DESCRIPTION

Hysol® FP4322 is a high purity liquid epoxy encapsulant designed for semiconductor encapsulation. It is a high flow material which requires a cavity or flow control barrier to prevent excessive flow. Hysol FP4322 is suitable for encapsulation of bare chips mounted to plastic substrates as well as potting of small hybrid circuit modules. Spot encapsulation of bare chips on ceramic substrates is not suggested in most cases.

TYPICAL APPLICATIONS

Semiconductor encapsulation.

PROPERTIES OF UNCURED MATERIAL

Color Black

Filler Content, % (ASTM D2584) 65

Specific Gravity @25°C, (77°F)

(ASTM D1475) 1.69

Shelf Life @-40°C (-40°F), months 9

Typical Value

Viscosity @ 25°C, (77°F)

(ITM2A) (ASTM D2393)

Brookfield RVF

Spindle 7, Speed 2, Cp 92,500

Spindle 7, Speed 20, Cp 52,500

PHYSICAL PROPERTIES, CURED MATERIAL

Color Black

Coefficient of Thermal Expansion, in/in/°C

(ASTM D3386)

(40°-120°C) 30 x 10-6

Linear Shrinkage, %(ASTM D2566) .43

Density, gm/cc (ASTM D792) 1.7

Glass Transition, (Tg), °C, (ASTM D3386) 160

Hardness, Shore D (ASTM D2240) 97

Moisture Absorption, % (ASTM D570)

Immersion @ 100°C, 8 hrs 0.25

Extractable Ionic Content (ITM107B)

Chloride (Cl-), ppm 25

Potassium (K+), ppm 25

Sodium 25

Cured Electrical Properties

25°C

K D

1kHz 3.18 0.005

10kHz 3.15 0.006

100kHz 3.04 0.11

Volume Resistivity 6.2 x 1014

Surface Resistivity 1.6 x 1014

K = Dielectric constant by ASTM D150

D = Dissipation Factor by ASTM D150

Vol. Res.= Volume Resistivity in ohm-cm by ASTM D257

Surf.Res.= Surface Resistivity in ohm by ASTM D257

Handling

Pot Life @ 25°C, 77°F, days, 1

(ITM10T), time to double in viscosity

Gel Time @ 121°C, (250°F), minutes,

(ITM10N) 11

Shelf life at room temperature is approximately 2 days. Product may be stored at –40°C for greater than 6 months. Frozen packages must be thawed before use. Warm at room temperature until no longer cool to the touch (normally 20-60 minutes). Do not thaw in an oven or water bath. For best results FP4322 should be dispensed onto a substrate warmed to approximately 90°C. This will help minimize air entrapment under bonding wire.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or their strong oxidizing materials

Cure Schedule

Recommended Cure 2-3 hours @ 170°C or

3-6 hours @ 150°C

Alternate Cure 1 hour @ 125°C plus

(Low Stress) 4 hours @ 150°C

(Designed for packages which are effected by high levels of stress.)

A two-step cure will minimize stress and warpage on large substrates. Curing below 140°C is not recommended. User should gel devices immediately after dispensing to prevent moisture degradation of ultimate cure properties. Use suggested cure schedules as general guidelines; other cure schedules may yield satisfactory results.

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4322 TDS (22.7 KB, 119 次)

PRODUCT DESCRIPTION

Hysol® OS2800 is a fast curing, water-white epoxy casting system designed specifically for the encapsulation of seven segment displays. This new system will cure rapidly at temperature above 100°C and can be colored by the addition of specific dye concentrates, AC7113 red, AC7044 green and AC7112 yellow. AC7117 is recommended as a standard diffusant for OS2800.

TYPICAL APPLICATIONS

Optoelectronic Liquid Encapsulant

PROPERTIES OF UNCURED MATERIAL

OS2800 OS2800

Part A Part B

Color Clear Blue Clear

Lt. Yellow

Specific Gravity @ 25°C, (77°F) 1.15 1.18

Gm/cc ASTM D1475

Shelf Life @ 25°C, (77°F), months 12 6

Typical Value

Viscosity @ 25°C, (77°F)

ASTM D2393

Brookfield RVF , cP 6,500 225

PHYSICAL PROPERTIES, CURED MATERIAL

OS2800

Color Water-white

Coefficient of Thermal Expansion, in/in/°C

ASTM D3386 70 x 10-6

Glass Transition, T(g),°C 130

Moisture Absorption, % (ASTM D570)

24 hours @ 115°C 1.88

7 days @ 25°C 0.45

Hardness, Shore D, (ASTM D2240) 90

Tensile Strength, psi, (ASTM D790) 10,000

Flexural Strength, psi (ASTM D790) 20,000

Cured Electrical Properties

25°C

K D

100 Hz 3.17 0.006

1 kHz 3.13 0.011

10 kHz 3.05 0.014

100 kHz 2.96 0.012

K = Dielectric constant by ASTM D150

D = Dissipation Factor by ASTM D150

Performance Properties

T-Cycles (55°C-+100°C)

