PRODUCT DESCRIPTION

Hysol® FP4549FC is a high purity, low stress, liquid epoxy designed for enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 110°C to 120°C with as little as a ½ mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extend thermal cycling performance. FP4549FC also exhibits low moisture absorption for improved JEDEC performance. FP4559FC has been specially formulated for improved compatibility with no-clean flux residues.

 

TYPICAL APPLICATIONS

Encapsulant for Flip Chip Underfill

 

PROPERTIES OF UNCURED MATERIAL

Color White

Filler content, (%, ignition) (ITM3A) 50

Flow Rate (500 mil flow, 3 mil gap, 110°C) 18 seconds

Shelf Life @-40°C, (-40°F), months 9

Typical Value

Viscosity @ 25°C, (77°F) (ITM2R)

Brookfield Cone & Plate

CP52, Speed 20 13,000

 

PHYSICAL PROPERTIES, CURED MATERIAL

Color White/Yellow

Glass Transition (Tg), °C, (TMA) (ITM65B) 125

Coefficient of Linear Thermal Expansion, (ITM65B)

α1, ppm/°C 45

α2, ppm/°C 143

Extractable Ionic Content, @ 121°C (ITM107B)

Chloride (Cl-), ppm 6

Sodium (Na+), ppm 2

Flexural Modulus, Gpa (ASTM D790) 5.6

Adhesion

Die shear strength 50±2Kg

Nitride passivated/FR4 substrate

100 mil x 100 mil die @ 25°C, (77°F)

 

Handling

Gel Time @ 121°C, (250°F), minutes, (ITM10N) 12

Pot Life @ 25°C, (77°F), hours 12

(ITM10T), (time required to double viscosity)

 

Frozen storage at approximately –40°C or lower is required for maximum shelf life. Frozen packages must be completely thawed before use. Warm at room temperature until no longer cool to the touch (normally 60-90 minutes). Do not thaw in an oven. For best results in dispensing, a 22 gauge needle should be used at 10-20 psi pressure. For best flow rates, a substrate temperature of 110-120°C is recommended.

 

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

 

Cure Schedule

Recommended Cure 30 minutes @ 165°C

 

Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results. With all fast cure systems, the minimum required time for cure depends on the rate of heating. Conditions where a hot plate or heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source.

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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