PRODUCT DESCRIPTION
FP4450 provides the following product characteristics:
Technology Epoxy
Appearance Black
Product Benefits • High purity
• Low stress
• Good moisture resistance
• Exhibits relatively high flow
• High temperature performance
• Excellent chemical resistance
Filler Weight, % 73
Cure Heat cure
Application Encapsulant
Operating Temperature -65 to 150 °C
Typical Package Application
Automotive applications, BGA, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules and Pin grid arrays
FP4450 encapsulant is designed for protection of bare semiconductor devices. It offers pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield – RVT, 25 °C, cps:
Spindle 7, speed 20 rpm 43,900
Specific Gravity @ 25 °C 1.77
Pot life @ 25 °C, days 3
Gel Time @ 121ºC, minutes 12
Shelf Life @ -40°C, months 9
Flash Point – See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
30 minutes @ 125°C plus
90 minutes @ 165°C
Alternative Cure Schedule
1 hour @ 165°C
The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion , ppm/°C:
Below Tg (40 to 120°C) 22
Glass Transition Temperature (Tg) by TMA, °C 155
Alpha Particle Emissions, cts/cm²/hr 0.005
Extractable Ionic Content, ppm:
Chloride (Cl-) 5
Sodium (Na+) 1
Potassium (K+) 2
GENERAL INFORMATION
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.
Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.
THAWING:
1. Allow container to reach room temperature before use.
2. DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.
3. DO NOT re-freeze. Once thawed, the adhesive should not be re-frozen.
DIRECTIONS FOR USE
1. For best results, dispense onto substrate warmed to 80°C.
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. Optimal Storage: -40 °C. Storage below minus (-)40 °C or greater than minus (-)40 °C can adversely affect product properties.
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.
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Henkel Loctite Hysol FP4450 TDS (62.6 KB, 148 次)
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