今日有网友咨询我FP4651这款产品，之前没有接触过，但是从牌号来看应该是属于HYSOL系列的环氧产品，下载了一下TDS资料，果不其然，而且这款FP4651产品官方显示是“Hysol FP4651 is a low viscosity version of FP4650 for a large array of packages.”，所以顺便也下载了FP4650这款产品的资料来看看。从TDS来看FP4650是2002年就推出的一款型号，而FP4651是2011年推出的一款产品。这款产品从用途来看也是属于高可靠性的环氧包封剂，关于HYSOL系列高可靠性环氧包封剂请参看此文《关于汉高乐泰HYSOL FP系列液态封装材料的应用》，或者以HYSOL为关键字在本站搜索可以找出很多相关的产品。这款产品的填料含量达到82%，也不知道是怎样加进去的，呵呵！另外它的CTE只有15ppm左右，几乎达到EMC的水平，也难怪会具有很高的可靠性了。 闲话少说，贴出部分FP4651的TDS内容，大家可以下载附件查看PDF文件：

PRODUCT DESCRIPTION

FP4651 provides the following product characteristics:

FP4651 epoxy encapsulant features very low thermal expansion while retaining syringe dispense capabilities. Its low viscosity  and  50  micron  maximum  particle  size  gives  it improved handling properties over FP4650 for fine wire pitch and  cavity-fill  applications. It  is  based  on   FP4450  resin chemistry, therefore exhibiting excellent chemical resistance and thermal stability properties.

TYPICAL PROPERTIES OF UNCURED MATERIAL

TYPICAL CURING PERFORMANCE Recommended Cure Schedule
1 hour @ 125°C plus
90 minutes @ 165°C

Alternative Cure Schedule
2 hours @ 110°C plus
3 hours @ 165°C

The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.

Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

THAWING：

Directions for use

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

Optimal Storage: ≤-40 °C

Material removed from containers may be contaminated during use.  Do not return product to the original container.  Henkel Corporation cannot assume responsibility for product  which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please   contact   your   local   Technical   Service   Center   or Customer Service Representative.

……

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汉高公司3月12日在官网发布了他们最新的底填胶水产品UF3810产品的相关新闻，官网TDS数据库里面也有对应的TDS资料。资料显示是2011年12月份发布的。摘录学习之：

PRODUCT DESCRIPTION

UF3810 provides the following product characteristics:

UF3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.

TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate,@ 25 °C , mPa∙s (cP):
@ 20 s-1 394
Specific Gravity, 1.13
Pot life @ 25 °C, 25% viscosity increase, days 3
Shelf Life @ -20°C (from date of manufacture), months 6
Flash Point – See MSDS

TYPICAL CURING PERFORMANCE
Cure Schedule    ≥8 minutes @ 130°C
The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion , TMA, ppm/°C:
Below Tg 55
Above Tg 171
Glass Transition Temperature (Tg) by TMA, °C 102
Storage Modulus, DMA:
@ 25 °C N/mm² 2,990
(psi) (435,000)

Electrical Properties:
Dielectric Constant @ 23ºC :
@ 1GHz 3.44
@ 2GHz 2.87
Dissipation Factor @ 23ºC:
@ 1GHz 0.0071
@ 2GHz 0.0037
TYPICAL PERFORMANCE OF CURED MATERIAL
Lap Shear Strength , ISO 4587:  Glass Epoxy to Glass Epoxy N/mm² 9.7(psi) (1,400)

GENERAL INFORMATION
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
THAWING:
1. Thaw 30 cc syringes at least 1 hour at room temperature prior to use.
2. Allow container to reach room temperature before use.
3. After removing from the freezer, set the syringes to stand vertically while thawing.
4. DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.
5. DO NOT re-freeze. Once thawed to 25°C, the adhesive should not be re-frozen.
DIRECTIONS FOR USE
1. Thawed adhesive should immediately be placed on dispense equipment for use.
2. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive.
3. Adhesive must be completely used within the product’s recommended work life.
Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container
labeling.

