这是一份在youtube上面找到的加拿大AIM公司的underfill视频资料，好像在中国大力推广此种One-Step Underfill比较多的是美国铟泰INDIUM公司，但被市场接受的程度似乎并不理想！ 摘录了文中的英文字幕，大家可以了解一下大致内容：
AIM’s Underfill Solutions for Complex Assemblies
688 One-Step Underfill
Save time
Fastet Cycle Times
Package on Package(POP) Assembly
Represents Unique Manufacturing Challenges
688 One-Step Underfill
Makes it Quick and Easy
simply Dispense 688 One Step on to your pasted bare board
Place Your Layer-One Components
Dispense 688 One-Step on Placed Package
688’s Green Bond Strength will Hold the First Layer in Place
Place the 2nd Component Creating the PoP Assembly
Reflow in your Lead-Free Solder Profile
And That’s It!
The Device has been Soldered and Underfilles in One Step!
688 One-Step Underfill
Can be Dispensed or Dipped
Resulting in low Voiding,High Reliability Solder Joints
AIM 688 One-Step
Represents a Breakthrough in Assembly Materials
AIM Innovates
Ask how we can help you
华为网盘下载视频文件：http://dl.dbank.com/c0ghcakv9a
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