DESCRIPTION

Hysol® FP4322 is a high purity liquid epoxy encapsulant designed for semiconductor encapsulation. It is a high flow material which requires a cavity or flow control barrier to prevent excessive flow. Hysol FP4322 is suitable for encapsulation of bare chips mounted to plastic substrates as well as potting of small hybrid circuit modules. Spot encapsulation of bare chips on ceramic substrates is not suggested in most cases.

TYPICAL APPLICATIONS

Semiconductor encapsulation.

PROPERTIES OF UNCURED MATERIAL

Color Black

Filler Content, % (ASTM D2584) 65

Specific Gravity @25°C, (77°F)

(ASTM D1475) 1.69

Shelf Life @-40°C (-40°F), months 9

Typical Value

Viscosity @ 25°C, (77°F)

(ITM2A) (ASTM D2393)

Brookfield RVF

Spindle 7, Speed 2, Cp 92,500

Spindle 7, Speed 20, Cp 52,500

PHYSICAL PROPERTIES, CURED MATERIAL

Color Black

Coefficient of Thermal Expansion, in/in/°C

(ASTM D3386)

(40°-120°C) 30 x 10-6

Linear Shrinkage, %(ASTM D2566) .43

Density, gm/cc (ASTM D792) 1.7

Glass Transition, (Tg), °C, (ASTM D3386) 160

Hardness, Shore D (ASTM D2240) 97

Moisture Absorption, % (ASTM D570)

Immersion @ 100°C, 8 hrs 0.25

Extractable Ionic Content (ITM107B)

Chloride (Cl-), ppm 25

Potassium (K+), ppm 25

Sodium 25

Cured Electrical Properties

25°C

K D

1kHz 3.18 0.005

10kHz 3.15 0.006

100kHz 3.04 0.11

Volume Resistivity 6.2 x 1014

Surface Resistivity 1.6 x 1014

K = Dielectric constant by ASTM D150

D = Dissipation Factor by ASTM D150

Vol. Res.= Volume Resistivity in ohm-cm by ASTM D257

Surf.Res.= Surface Resistivity in ohm by ASTM D257

Handling

Pot Life @ 25°C, 77°F, days, 1

(ITM10T), time to double in viscosity

Gel Time @ 121°C, (250°F), minutes,

(ITM10N) 11

Shelf life at room temperature is approximately 2 days. Product may be stored at –40°C for greater than 6 months. Frozen packages must be thawed before use. Warm at room temperature until no longer cool to the touch (normally 20-60 minutes). Do not thaw in an oven or water bath. For best results FP4322 should be dispensed onto a substrate warmed to approximately 90°C. This will help minimize air entrapment under bonding wire.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or their strong oxidizing materials

 

Cure Schedule

Recommended Cure 2-3 hours @ 170°C or

3-6 hours @ 150°C

Alternate Cure 1 hour @ 125°C plus

(Low Stress) 4 hours @ 150°C

(Designed for packages which are effected by high levels of stress.)

A two-step cure will minimize stress and warpage on large substrates. Curing below 140°C is not recommended. User should gel devices immediately after dispensing to prevent moisture degradation of ultimate cure properties. Use suggested cure schedules as general guidelines; other cure schedules may yield satisfactory results.

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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