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今天有幸与一位世界级的底填胶UNDERFILL高人及另一位EMC领域资深的人士交流了一个上午，收获良多， 交流的信息量比较大，记录几个亮点与大家分享，在未征得他们同意前就不把他们的身份做明示，业内人士估计也能猜到一二。

1）这两位昨日刚在深圳某公司做了UNDERFILL的培训，大家感触一样，即便是行业的领先和佼佼者，某公司对底填材料或者说电子辅料的认知也不是特别深刻，好在某公司前两年开始建立材料可靠性试验室，对电子胶水、焊接材料、功能材料开始了专门的研究与分析，也开始与一些厂家和半政府性质的科研机构展开合作，在材料上做一些创新和突破（大家觉得唯有如此才有可能真正超越国外的竞争者）；

2）关于汉高乐泰底填材料的演变，也是有着许多的故事，很多产品也是在早期给类似的NOKIA、MOTO等公司给“逼”出来的，而这几年推出的一些新型号类似UF3800、UF3801以及最新的UF3810也是给苹果等公司给“逼”出来的。中途也曾遭受过EMERSONCUMING的阻击，但通过收购解决了这个问题；

3）芯片级封装的UNDERFILL依旧被垄断，而PCB板级封装的UNDERFILL也是从其中演变而来，但由于使用者水平参差不齐，导致看上去的貌似百花齐放，而真正垄断市场的还是以汉高乐泰为主，不过国内外奋起直追者不少。中间谈到韩国元化学WON CHEMICAL的产品，这位高人也接触过，甚至当年去韩国三星多次“救驾”，在乐泰的3513系列产品被韩国元化学的WE-1007逐步替代的时候。不过发现这个也是替他人做了嫁衣（简言之就是韩国三星联合WON CHEMICAL一起在乐泰这里学了很多东西），导致乐泰底填产品全线从三星退出。中间还提到了SAMSUNG CHEIL(三星第一毛织）的unerfill，这个我也有印象，当时记得还帮他们把EL1200R卖给了当时的深圳天时达，不过UNDERFILL这个项目后来SAMSUNG CHEIL貌似放弃了。中间还提到了韩国的另一个公司但没记清楚。

4）每一次世界级公司的并购都会成就另外一些公司和个人， 一个现实的例子就是当初日本HYSOL被汉高收购的时候，他们的很多开发人员去了日本NAMICS，造就了NAMICS公司现在在芯片级UNDERFILL中的地位。不过当年汉高和国民淀粉电子部（EMERSONCUMING)的并购貌似也造成了尤其是乐泰电子部人员的动荡，包括研发和市场人员， 他们纷纷回国创业或者与国内本土企业合作，类似武汉晶丰、北京海斯迪克、烟台德邦等等公司都有他们的身影，还有部分人去了一些电子制造行业，例如前面提到的某公司等等。   当然还有这两位高人的公司（这里就不明示了）。相信随着他们的“回归”，国内应该很快可以成长起真正的高水准的电子胶水厂商（国内目前的胶粘剂龙头企业上市和准上市公司类似回天、硅宝、天山等其实都是在民用、建筑、工业胶粘剂颇有建树的，而电子胶水方面也都只是在开发阶段），请大家拭目以待！

5）透露一些“窃听”到的技术话题，研发的朋友可以关注一下哦，首先今天第一次听到关于胶粘剂ΔH值的概念，据说美国还有专门法规进行管控的，而类似很多配方的设计都是为了满足这个条件，而不光是为了操作性和功能性要求，这个值相信学过物理化学的朋友应该还是有印象的。但我个人估计国内做电子胶粘剂配方的研发人员估计没两个会考虑过这个参数的。另外交流中提到了美国一些化学公司为汉高乐泰专门开发的一些促进剂，谈到这里我更加佩服原来公司的时候UNDERFILL项目开发组的负责人曾工（ALEX ）， 我相信他也是从化学原理角度找到这款分子式的物质，进而找到生产的产品的公司，而这个恰恰也是低粘度底填产品的最理想的促进剂之一。包括乐泰和EMERSONCUMING的一些配方中都有用到。 中间还提到了一些类似纳米核壳类的材料，这个我也是从曾工那里学习到的，所以有个同事戏称曾工为“流落民间的大内高手”真是一点也不为过，水平应该是超过了很多拿到硕士博士学位的人了。

6）今天信息量真的比较大，而且这位高手的语速奇快（很多搞技术的人好像都是这样的）， 我一时半会消化不了，但对电子胶水行业的认知应该又会得到一个提升的，其中也探讨了很多关于行业的现状和发展的话题，这里就不再展开了。 碰巧今天在TWITTER上看到HENKEL公司发布的最新新闻《Henkel develops reworkable underfill》，是2012年3月12日发布的， 也难怪上午交流时说UF3800也快过时了，呵呵！ 这个估计是最新的的产品UF3810。

最后就把这则新闻摘录如下，各位研发达人们，赶紧去研究研究吧，呵呵！

New product for high value electronic components

Expanding on its portfolio of advanced underfill materials, Henkel has developed Loctite UF3810, a new underfill technology that provides high reliability while also allowing for easier reworkability as compared to previous generation products.

