PRODUCT DESCRIPTION

FP4549 provides the following product characteristics:

Technology Epoxy

Appearance White

Product Benefits • High purity

• Low stress

• Liquid flexible

• Low moisture absorption

Filler Weight, % 50

Components One-component

Cure Heat cure

Application Encapsulation

Typical Applications Flip Chip

 

FP4549 also exhibits low moisture absorption for improved JEDEC performance.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Brookfield – Cone & Plate, 25 °C, mPa·s (cP):

Spindle 52, speed 20 rpm 2,300

Pot Life @ 25 °C(time to double viscosity), hours 24

Gel Time @ 121ºC, minutes 13.5

Shelf Life: @ -40ºC, months 9

Flow Rate @ 90°C, seconds

500mil travel, 3mil gap 15

Flash Point – See MSDS

 

TYPICAL CURING PERFORMANCE

Recommended Cure Schedule

30 minutes @ 165°C

 

The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

 

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion , ppm/°C:

Below Tg 45

Above Tg 143

Glass Transition Temperature (Tg) °C 140

(Cured 7 minutes @ 160ºC)

Extractable Ionic Content, ppm:

Chloride (Cl-) 3

Sodium (Na+) 2

Flexural Modulus N/mm² 5.6

(psi) (784)

 

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

Die Shear Strength, Kg:

Nitride Passivated/FR4 substrate:

100 mil x 100 mil die @ 25°C 50±2

 

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

 

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.

 

Not for product specifications

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

 

THAWING:

1. Allow container to reach room temperature before use.

2. Warm at room temperature until no longer cool to the touch (normally 60 to 90 minutes).

3. DO NOT thaw in an oven.

 

Directions for use

1. For best flow rates, a preheat temperature of 90 °C is recommended.

2. For best results in dispensing a 22 gauge needle should be used at 10 to 20 psi pressure.

 

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

 

Optimal Storage: -40 °C

Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

 

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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