high purity, low stress, liquid epoxy designed for enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 90°C to 120°C with as little as a ½ mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extend thermal cycling performance. FP4549G also exhibits low moisture absorption for improved JEDEC performance.

 

TYPICAL APPLICATIONS

Flip chip on board applications with low moisture absorption for improved JEDEC performance.

 

PROPERTIES OF UNCURED MATERIAL

Value

Chemical Type Epoxy

Appearance Grey

Flow Rate 500 mil flow, 3 mil gap, 90°C) 15 seconds

Filler Content,% ignition, ITM3A 50

Shelf Life @ -40°F,(-40°C), months 9

Typical Range

Viscosity @ 25ºC, (77°F)

Cone & Plate , (Brookfield, cps)

CP52; speed 20 (ITM2A) 2,300

 

Work Life at Room Temperature 全文 »

PRODUCT DESCRIPTION

Hysol® FP4549FC is a high purity, low stress, liquid epoxy designed for enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 110°C to 120°C with as little as a ½ mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extend thermal cycling performance. FP4549FC also exhibits low moisture absorption for improved JEDEC performance. FP4559FC has been specially formulated for improved compatibility with no-clean flux residues.

 

TYPICAL APPLICATIONS

Encapsulant for Flip Chip Underfill

 

PROPERTIES OF UNCURED MATERIAL

Color White

Filler content, (%, ignition) (ITM3A) 50

Flow Rate (500 mil flow, 3 mil gap, 110°C) 18 seconds

Shelf Life @-40°C, (-40°F), months 9

Typical Value

Viscosity @ 25°C, (77°F) (ITM2R)

Brookfield Cone & Plate

CP52, Speed 20 13,000

 

PHYSICAL PROPERTIES, CURED MATERIAL

Color White/Yellow

Glass Transition (Tg), °C, (TMA) (ITM65B) 125

Coefficient of Linear Thermal Expansion, (ITM65B)

α1, ppm/°C 45

α2, ppm/°C 143

Extractable Ionic Content, @ 121°C (ITM107B)

Chloride (Cl-), ppm 6

Sodium (Na+), ppm 2

Flexural Modulus, Gpa (ASTM D790) 5.6

Adhesion

Die shear strength 50±2Kg

Nitride passivated/FR4 substrate

100 mil x 100 mil die @ 25°C, (77°F)

 

Handling

Gel Time @ 121°C, (250°F), minutes, (ITM10N) 12

Pot Life @ 25°C, (77°F), hours 12

(ITM10T), (time required to double viscosity)

 

Frozen storage at approximately –40°C or lower is required for maximum shelf life. Frozen packages must be completely thawed before use. Warm at room temperature until no longer cool to the touch (normally 60-90 minutes). Do not thaw in an oven. For best results in dispensing, a 22 gauge needle should be used at 10-20 psi pressure. For best flow rates, a substrate temperature of 110-120°C is recommended.

 

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

 

Cure Schedule

Recommended Cure 30 minutes @ 165°C

 

Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results. With all fast cure systems, the minimum required time for cure depends on the rate of heating. Conditions where a hot plate or heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source.

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4549FC TDS (78.2 KB, 93 次)

PRODUCT DESCRIPTION

FP4549 provides the following product characteristics:

Technology Epoxy

Appearance White

Product Benefits • High purity

• Low stress

• Liquid flexible

• Low moisture absorption

Filler Weight, % 50

Components One-component

Cure Heat cure

Application Encapsulation

Typical Applications Flip Chip

 

FP4549 also exhibits low moisture absorption for improved JEDEC performance.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Brookfield – Cone & Plate, 25 °C, mPa·s (cP):

Spindle 52, speed 20 rpm 2,300

Pot Life @ 25 °C(time to double viscosity), hours 24

Gel Time @ 121ºC, minutes 13.5

Shelf Life: @ -40ºC, months 9

Flow Rate @ 90°C, seconds

500mil travel, 3mil gap 15

Flash Point – See MSDS

 

TYPICAL CURING PERFORMANCE

Recommended Cure Schedule

30 minutes @ 165°C

 

The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

 

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion , ppm/°C:

Below Tg 45

Above Tg 143

Glass Transition Temperature (Tg) °C 140

(Cured 7 minutes @ 160ºC)

Extractable Ionic Content, ppm:

Chloride (Cl-) 3

Sodium (Na+) 2

Flexural Modulus N/mm² 5.6

(psi) (784)

 

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

Die Shear Strength, Kg:

Nitride Passivated/FR4 substrate:

100 mil x 100 mil die @ 25°C 50±2

 

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

 

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.