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Henkel develops reworkable underfill

In today’s electronic devices such as smartphones there are numerous complex engineering components. Expanding on its portfolio of advanced underfill materials, Henkel has developed Loctite UF3810, a new underfill technology that provides extremely high reliability while also enabling easier reworkability as compared to previous generation products. Ideally suited for today’s handheld communication and entertainment applications, Loctite UF3810 delivers excellent drop and shock protection.

Designed to deliver superior performance and ease-of-use, Loctite UF3810 addresses many of the complex requirements associated with today’s high value devices, but does so in a formulation that has excellent processability. The material is halogen-free, completely reworkable and has a high glass transition (Tg) temperature of 100°C, thereby delivering robust thermal cycling reliability for next-generation wafer-level CSP (WLCSP) and PoP devices. “Assembly specialists want to reliably protect these devices but also have the option to rework them should any issues arise”, explains Dr. Brian Toleno, Henkel’s Global Product Manager for Liquids. “Loctite UF3810 provides high reliability and reworkability – a balance not readily available with traditional, low Tg formulas”, says Toleno.

High-capacity at a cost-saving production process
With increasing device complexity comes increasing cost. Loctite UF3810 is the go-to product for manufacturers seeking high reliability in a cost-conscious formulation and improved thermal cycling reliability for fine-pitch (0.5mm pitch and below) area array devices. In addition to superior performance versus alternative reworkable underfills, Loctite UF3810 also provides ease-of-use that lends to its process flexibility. The material flows fast and underfills at room temperature and cures quickly at a moderate 130°C which, in addition to its halogen-free status, adds to the material’s sustainability through reduced energy consumption requirements.

These characteristics, in combination with its proven solder compatibility, make Loctite UF3810 a highly versatile, yet highly effective underfill system Besides the handheld market other industries can also profit from Henkel’s products. “Loctite UF3810 has also attracted the attention of those in the aerospace and automotive sectors, as it allows incorporation of CSP and PoP devices without any adverse impact to reliability,“ Toleno closes.

For more information on Loctite UF3810 or any of Henkel’s next-generation underfills, log ontowww.henkel.com/electronics.

Henkel AG & Co. KGaA

原文链接如下：http://www.henkel.com/news-2012-20120312-henkel-develops-reworkable-underfill-35160.htm

年初找到了一份《汉高电子部 电子组装解决方案》《Henkel Electronics Assembly Solutions》，这两天在查找3036的underfill技术资料时，找到了这份《Henkel Electronic Solutions》，好像主要是针对封装方面的用胶和材料，很多型号之前都没怎么接触，里面的underfill之类的材料更侧重于一道underfill，此类材料是：MATERIAL SOLUTIONS FORELECTRONIC PACKAGINGAND ASSEMBLY。 罗列产品目录如下，有需要了解的朋友可以下载附件查看：

