今日有网友咨询我FP4651这款产品，之前没有接触过，但是从牌号来看应该是属于HYSOL系列的环氧产品，下载了一下TDS资料，果不其然，而且这款FP4651产品官方显示是“Hysol FP4651 is a low viscosity version of FP4650 for a large array of packages.”，所以顺便也下载了FP4650这款产品的资料来看看。从TDS来看FP4650是2002年就推出的一款型号，而FP4651是2011年推出的一款产品。这款产品从用途来看也是属于高可靠性的环氧包封剂，关于HYSOL系列高可靠性环氧包封剂请参看此文《关于汉高乐泰HYSOL FP系列液态封装材料的应用》，或者以HYSOL为关键字在本站搜索可以找出很多相关的产品。这款产品的填料含量达到82%，也不知道是怎样加进去的，呵呵！另外它的CTE只有15ppm左右，几乎达到EMC的水平，也难怪会具有很高的可靠性了。 闲话少说，贴出部分FP4651的TDS内容，大家可以下载附件查看PDF文件：
PRODUCT DESCRIPTION
FP4651 provides the following product characteristics:
| Technology | Epoxy |
| Appearance | Black |
| Product Benefits | • High purity• Self-leveling• Excellent chemical resistance
• High thermal stability • Low thermal expansion • Low viscosity |
| Components | One-component |
| Filler content , %ignition | 82 |
| Cure | Heat cure |
| Application | Encapsulant |
| Typical Applications | Cavity-fill and fine wire pitch applications |
FP4651 epoxy encapsulant features very low thermal expansion while retaining syringe dispense capabilities. Its low viscosity and 50 micron maximum particle size gives it improved handling properties over FP4650 for fine wire pitch and cavity-fill applications. It is based on FP4450 resin chemistry, therefore exhibiting excellent chemical resistance and thermal stability properties.
TYPICAL PROPERTIES OF UNCURED MATERIAL
| Viscosity, Brookfield – RVF, 25 °C, mPa·s (cP): | ||
| Spindle 7, speed 20 rpm | 130,000 | |
| Specific Gravity 1.91Pot life @ 25 °C, days: | ||
| (Time required to double viscosity) |
2 |
|
| Gel Time @ 121 °C, minutes |
9 |
|
| Shelf Life @ -40°C, monthsFlash Point – See MSDS |
9 |
|
TYPICAL CURING PERFORMANCE Recommended Cure Schedule
1 hour @ 125°C plus
90 minutes @ 165°C
Alternative Cure Schedule
2 hours @ 110°C plus
3 hours @ 165°C
The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion ppm/°C:
| Below Tg (40 to 120°C) |
11 |
| Above Tg (190 to 220°C) |
50 |
| Glass Transition Temperature (Tg), °C |
150 |
| Extractable Ionic Content, ppm: Chloride (Cl-) |
5 |
| Potassium (K+) |
1 |
| Sodium (Na+) |
1 |
GENERAL INFORMATION
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.
Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.
THAWING：
|
1. |
Frozen packages must be completely thawed before use. |
|
2. |
Warm at room temperature until no longer cool to the |
| touch (normally 20 to 60 minutes). | |
|
3. |
DO NOT thaw in an oven. |
Directions for use
|
1. |
FP4651 should be dispensed onto a substrate warmed to |
| approximately 80°C. This will help minimize air | |
|
2. |
entrapment.Warm FP4651 to 30 to 40°C for faster dispensing. |
|
3. |
NOTE: Elevated temperatures reduce working life. |
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage: ≤-40 °C
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.
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