 

Not for product specifications

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

 

THAWING:

1. Allow container to reach room temperature before use.

2. Warm at room temperature until no longer cool to the touch (normally 60 to 90 minutes).

3. DO NOT thaw in an oven.

 

Directions for use

1. For best flow rates, a preheat temperature of 90 °C is recommended.

2. For best results in dispensing a 22 gauge needle should be used at 10 to 20 psi pressure.

 

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

 

Optimal Storage: -40 °C

Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

 

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4549 TDS (66.2 KB, 133 次)

PRODUCT DESCRIPTION

FP4323 provides the following product characteristics:

Technology Epoxy

Appearance (Part A) Black

Appearance (Part B) Cream

Appearance (Mixed) Black

Product Benefits • Low CTE for improved thermal cycling

• High purity

• Thixotropic

• Excellent moisture resistance

• Excellent chemical resistance

Filler Weight, % 65

Filler Type Silica

Mix Ratio, by weight – Part

A: Part B

100 : 100

Cure Heat cure

Application Encapsulant – glob top

Typical Assembly

Applications

Chip-on-board and Plastic PGA

applications

Substrates Plastic

FP4323 liquid epoxy encapsulant glob top is designed with flow capabilities that allows encapsulation without flowing beyond the chip.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Part A Properties

Viscosity, Brookfield – RVF, 25 °C, mPa·s (cP):

Spindle 7, speed 2 rpm 172,500

Spindle 7, speed 20 rpm 115,000

Specific Gravity @ 25 °C 1.7

Shelf Life @ 25°C, months 12

Flash Point – See MSDS

Part B Properties

Viscosity, Brookfield – RVF, 25 °C, mPa·s (cP):

Spindle 7, speed 2 rpm 250,000

Spindle 7, speed 20 rpm 72,500

Specific Gravity @ 25 °C 1.7

Shelf Life @ 25°C, months 12

Flash Point – See MSDS

Mixed Properties

Mixed Viscosity, Brookfield – RVF, 25 °C, mPa·s (cP):

Spindle 7, speed 2 rpm 220,000

Spindle 7, speed 20 rpm 100,000

Specific Gravity @ 25 °C 1.67

Gel Time @ 121ºC, minutes 11

Pot Life @ 25 °C, days 2

Shelf Life @ -40 °C, months 9

Working Life@ 25 °C, hours 48

Flash Point – See MSDS

 

TYPICAL CURING PERFORMANCE

Recommended Cure Schedule

4 hours @ 150°C or

1 hour @ 170°C

Alternative Cure Schedule

2 hours @ 125°C + 4 hours @ 150°C

Substrate Temperature

Temperature, °C 90

The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

A two-step cure will minimize stress.

 

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion ASTM D-3386, ppm/°C:

Below Tg (40 to 120°C) 28

Glass Transition Temperature (Tg) by TMA, °C 174

Thermal Conductivity, W/mk 0.63

Shore Hardness, ISO 868, Durometer D 97

Linear Shrinkage, % 0.43

Extractable Ionic Content, ppm:

Chloride (Cl-) 20

Sodium (Na+) 20

Potassium (K+) 20

Water Absorption, ISO 62 , %:

8 hours @ 100°C 0.25

Electrical Properties:

Dielectric Constant / Dissipation Factor, IEC 60250:

1kHz 3.7 / 0.004

100-MHz 3.59 / 0.085

1-GHz 3.44 / 0.075

Volume Resistivity, IEC 60093, Ω·cm 6.2×1014

Surface Resistivity, IEC 60093, Ω 1.6×1014

 

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

 

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be used with chlorine or other strong oxidizing materials.