Semiconductor Market Solutions
Discrete Components . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Quad Flat Pack (QFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Quad Flat No-Lead (QFN) . . . . . . . . . . . . . . . . . . . . . . 11
Ball Grid Array/Chip Scale Package (BGA/CSP) . . . . 14
System-in-Package (SiP) . . . . . . . . . . . . . . . . . . . . . . . 18
Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Semiconductor Materials
Hysol® Die Attach Adhesives . . . . . . . . . . . . . . . . . . . . 23
Hysol® Semiconductor Underfills . . . . . . . . . . . . . . . . 29
Hysol® Semiconductor Encapsulants . . . . . . . . . . . . . 32
Hysol® Thermal Compression Materials . . . . . . . . . . . 34
Hysol® Coating Powders . . . . . . . . . . . . . . . . . . . . . . . 36
Hysol® Electronic Molding Compounds . . . . . . . . . . . 37
Hysol® and Hysol® Huawei™ Semiconductor
Molding Compounds . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Multicore® Accurus™ Solder Spheres . . . . . . . . . . . . . 47
Printed Circuit Board (PCB) Assembly Materials
Multicore® Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . 50
Multicore® Fluxes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Multicore® Cored Wire . . . . . . . . . . . . . . . . . . . . . . . . . 54
Multicore® Solder Accessories . . . . . . . . . . . . . . . . . . 55
Chip on Board Encapsulant Materials . . . . . . . . . . . . 56
Loctite® Board Level Underfills . . . . . . . . . . . . . . . . . . 59
Loctite® Thermal Management Materials . . . . . . . . . . 61
Loctite® Electrically Conductive Adhesives . . . . . . . 64
Loctite® Chipbonder™ Surface Mount Adhesives . . . 66
Circuit Board Protection Solutions . . . . . . . . . . . . . . . 68
Flat Panel Display Materials
Flat Panel Display Solutions . . . . . . . . . . . . . . . . . . . . 79
Semiconductor Solutions . . . . . . . . . . . . . . . . . . . . . . 84
Solutions Across the Board . . . . . . . . . . . . . . . . . . . . . 86
Periodic Table of Elements . . . . . . . . . . . . . . . . . . . . . 88

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PRODUCT DESCRIPTION
LOCTITE® 3108™ provides the following product characteristics:
Technology Acrylic
Chemical Type Acrylated urethane
Appearance (uncured) Translucent colorless liquidLMS
Components One component – requires no mixing
Viscosity Medium
Cure Ultraviolet (UV) light
Cure Benefit Production – high speed curing
Application Bonding
Flexibility Enhances load bearing & shock absorbing characteristics of the bond area.

LOCTITE® 3108™ is designed primarly for potting and sealing glass to metal joints that must withstand thermal cycling and environmental exposure. The product has shown excellent capabilities in bonding dissimilar rigid substrates.

TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity@ 25 °C 1.08
Flash Point – See MSDS
Viscosity, Brookfield – RVT, 25 °C, mPa·s (cP):
Spindle 4, speed 20 rpm 3,600 to 6,600LMS

TYPICAL CURING PERFORMANCE
LOCTITE® 3108™ can be cured by exposure to UV light at 365nm. Surface cure is enhanced by exposure to UV light in the 220 to 260 nm range. Cure rate and ultimate depth of cure depend on light intensity, spectral distribution of the light source, exposure time and light transmittance of the substrate through which the light must pass.

Fixture Time
Fixture time is defined as the time to develop a shear strength of 0.1 N/mm².
UV Fixture Time, Glass, seconds:
Medium Pressure Hg Arc bulb, Zeta® 7200 light source: 50 mW/cm², measured @ 365 nm ≤15LMS
Electrodeless, D bulb: 100 mW/cm², measured @ 365 nm 7

Depth of Cure vs. Irradiance (365 nm)

The graphs below show the increase in depth of cure with time at 50 mW/cm² and 100 mW/cm² as measured from the

thickness of the cured test piece.

TYPICAL PROPERTIES OF CURED MATERIAL

Cured @ 100 mW/cm², for 30 seconds using an Electrodeless

system, D bulb

Physical Properties:

Shore Hardness, ISO 868, Durometer A ≥72LMS

Water Absorption, ISO 62, %:

2 hours in boiling water 4.9

Elongation, at break, ISO 527-3, % 330

Tensile Modulus, ISO 527-3 N/mm² 18.6

(psi) (2,670)

Tensile Strength, at break, ISO

527-3

N/mm² 7.91

(psi) (1,135)

UV Depth of Cure, mm:

Cured @ 100 mW/cm², measured @

365 nm,

for 15 seconds

≥1.6LMS

Electrical Properties:

Surface Resistivity, IEC 60093, Ω∙cm 7.84×1014

Volume Resistivity, IEC 60093, Ω·cm 1.06×1014

Dielectric Breakdown Strength,

IEC 60243-1, kV/mm

37

Dielectric Constant / Dissipation Factor, IEC 60250:

100-Hz 7.47 / 0.19

1-kHz 6.8 / 0.07

1-MHz 5.59 / 0.05

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

Cured @ 100 mW/cm², measured @ 365 nm, for 30 seconds using

an Electrodeless system, D bulb, (samples with 0.127 mm gap)

Block Shear Strength, ISO 13445:

