PRODUCT DESCRIPTION
Hysol® FP4549G is a high purity, low stress, liquid epoxy designed for enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 90°C to 120°C with as little as a ½ mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extend thermal cycling performance. FP4549G also exhibits low moisture absorption for improved JEDEC performance.
TYPICAL APPLICATIONS
Flip chip on board applications with low moisture absorption for improved JEDEC performance.
PROPERTIES OF UNCURED MATERIAL
Value
Chemical Type Epoxy
Appearance Grey
Flow Rate 500 mil flow, 3 mil gap, 90°C) 15 seconds
Filler Content,% ignition, ITM3A 50
Shelf Life @ -40°F,(-40°C), months 9
Typical Range
Viscosity @ 25ºC, (77°F)
Cone & Plate , (Brookfield, cps)
CP52; speed 20 (ITM2A) 2,300
Work Life at Room Temperature 全文 »
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