 

DIRECTIONS FOR USE

1. For best results, dispense onto substrate warmed to 90°C.

2. FP4323 may settle upon storage. Each container must be thoroughly mixed before combining.

3. Mix Part A and Part B separately for about 5 to 10 minutes on a standard paint shaker to ensure complete dispersion of the filler.

4. Stir with a large spatula to check for lumps.

5. Cold storage will minimize filler settling.

6. Part B may form a crust if exposed to moist air for an extended period of time. Keep in a well sealed container. For best results, do not use Part B which contains this crust caused by moisture contamination.

7. Thorough mechanical mixing of Part A and Part B together is required for best results. Hand mixing alone is not recommended.

 

Not for product specifications

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

 

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

 

Optimal Storage: -40°C. Storage below -40°C or greater than -40°C can adversely affect product properties.

 

Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

 

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4323 TDS (68.0 KB, 96 次)

DESCRIPTION

Hysol® FP4322 is a high purity liquid epoxy encapsulant designed for semiconductor encapsulation. It is a high flow material which requires a cavity or flow control barrier to prevent excessive flow. Hysol FP4322 is suitable for encapsulation of bare chips mounted to plastic substrates as well as potting of small hybrid circuit modules. Spot encapsulation of bare chips on ceramic substrates is not suggested in most cases.

TYPICAL APPLICATIONS

Semiconductor encapsulation.

PROPERTIES OF UNCURED MATERIAL

Color Black

Filler Content, % (ASTM D2584) 65

Specific Gravity @25°C, (77°F)

(ASTM D1475) 1.69

Shelf Life @-40°C (-40°F), months 9

Typical Value

Viscosity @ 25°C, (77°F)

(ITM2A) (ASTM D2393)

Brookfield RVF

Spindle 7, Speed 2, Cp 92,500

Spindle 7, Speed 20, Cp 52,500

PHYSICAL PROPERTIES, CURED MATERIAL

Color Black

Coefficient of Thermal Expansion, in/in/°C

(ASTM D3386)

(40°-120°C) 30 x 10-6

Linear Shrinkage, %(ASTM D2566) .43

Density, gm/cc (ASTM D792) 1.7

Glass Transition, (Tg), °C, (ASTM D3386) 160

Hardness, Shore D (ASTM D2240) 97

Moisture Absorption, % (ASTM D570)

Immersion @ 100°C, 8 hrs 0.25

Extractable Ionic Content (ITM107B)

Chloride (Cl-), ppm 25

Potassium (K+), ppm 25

Sodium 25

Cured Electrical Properties

25°C

K D

1kHz 3.18 0.005

10kHz 3.15 0.006

100kHz 3.04 0.11

Volume Resistivity 6.2 x 1014

Surface Resistivity 1.6 x 1014

K = Dielectric constant by ASTM D150

D = Dissipation Factor by ASTM D150

Vol. Res.= Volume Resistivity in ohm-cm by ASTM D257

Surf.Res.= Surface Resistivity in ohm by ASTM D257

Handling

Pot Life @ 25°C, 77°F, days, 1

(ITM10T), time to double in viscosity

Gel Time @ 121°C, (250°F), minutes,

(ITM10N) 11

Shelf life at room temperature is approximately 2 days. Product may be stored at –40°C for greater than 6 months. Frozen packages must be thawed before use. Warm at room temperature until no longer cool to the touch (normally 20-60 minutes). Do not thaw in an oven or water bath. For best results FP4322 should be dispensed onto a substrate warmed to approximately 90°C. This will help minimize air entrapment under bonding wire.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or their strong oxidizing materials

 

Cure Schedule

Recommended Cure 2-3 hours @ 170°C or

3-6 hours @ 150°C

Alternate Cure 1 hour @ 125°C plus

(Low Stress) 4 hours @ 150°C

(Designed for packages which are effected by high levels of stress.)

A two-step cure will minimize stress and warpage on large substrates. Curing below 140°C is not recommended. User should gel devices immediately after dispensing to prevent moisture degradation of ultimate cure properties. Use suggested cure schedules as general guidelines; other cure schedules may yield satisfactory results.

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4322 TDS (22.7 KB, 109 次)