Glass to Glass N/mm² 4.2

(psi) (610)

Glass to Steel N/mm² 3.5

(psi) (510)

Glass to Aluminum N/mm² 3.1

(psi) (445)

Cured @ 100 mW/cm², measured @ 365 nm, for 30 secondsusing a

medium pressure Hg Arc bulb, Zeta® 7200 light source

Block Shear Strength, ISO 13445:

Polycarbonate to

Polycarbonate

N/mm² ≥5.5LMS

(psi) (≥797)

TYPICAL ENVIRONMENTAL RESISTANCE

Cured @ 100 mW/cm², measured @ 365 nm, for 30 seconds using

an Electrodeless system, D bulb

Block Shear Strength, ISO 13445:

Polycarbonate:

0.127 mm gap

Chemical/Solvent Resistance

Aged under conditions indicated and tested @ 22 °C.

% of initial strength

Environment °C 100 h 500 h 1000 h

Water immersion 22 75 40 45

Heat/humidity 95% RH 38 80 100 100

Salt fog 35 65 55 60

GENERAL INFORMATION

This product is not recommended for use in pure oxygen

and/or oxygen rich systems and should not be selected as

a sealant for chlorine or other strong oxidizing materials

For safe handling information on this product, consult the

Material Safety Data Sheet (MSDS).

Directions for use:

1. This product is light sensitive; exposure to daylight, UV

light and artificial lighting should be kept to a minimum

during storage and handling.

2. The product should be dispensed from applicators with

black feedlines.

3. For best performance bond surfaces should be clean and

free from grease.

4. Cure rate is dependent on lamp intensity, distance from

light source, depth of cure needed or bondline gap and

light transmittance of the substrate through which the

radiation must pass.

5. Cooling should be provided for temperature sensitive

substrates such as thermoplastics.

6. Plastic grades should be checked for risk of stress

cracking when exposed to liquid adhesive.

7. Excess uncured adhesive can be wiped away with organic

solvent (e.g. Acetone).

8. Bonds should be allowed to cool before subjecting to any

service loads.

Loctite Material SpecificationLMS

LMS dated July-3, 2003. Test reports for each batch are

available for the indicated properties. LMS test reports include

selected QC test parameters considered appropriate to

specifications for customer use. Additionally, comprehensive

controls are in place to assure product quality and

consistency. Special customer specification requirements may

be coordinated through Henkel Quality.

Storage

Store product in the unopened container in a dry location.

Storage information may be indicated on the product container

labeling.

Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or

greater than 8 °C can adversely affect product properties.

Material removed from containers may be contaminated during

use. Do not return product to the original container. Henkel

Corporation cannot assume responsibility for product which

has been contaminated or stored under conditions other than

those previously indicated. If additional information is required,

please contact your local Technical Service Center or

Customer Service Representative.

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

μm / 25.4 = mil

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  loctite 3108 TDS (65.3 KB, 7 次)
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PRODUCT DESCRIPTION

LOCTITE® 5939™ provides the following product characteristics:

Technology MS® – Polymer

Chemical Type Modified silane polymer

Appearance (uncured) Smooth grey liquidLMS

Components One part – requires no mixing

Viscosity Paste

Cure Atmospheric moisture

Application Sealing

LOCTITE® 5939™ is a high strength, high elongation adhesive used for elastic bonding and sealing on various substrates. It is a one component adhesive/sealant based on a modified silane polymer, which cures by reaction with moisture to an elastomeric thermoset product. The skin formation and curing times are dependent on humidity, temperature, and joint depth. By increasing the exposure to moisture these times can be reduced. LOCTITE® 5939™ is sag-resistant leading to high initial tack. It is non-corrosive and free of solvents, isocyanates, silicones, PVC, and is odorless. It demonstrates good adhesion without primer to a wide variety of substrates and is compatible with suitable paint systems. The adhesive/sealant also demonstrates good UV resistance and can therefore be used for interior and exterior applications.

TYPICAL PROPERTIES OF UNCURED MATERIAL 全文 »

PRODUCT DESCRIPTION

Hysol® FP4549G is a high purity, low stress, liquid epoxy designed for enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 90°C to 120°C with as little as a ½ mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extend thermal cycling performance. FP4549G also exhibits low moisture absorption for improved JEDEC performance.

