PRODUCT DESCRIPTION

FP4450 provides the following product characteristics:

Technology Epoxy

Appearance Black

Product Benefits • High purity

• Low stress

• Good moisture resistance

• Exhibits relatively high flow

• High temperature performance

• Excellent chemical resistance

Filler Weight, % 73

Cure Heat cure

Application Encapsulant

Operating Temperature -65 to 150 °C

Typical Package Application

Automotive applications, BGA, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules and Pin grid arrays

FP4450 encapsulant is designed for protection of bare semiconductor devices. It offers pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Brookfield – RVT, 25 °C, cps:

Spindle 7, speed 20 rpm 43,900

Specific Gravity @ 25 °C 1.77

Pot life @ 25 °C, days 3

Gel Time @ 121ºC, minutes 12

Shelf Life @ -40°C, months 9

Flash Point – See MSDS

TYPICAL CURING PERFORMANCE

Recommended Cure Schedule

30 minutes @ 125°C plus

90 minutes @ 165°C

Alternative Cure Schedule

1 hour @ 165°C

The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion , ppm/°C:

Below Tg (40 to 120°C) 22

Glass Transition Temperature (Tg) by TMA, °C 155

Alpha Particle Emissions, cts/cm²/hr 0.005

Extractable Ionic Content, ppm:

Chloride (Cl-) 5

Sodium (Na+) 1

Potassium (K+) 2

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.

Not for product specifications

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

THAWING:

1. Allow container to reach room temperature before use.

2. DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.

3. DO NOT re-freeze. Once thawed, the adhesive should not be re-frozen.

DIRECTIONS FOR USE

1. For best results, dispense onto substrate warmed to 80°C.

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. Optimal Storage: -40 °C. Storage below minus (-)40 °C or greater than minus (-)40 °C can adversely affect product properties.

Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

华为网盘下载：http://dl.dbank.com/c079ofgmzs

点击下载PDF文件：

  Henkel Loctite Hysol FP4450 TDS (62.6 KB, 143 次)