<1% failures 1,000 cycles

Light Transmittance 400 nm 800 nm

Initial 75% 90%

After 500 hours @ 121°C 56% 90%

Handling

(Recommended mix ratio and typical mixed properties)

Mix Ratio, parts by weight* 100/106

Pot Life, Hours 5-6

Initial Mixed Viscosity @ 25°C, cP 1100

*Mix ratio of these materials is fixed by their chemistry. Any attempt to increase or decrease the cure rate by adding more or less hardener will result in degraded materials.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or their strong oxidizing materials

Cure Schedule

(Recommended for optimum properties)

Recommended Cure 4 hours @ 105°C

Note: Larger parts may require 2 hours @ 85°C pre-cure to minimize exotherm. If exotherm temperature exceeds 140°C, severe yellowing will occur. Typical cured properties were determined using the recommended cure schedule. Some differences in properties may occur with the alternate or other cure schedules.

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

华为网盘下载：http://dl.dbank.com/c0zx7ajc98

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  Henkel Loctite Hysol OS2800 TDS (32.3 KB, 126 次)

大年初八开工，没什么紧急的事情要处理，在网上找到了汉高公司新发行的《汉高电子部 电子组装解决方案》，去年曾找到过此份资料的英文版《Henkel Electronics Assembly Solutions》，大约6~7M，今天很偶然的找到了一份中文版，但文件却有大概60M。这里面基本上涵盖了汉高电子胶粘剂所有的行业和相关型号，有兴趣的朋友可以下载学习一下，下面简要的列明一下目录：

组装市场解决方案
汽车电子设备 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 – 7
消费与工业电子设备. . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 9
国防和航空电子设备. . . . . . . . . . . . . . . . . . . . . . . . 10 – 11
手持式通信和计算设备. . . . . . . . . . . . . . . . . . . . . . 12 – 13
绿色和便携式能源 (GAPE) . . . . . . . . . . . . . . . . . . . . . . . 14
LED照明 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
医疗电子设备 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 – 17
射频识别 (RFID) . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 – 19
无线电信设施 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 – 21
组装材料
粘合剂. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 – 31
显示器材料 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 – 35
油墨和涂料 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 – 37
微电子灌封材料(CSP底部填充剂). . . . . . . . . . . . . . . 38 – 39
微电子灌封材料(COB包封材料) . . . . . . . . . . . . . . . . 40 – 42
线路板保护 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 – 51
焊接材料. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 – 57
贴片胶 (Chipbonder™). . . . . . . . . . . . . . . . . . . . . . . 58 – 59
导热材料. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 – 63
附录 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
索引 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 – 68

Assembly Market Solutions
Automotive Electronics 6 – 7
Consumer & Industrial Electronics 8 – 9
Defense & Aerospace Electronics . 10 – 11
Handheld Communications & Computing 12 – 13
Green and Portable Energy (GAPE) . 14
LED Lighting 15
Medical Electronics . 16 – 17
Radio Frequency Identification (RFID) 18 – 19
Wireless DataCom Infrastructure 20 – 21
Assembly Materials
Adhesives . 22 – 31
Display Materials . 32 – 35
Inks & Coatings . 36 – 37
Micro-Encapsulants (CSP Underfills) 38 – 39
Micro-Encapsulants (COB Encapsulants) . . . . . .40 – 42
PCB Protection 43 – 51
Solder Materials 52 – 57
Surface Mount Adhesives (Chipbonder™) 58 – 59
Thermal Management Materials 60 – 63
Appendix 64
Index . 65 – 68

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  汉高电子用胶彩页 (4.7 MB, 49 次)
您没有权限下载此文件。

记得此次收购是在2007年在Henkel的官网上看到的此则新闻知道的Henkel takes further step towards acquisition of National Starch businesses，链接网址为：http://goo.gl/HPjw，真正完成收购是在2008年由此则新闻公布的Henkel closes acquisition of National Starch businesses，链接网址为：http://goo.gl/abe6，其实这些跨国公司之间的兼并收购挺复杂的，准确的说是汉高公司此次跟随荷兰化学和涂料巨头Akzo Nobel公司(AKZOY)一起收购帝国化工公司（ICI），而汉高公司将得到ICI 旗下National Starch公司的粘合剂和电子材料业务部门，Akzo Nobel公司收购其母公司帝国化工公司。而类似Emersoncuming、Ablestick、Ablebond都是原来国民淀粉旗下电子材料部门的品牌！ 因为碰到最多的是Emersoncuming的产品，所以此博文的题目就以此为题!