TYPICAL APPLICATIONS

Flip chip on board applications with low moisture absorption for improved JEDEC performance.

PROPERTIES OF UNCURED MATERIAL

Value

Chemical Type Epoxy

Appearance Grey

Flow Rate 500 mil flow, 3 mil gap, 90°C) 15 seconds

Filler Content,% ignition, ITM3A 50

Shelf Life @ -40°F,(-40°C), months 9

Typical Range

Viscosity @ 25ºC, (77°F)

Cone & Plate , (Brookfield, cps)

CP52; speed 20 (ITM2A) 2,300

Work Life at Room Temperature 全文 »

PRODUCT DESCRIPTION

Hysol® FP4549FC is a high purity, low stress, liquid epoxy designed for enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 110°C to 120°C with as little as a ½ mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extend thermal cycling performance. FP4549FC also exhibits low moisture absorption for improved JEDEC performance. FP4559FC has been specially formulated for improved compatibility with no-clean flux residues.

TYPICAL APPLICATIONS

Encapsulant for Flip Chip Underfill

PROPERTIES OF UNCURED MATERIAL

Color White

Filler content, (%, ignition) (ITM3A) 50

Flow Rate (500 mil flow, 3 mil gap, 110°C) 18 seconds

Shelf Life @-40°C, (-40°F), months 9

Typical Value

Viscosity @ 25°C, (77°F) (ITM2R)

Brookfield Cone & Plate

CP52, Speed 20 13,000

PHYSICAL PROPERTIES, CURED MATERIAL

Color White/Yellow

Glass Transition (Tg), °C, (TMA) (ITM65B) 125

Coefficient of Linear Thermal Expansion, (ITM65B)

α1, ppm/°C 45

α2, ppm/°C 143

Extractable Ionic Content, @ 121°C (ITM107B)

Chloride (Cl-), ppm 6

Sodium (Na+), ppm 2

Flexural Modulus, Gpa (ASTM D790) 5.6

Adhesion

Die shear strength 50±2Kg

Nitride passivated/FR4 substrate

100 mil x 100 mil die @ 25°C, (77°F)

Handling

Gel Time @ 121°C, (250°F), minutes, (ITM10N) 12

Pot Life @ 25°C, (77°F), hours 12

(ITM10T), (time required to double viscosity)

Frozen storage at approximately –40°C or lower is required for maximum shelf life. Frozen packages must be completely thawed before use. Warm at room temperature until no longer cool to the touch (normally 60-90 minutes). Do not thaw in an oven. For best results in dispensing, a 22 gauge needle should be used at 10-20 psi pressure. For best flow rates, a substrate temperature of 110-120°C is recommended.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

Cure Schedule

Recommended Cure 30 minutes @ 165°C

Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results. With all fast cure systems, the minimum required time for cure depends on the rate of heating. Conditions where a hot plate or heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source.

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4549FC TDS (78.2 KB, 98 次)

PRODUCT DESCRIPTION

FP4549 provides the following product characteristics:

Technology Epoxy

Appearance White

Product Benefits • High purity

• Low stress

• Liquid flexible

• Low moisture absorption

Filler Weight, % 50

Components One-component

Cure Heat cure

Application Encapsulation

Typical Applications Flip Chip

FP4549 also exhibits low moisture absorption for improved JEDEC performance.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Brookfield – Cone & Plate, 25 °C, mPa·s (cP):

Spindle 52, speed 20 rpm 2,300

Pot Life @ 25 °C(time to double viscosity), hours 24

Gel Time @ 121ºC, minutes 13.5

Shelf Life: @ -40ºC, months 9

Flow Rate @ 90°C, seconds

500mil travel, 3mil gap 15

Flash Point – See MSDS

TYPICAL CURING PERFORMANCE

Recommended Cure Schedule

30 minutes @ 165°C

The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion , ppm/°C:

Below Tg 45

Above Tg 143

Glass Transition Temperature (Tg) °C 140

(Cured 7 minutes @ 160ºC)

Extractable Ionic Content, ppm:

Chloride (Cl-) 3

Sodium (Na+) 2

Flexural Modulus N/mm² 5.6

(psi) (784)

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

Die Shear Strength, Kg:

Nitride Passivated/FR4 substrate:

100 mil x 100 mil die @ 25°C 50±2

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.

