PRODUCT DESCRIPTION

LOCTITE® 3563™ provides the following product characteristics:

Technology Epoxy

Chemical Type Epoxy

Appearance (uncured) Off-white to beige liquidLMS

Components One component – requires no mixing

Cure Heat cure

Cure Benefit Production – high speed curing

Application Underfill for flip chip devices

Dispense Method Syringe

Key Substrates SMD components to PCB

Reworkable No

LOCTITE® 3563™ is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, such as CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 μm. When fully cured, it minimizes induced stress at solder joint and thus improves thermal cycling performance.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity@ 25 °C 1.52

Viscosity, Cone & Plate rheometer, 2 ° Cone, mPa·s (cP):

Temperature: 25 °C, Shear Rate: 5 s-1 5,000 to 12,000LMS

Temperature: 25 °C, Shear Rate: 20 s-1 5,000 to 12,000

Capillary Flow Rate, seconds:

Flow time, 100 °C, glass to glass, 25 μm:

6.35 mm flow ≤15

12.7 mm flow ≤45LMS

25.4 mm flow ≤150

VOC, ASTM D 3960, g/l <10

Moisture Content, ASTM D 4017, % 0.01

Total Volatile Content, ASTM D 2369, % <1

Filler Content, % 40

Particle Size, μm:

Average 1 to 2

Maximum <10

Pot life @ 22 °C, hours 8 to 12

Flash Point – See MSDS

Recommended Curing Conditions

>7 minutes @ 150 °C

>5 minutes @ 165 °C

Note: With all fast cure systems, the time required for cure depends on the rate of heating. Conditions where a hot plate or heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source. Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results. 全文 »