之前学习过《关于反应性热熔胶—PUR-HM》里面提到过乐泰的3541和3542两款产品，后来学习乐泰公司《Bonding, Sealing and Coating Solutions for Mobile Devices》中也多次提到此款产品。但在乐泰的官网上没法下载到其TDS资料，google和baidu上也没找到完整的资料，后来在电子胶水论坛上发帖求助，有两位热心的网友@haz_2008和@A_camel给我发来了资料。 惊奇地发现这款产品居然1997年就有了，一份TDS是1997年的，一份是2009年的。但仔细看过之后发现不是同一个产品，一个是环氧体系的（1997年），一个是聚氨酯体系的（2009年）。但怎么会取一样的型号呢，呵呵！第一次发现这个问题。 聚氨酯体系才是最近在手机组装中尤其是触控屏手机组装中应用得非常普遍的这款。这份资料应该还只是实验室数据，里面及提供了几个简单的参数。对比了3541和3542的资料，发现除了open time差一分钟外，其它的好像没有任何区别！ 技术资料摘录如下，大家可以到后面下载查看之。
PRODUCT DESCRIPTION
LOCTITE 3541 is a reactive hot-melt adhesive based on polyurethane prepolymers. The adhesive is pressure sensitive and gives a high initial strength instantly after joining the parts. Additionally it has a long open time to be suitable for automatic or manual assembly line.
The adhesive provides the following characteristics:
| Colour: | Transparent when molten, after cooling light ivory |
| Odour: | Weak |
| Density: | 1.15±0.05g/cm3 |
| Solids: | 100% |
| Voiscosity: | 6000-10000mPa.s @110degC |
| Equipment: | Brookfield Thermosel, Spindle 27 |
| Open time: | 2-4 min |
| ApplicationTemperature: | 110 to 140 degC |
| Temperature resistance: Short-term (up to 1 h) | -30 to 100 degC-30 to 120 degC |
Pretreatment
The bonding surfaces must be clean, dry and free of oil and grease. Substrate temperature should not fall below 20degC during application. Lower temperatures will lead to and early solidification of the adhesive and thus to a reduced open time, possibly the adhesive might even flake off. If necessary the substrates may be preheated, however longer open times and thus extended cycle times will have to be taken into consideration at temperatures above 45degC.
Application
LOCTITE 3541 can be applied from heatable cartridge guns, from usual syringe type melting equipment. At longer rest periods melting and application temperatures should be decreased. Longer exposure to higher temperatures can lead to a viscosity increase.
Curing
LOCTITE 3541 cures exclusively by moisture and gains its final strength after 1-5 days, but exhibits high handling strength instantly after joining.
Curing is a chemical reaction depending on the following
parameters:
– Humidity in the rooms of application and storage
– Humidity of the substrates
– Permeability of the substrates to be bonded
– Application weight/ layer of the adhesive film
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loctite 3541and 3542 TDS (84.4 KB, 29 次)
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