Not for product specifications

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

THAWING:

1. Allow container to reach room temperature before use.

2. Warm at room temperature until no longer cool to the touch (normally 60 to 90 minutes).

3. DO NOT thaw in an oven.

Directions for use

1. For best flow rates, a preheat temperature of 90 °C is recommended.

2. For best results in dispensing a 22 gauge needle should be used at 10 to 20 psi pressure.

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

Optimal Storage: -40 °C

Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4549 TDS (66.2 KB, 137 次)

PRODUCT DESCRIPTION

FP4323 provides the following product characteristics:

Technology Epoxy

Appearance (Part A) Black

Appearance (Part B) Cream

Appearance (Mixed) Black

Product Benefits • Low CTE for improved thermal cycling

• High purity

• Thixotropic

• Excellent moisture resistance

• Excellent chemical resistance

Filler Weight, % 65

Filler Type Silica

Mix Ratio, by weight – Part

A: Part B

100 : 100

Cure Heat cure

Application Encapsulant – glob top

Typical Assembly

Applications

Chip-on-board and Plastic PGA

applications

Substrates Plastic

FP4323 liquid epoxy encapsulant glob top is designed with flow capabilities that allows encapsulation without flowing beyond the chip.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Part A Properties

Viscosity, Brookfield – RVF, 25 °C, mPa·s (cP):

Spindle 7, speed 2 rpm 172,500

Spindle 7, speed 20 rpm 115,000

Specific Gravity @ 25 °C 1.7

Shelf Life @ 25°C, months 12

Flash Point – See MSDS

Part B Properties

Viscosity, Brookfield – RVF, 25 °C, mPa·s (cP):

Spindle 7, speed 2 rpm 250,000

Spindle 7, speed 20 rpm 72,500

Specific Gravity @ 25 °C 1.7

Shelf Life @ 25°C, months 12

Flash Point – See MSDS

Mixed Properties

Mixed Viscosity, Brookfield – RVF, 25 °C, mPa·s (cP):

Spindle 7, speed 2 rpm 220,000

Spindle 7, speed 20 rpm 100,000

Specific Gravity @ 25 °C 1.67

Gel Time @ 121ºC, minutes 11

Pot Life @ 25 °C, days 2

Shelf Life @ -40 °C, months 9

Working Life@ 25 °C, hours 48

Flash Point – See MSDS

TYPICAL CURING PERFORMANCE

Recommended Cure Schedule

4 hours @ 150°C or

1 hour @ 170°C

Alternative Cure Schedule

2 hours @ 125°C + 4 hours @ 150°C

Substrate Temperature

Temperature, °C 90

The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

A two-step cure will minimize stress.

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion ASTM D-3386, ppm/°C:

Below Tg (40 to 120°C) 28

Glass Transition Temperature (Tg) by TMA, °C 174

Thermal Conductivity, W/mk 0.63

Shore Hardness, ISO 868, Durometer D 97

Linear Shrinkage, % 0.43

Extractable Ionic Content, ppm:

Chloride (Cl-) 20

Sodium (Na+) 20

Potassium (K+) 20

Water Absorption, ISO 62 , %:

8 hours @ 100°C 0.25

Electrical Properties:

Dielectric Constant / Dissipation Factor, IEC 60250:

1kHz 3.7 / 0.004

100-MHz 3.59 / 0.085

1-GHz 3.44 / 0.075

Volume Resistivity, IEC 60093, Ω·cm 6.2×1014

Surface Resistivity, IEC 60093, Ω 1.6×1014

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be used with chlorine or other strong oxidizing materials.

DIRECTIONS FOR USE

1. For best results, dispense onto substrate warmed to 90°C.

2. FP4323 may settle upon storage. Each container must be thoroughly mixed before combining.

3. Mix Part A and Part B separately for about 5 to 10 minutes on a standard paint shaker to ensure complete dispersion of the filler.

4. Stir with a large spatula to check for lumps.

5. Cold storage will minimize filler settling.

6. Part B may form a crust if exposed to moist air for an extended period of time. Keep in a well sealed container. For best results, do not use Part B which contains this crust caused by moisture contamination.

7. Thorough mechanical mixing of Part A and Part B together is required for best results. Hand mixing alone is not recommended.

Not for product specifications

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

Optimal Storage: -40°C. Storage below -40°C or greater than -40°C can adversely affect product properties.

Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4323 TDS (68.0 KB, 99 次)