这是ablestik比较经典的固晶绝缘胶之一,之前介绍的《HENKEL ABLESTIK ABLEBOND 2030SC》是属于导电胶系列,这个是绝缘胶产品。 此产品的一个技术优势就是在能快速固化的条件下还能有很高的粘接力,推荐的固化条件是:90 seconds @ 110°C或者60 seconds @ 120°C or 10 seconds @ 150°C。 在目前接触的胶粘剂产品中能如此快速固化的还不多。 摘录TDS如下:
PRODUCT DESCRIPTION
ABLEBOND 2035SC provides the following product characteristics:
Technology | Proprietary Hybrid Chemistry |
Appearance | Red |
Cure | Heat cure |
Product Benefits | • Non-conductive • Single component • Fast cure • Low cure temperature • Low stress |
Application | Die attach |
pH | 3.7 |
Filler Type | Silica |
ABLEBOND 2035SC nonconductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm) 4.2
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP): Speed 5 rpm 11,000
Work Life @ 25°C, hours 24
Shelf Life @ -40°C (from date of manufacture), year 1
TYPICAL CURING PERFORMANCE
Cure Schedule
90 seconds @ 110°C
Alternative Cure Schedule
60 seconds @ 120°C or 10 seconds @ 150°C
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’
experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion :
Below Tg, ppm/°C 54
Above Tg, ppm/°C 128
Glass Transition Temperature (Tg) by TMA, °C 120
Thermal Conductivity, W/mK 0.35
Tensile Modulus, DMTA :
@ -65 °C N/mm² 3,700 (psi) (540,000)
@ 25 °C N/mm² 2,500 (psi) (360,000)
@ 150 °C N/mm² 70 (psi) (11,000)
@ 250 °C N/mm² 68 (psi) (10,000)
Extractable Ionic Content, ppm:
Chloride (Cl-) <30
Sodium (Na+) <50
Potassium (K+) <20
Water Extract Conductivity, μmhos/cm 75
Weight Loss @ 300ºC, % 2.51
TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength: 2 X 2 mm die, kg-f,
Die on Substrate: | @25°C |
Au die on Au PBGA | 11 |
Si die on Ag leadframe | 13 |
Si die on Pd leadframe | 12 |
Si die on PBGA-FR4 | 12 |
Die Shear Strength vs Temperature, kg-f:
3 X 3 mm Si die, kg-f,
Substrate | @25°C | @150°C | @200°C |
PBGA-FR4 | 25 | 7.0 | 4.0 |
Chip Warpage vs Chip Size:
0.38 mm thick Si die on Diff substrates @ 25°C, μm
Chip Size: | Warpage: |
12.7 x 12.7 mm | 34 |
GENERAL INFORMATION
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
THAWING:
1. Allow container to reach room temperature before use.
2. After removing from the freezer, set the syringes to stand vertically while thawing.
3. DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.
4. DO NOT re-freeze. Once thawed to -40°C, the adhesive should not be re-frozen.
DIRECTIONS FOR USE
1. Thawed adhesive should be immediately placed on dispense equipment for use.
2. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive.
3. Adhesive must be completely used within the product’s recommended work life.
Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. Optimal Storage: -40 °C. Storage below minus (-)40 °C or greater than minus (-)40 °C can adversely affect product
properties.
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
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