Product Description
Hernon Dissipator 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap.
Dissipator 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature of produces a constant gap of 0.005 in. to 0.006 in. between components.
Product Benefits
No mixing required (eliminates errors in mixing ratio)
Room temperature cure. No heat required
Eliminates screws and rivets for assembly
Eliminates the air space between components
High k factor for heat conductive application 全文 »
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