乐泰公司的一款用于EDGEBOND的胶水，关于EDGEBOND请查看此文《关于Edgebond Adhesive的应用》，不过这个型号的命名规则貌似不是乐泰的风格，看来还是HYSOL的技术基础，呵呵！

此资料里面几个与别的环氧胶不同的地方，第一个是其粘度的表征，使用的是锥板粘度计，不同剪切梯度下从12万到7千不等，如果按以往使用brookfield粘度计的比值方法，其触变岂不是有17以上了，呵呵！ 难怪有个胶粘剂技术人员告诉我其实红胶用brookfield粘度计或者用流变仪测试的触变都不如锥板粘度计来得准确，以往用低转速下的粘度除以高转速下的粘度得到触变指数也只是个权宜的测试方法而已。第二个是在固化条件那一段，有一个推荐的升温速率“Recommended Ramp Rate:  30°C/ minute or less”，这个应该是针对多温区回流炉的建议，之前的胶粘剂很少会推荐这个参数，不知何故。

摘录TDS资料如下：

PRODUCT DESCRIPTION

SB-50 provides the following product characteristics:

SB-50 underfill material is ideal for high volume assembly processes.  As the  product  does  not  flow  under  the  solder array, it is ideal for large packages where underfill flow is challenging.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Cone & Plate, mPa∙s (cP)
Shear Gradient: 1 s-1                                                119,000
Shear Gradient: 10 s-1                                             19,000
Shear Gradient: 100 s-1                                          7,000

Work Life:     @ 25ºC, days                                            4
Shelf Life:      @ -20ºC, months                                    6
Flash Point – See MSDS

TYPICAL CURING PERFORMANCE
Cure Schedule                                                   4 minutes @ 120°C
Recommended Ramp Rate:                        30°C/ minute or less

The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion :        Below Tg, ppm/°C                                                        70
Glass Transition Temperature (Tg) by TMA, °C                                                                              30
Storage Modulus, DMA , MPa                                                                                                              1,700

GENERAL INFORMATION

For safe handling information on this product, consult the

Material Safety Data Sheet, (MSDS).

THAWING:

1.  After removing from the freezer, set the syringes to stand vertically while thawing.

2.  Syringes should thaw a minimum of 2 hours.

3.  DO NOT re-freeze. Once thawed, the adhesive should not be re-frozen.

DIRECTIONS FOR USE

1.  Dispense a bead of SB-50 along the outer corners of the component with the needle/nozzle heated to 45°C

2.  Apply only 25% of the length of the component (for a 1 mm wide component only apply 0.25 mm on each side) to obtain performance characteristics

3. Because SB-50 is thixotropic, it will not flow under the component, leaving a nice fillet on the corner of the component

Rework Procedure
1. Remove the component from the substrate by using local application of heat onto the component.
2. The recommended heat profile is identical to the profile used during initial assembly.
3. Once the solder has reached temperatures above it’s reflow temperatures, lift the component off by using a slight twisting motion.
4. The site should be cleaned, removing any excess underfill and solder remaining on the PCB site.
5. Use appropriate flux remover or solvent.
6. A non-contact, vacuum method is preferred because it minimizes potential damage to the PCB and solder-mask.
7. Total time required for component removal is about 5 to 7 minutes.
Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

Storage
Store product in the unopened container in a dry location.  Storage information may be indicated on the product container
labeling.
Optimal Storage: -20°C. Storage below -20°C or greater than minus -20°C can adversely affect product properties.
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Note
The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent applications.

华为网盘下载：http://dl.dbank.com/c0d0nd26y7

注册本地下载：

  HENKEL LOCTITE HYSOL EDGEBOND SB-50 (62.6 KB, 11 次)
您没有权限下载此文件。

这是一款乐泰公司推出的EDGEBOND用的UV型产品，关于EDGEBOND的文章之前探讨过一篇，参看《关于Edgebond Adhesive的应用》，这个是zymet推出的一款热固化系列的产品。其实个人觉得EDGEBOND应该是CORNERBOND的另一种说法，如果要做严格区分的话前者胶水是基本不会渗透到BGA或者元件底部的，而早期的CORNERBOND产品是有直接点在BGA四角或元件底部四角的（这类工艺有一定的隐患，膨胀系数太大时会导致锡球焊接不良)，但绝大多数是在焊接完之后再去施胶固化补强的。当时在几大notebook代工厂都有用到这个工艺，但有些是选取的热固化环氧系列的，有些是选取UV固化的，两个体系各有利弊，看客户权衡选择了。几年前曾送过一款环氧胶水给其中一家大公司进行了测试，他们出具的报告我也觉得是接触到的电子厂商中最为专业的报告之一。