其实收购后不论是从产品还是从品牌来讲，汉高公司都在逐渐的将收购来的业务逐步并入到自有品牌下，而逐步弱化原来Emersoncuming等品牌。在以前这篇博文里面就有和网友@neal886讨论过，博文题目及地址如下：《LOCTITE/HYSOL 最新underfill产品UF3800》http://goo.gl/D7zs。 从产品本身来讲，就以前博文中提到的产品为例，《Hysol ECCOBOND CE3126 各向异性导电胶》也是由原来Emersoncuming旗下的14281-99B-Snap Heat Cure Anisotropic Conductive Adhesive Paste产品演变而来，具体可以参看以上两篇文章。另外还有以前Emersoncuming主推的1218型号underfill后来也被纳入到汉高旗下的Hysol品牌，不过估计可能是文字编辑错误，HYSOL 1218产品的玻璃转化温度为60度，而原来资料的玻璃转化温度为15度，为此和网友@dovs在电子胶水论坛这个帖子里还讨论了半天http://www.r4e.cn/bbs/thread-61-5-1.html，有兴趣的朋友可以去看看并下载相关技术资料对比一下。

另外从收购后销售渠道规整来讲，好像也有较大的变化，这个也是听以前Emersoncuming的代理商讲的，据说从全球而言汉高旗下的电子胶粘剂业务与国民淀粉的电子胶粘剂部分合并后，基本都是由原国民淀粉的人员来主导，但是好像据说在中国大陆地区是反过来的，合并后主要由汉高乐泰的人来主导，所以据说国内的原Emersoncuming的代理商都变成了汉高乐泰的代理商，日子没有以前那么好过了，呵呵！另外就收购前而言这两家公司的销售模式和方法也是有着很大的区别的，估计合并后也需要一段时间来磨合。而原来国民淀粉公司的直属人员据说也流失不少，估计也分散到各其他相关行业和公司里面了。另外因为Emersoncuming公司的同类产品以前价位一直比汉高要高，合并之后据说为了一致，将汉高公司的同类产品全部做了提价措施。

最后再谈谈前面说到的LOCTITE/HYSOL 最新underfill产品UF3800，当时就这款产品是否是由原来Emersoncuming的或者Hysol的什么77B技术的衍生而来也有一些传闻，包括UF3800的的生产地在何处等等都众说纷纭，呵呵！ 不过经过这一年多的了解，就此款产品也得到了一些更多的消息，据说这款产品是由汉高乐泰烟台的研发部门花了不少时间研究出来的，而生产自然就在烟台了。另外这款产品其实就是为Apple公司的Iphone、Itouch等一些产品定制开发的，这个定制需求估计是苹果公司和其代工厂富士康共同发起的，当时富士康也有一个工艺部门在为苹果公司评估新的underfill胶水，当时我们公司的曾工开发的一款超低粘度胶水也通过了富士康自身第一轮的评估，不过后面估计富士康自身评估的几家underfill由于产品品牌、公司规模及综合性能等一系列原因，最终未能获得苹果公司的认可，但迫于苹果这样世界级公司的要求，汉高乐泰还真是为他专门做出了这样一款UF3800的低粘度375cps的产品。这两年是苹果产品销售最火爆的两年，据说就2009年而言，UF3800这一款型号的销售达到了五千万人民币以上。后来查看了一下苹果公司2009年的年报，当年就iphone产品而言的销量好像都有两千多万台，如果iphone全部使用UF3800产品，加上其他苹果公司的移动产品都使用underfill工艺的话，估计五千万的销售额似乎还保守了一些，呵呵！

总而言之，通过这样的兼并收购，汉高公司可是进一步巩固了其在电子封装组装胶粘产品的核心地位，目前在这一块貌似还有日本Namics还是个别领域还是比较强的，会不会哪天也被汉高收购了呢，类似以前Hysol被收购一样!

说来惭愧，有将近三四个月没有更新博文了，只怪自己太懒了些，以后争取每周末更新一篇！

两份1218TDS资料供下载参考：

华为网盘下载：http://dl.dbank.com/c0tb5jdtlb

XE1218-EN XE 1218 rev 1.06

今天在看EMasia中国电子制造杂志时，看到上面有汉高公司的一个新产品的广告，Hysol ECCOBOND CE3126 各向异性导电胶。“汉高新型各向异性导电胶CE3126可满足RFID及低成本电子产品对高性能、高可靠性以及成本效益的需求。产品优势：快速低温固化、对蚀刻铜天线具有卓越的粘合性能、抗腐蚀接触电阻低、可靠性卓越工作时间长、适合喷射点胶”。

记得去年汉高收购emersoncuming后曾经发布一款用于RFID的异向导电胶14281-99B，大家可参看我的旧贴：14281-99B-Snap Heat Cure Anisotropic Conductive Adhesive Paste，也不知此二者有何差异，对比了一下TDS文件，发现参数居然是一摸一样，呵呵！ 看来是产品成熟了以后正式型号发布了，14281-99B的TDS上本身也注明了“Preliminary Technical Data”，不过技术资料上均是emersoncuming的logo和说明，现在正式发布时候就以Hysol名义发布了，但从TDS来看依然保留了emersoncuming的logo，不过颜色居然由原来特有的蓝色变成了与乐泰类似的红色了，呵呵！ 看来汉高收购emersoncuming后的整合工作也在陆续展开，记得在此帖“LOCTITE/HYSOL 最新underfill产品UF3800”中和网友探讨到汉高收购emersoncuming的品牌整合策略，从此产品看来汉高的动作比想象的要快的多咯，呵呵！ 全文 »