PRODUCT DESCRIPTION
ECCOBOND 45 Clear/Catalyst 15 Clear provides the following
product characteristics:
| Technology | Epoxy |
| Technology (Catalyst) | Amine |
| Appearance (Resin) | Clear yellow |
| Appearance (Catalyst) | Clear yellow |
| Mix Ratio – Resin : HardenerRigid Formula | 100 : 100 |
| Mix Ratio – Resin : HardenerSemi-Rigid Formula | 100 : 200 |
| Mix Ratio – Resin : HardenerFlexible Formula | 100 : 300 |
| Product Benefits | ● Unfilled● Ease of use
● Non-conductive ● General purpose ● Controllable flexibility ● Bond dissimilar substrates |
| Cure | Heat cure |
| Application | Assembly |
ECCOBOND 45 Clear/Catalyst 15 Clear is a clear, unfilled epoxy adhesive which, by varying the amount of catalyst used, can adjust the hardness from flexible to rigid. It has an easy mix ratio and bonds well to a wide variety of substrates. ECCOBOND 45 Clear/Catalyst 15 Clear is the clear, unfilled version of ECCOBOND 45/Catalyst 15.
ECCOBOND 45 Clear/Catalyst 15 Clear can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Part A Properties 45 Clear
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 13,500
Density, ASTM D792, g/cm³ 1.17
Flash Point – See MSDS
Part B Properties Catalyst 15
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 25,000
Density, ASTM D792, g/cm³ 0.97
Flash Point – See MSDS
Mixed Properties
Rigid Formulation:
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 20,000
Density, ASTM D792, g/cm³ 1.06
此产品据悉PCB行业有用到，分为透明和黑色两种！
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