闲话少说，回到正题，贴出这个产品的技术资料，后面有TDS&MSDS&ROHS的PDF资料供大家下载。 不过这个ROHS可不是汉高公司送检SGS之类的报告，只不过是他们的一份自我声明，貌似世界级胶商都是不做ROHS或类似的报告的，这个一般要由代理商承担的。 另外这份资料里面也出现了一个明显矛盾的错误，呵呵！  在使用指南中写到”Product is shipped at 2 to 8ºC with ice packs to prevent excessive temperature exposure during shipping.”，指产品的储运需要冷藏（刚看到这里时我还纳闷了一把，很少会见到UV胶需要冷藏储运的，一般都是要求避光，是不是这款胶有什么特别之处呢？)，再看到后面“.Optimal Storage:  8 to 28°C.  Storage below 8°C or greater than 28°C can adversely affect product properties”，估计前面那段话是写错了，这个才是比较标准的UV胶储存条件。

PRODUCT DESCRIPTION

3705 provides the following product characteristics:

3705 UV cure adhesive is designed for high throughput assembly operations. Its thixotropic nature reduces migration of the liquid product after application to the substrate.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Brookfield – HBT, 25 °C, mPa·s (cP):
Spindle TB, Helipath, speed 10 rpm                                   44,000
Specific Gravity @ 25 °C                                                      1.1
Flash Point – See MSDS

TYPICAL CURING PERFORMANCE
Recommended UV Cure
Light Source and Condition: Zeta 7411 UV Flood System
Light Intensity, mW/cm²                                           30
UV Wavelength, nm                                                 365
Time, seconds                                                          80
3705 can be cured by exposure to UV and/or visible light of sufficient intensity. Cure rate and ultimate depth of cure depend on light intensity, spectral distribution of light source, exposure time, etc.

Fixture Time
UV fixture time is defined as the light exposure time required to develop a shear strength of 0.1 N/mm² .
UV Fixture Time , Glass microscope slides, 0 gap, seconds:
6 mW/cm² , measured @ 365 nm                             ≤10

Depth of Cure
Cure depth depends both on external factors including the type of light source, light intensity and exposure time and on internal factors including composition of the adhesive
The following graph show the increase in depth of cure with time as measured from the thickness of the cured product formed in a 15mm diameter PTFE die.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:

Coefficient of Thermal Expansion , ASTM E831-86, µm/m/K:

Glass Transition Temperature, ASTM D 1640, °C:|
Tg 1                                                                           -39
Tg 2                                                                           77

Thermal Conductivity, ASTM E1530, W/mK             0.17
Elongation , ASTM D882,%                                       186
Tensile Modulus , ASTM D882                   N/mm²    175 (psi)   (25,381)
Tensile Strength, ASTM D882                    N/mm²    15.6 (psi)  (2,262)

Electrical Properties:
Dielectric Constant , ASTM D150:
@ 100Hz                                                                 4.584
@ 1KHz                                                                   4.799
@ 10KHz                                                                 4.633
@ 100KHz                                                               4.221
@ 1MHz                                                                  4.312

@ 100Hz                                                                 0.0319
@ 1KHz                                                                   0.0222
@ 10KHz                                                                 0.0189
@ 100KHz                                                               0.02
@ 1MHz                                                                  0.0343

Volume Resistivity @ 100 volts, ohms-cm               1.13×1017
Surface Resistivity100 volts, ohms                           1.53×1016

TYPICAL PERFORMANCE OF CURED MATERIAL
Shear Strength:
Block Shear Strength, ASTM 700:
Polycarbonate to Polycarbonate                N/mm²    12.56 (psi)      (1,822)

GENERAL INFORMATION
This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

DIRECTIONS FOR USE

1.  Product is shipped at 2 to 8ºC with ice packs to prevent excessive temperature exposure during shipping.
2.  This product is light sensitive; exposure to daylight, UV light and artificial lighting should be kept to a minimum during storage and handling.
3. The product should be dispensed from application with black feedlines.
4.  For best performance bond surfaces should be clean and free from grease.
5.  Apply adhesive to one of the bond surfaces and assemble immediately.
6.  Cure rate is dependent on lamp intensity, distance from light source, depth of cure needed or bondline gap and light transmission of the substrate through which the radiation must pass.
7. Cooling should be provided for temperature sensitive substrates such as thermoplastics.
8.  Crystalline and semi-crystalline thermoplastics should be checked for risk of stress cracking when exposed to liquid adhesive.
9.  Excess uncured adhesive can be wiped away with organic solvent (e.g. Acetone).
10. Bonds should be allowed to cool before subjecting to any service loads.

Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.Optimal Storage:  8 to 28°C.  Storage below 8°C or greater than 28°C can adversely affect product properties.Material removed from containers may be contaminated during use.  Do not return product to the original container.  Henkel Corporation cannot assume responsibility for product  which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please   contact   your   local   Technical   Service   Center   or Customer Service Representative.

Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

Conversions

(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm²  x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

华为网盘下载：http://dl.dbank.com/c0gfdb0b62

注册本地下载：

  LOCTITE EDGEBOND UV 3705 TDS&MSDS&ROHS (117.2 KB, 9 次)
您没有权限下载此文件。