PRODUCT DESCRIPTION
3508™ provides the following product characteristics:
Technology Epoxy
Appearance Black
Components One component
Product Benefits • Reworkable
• Pb-free applications
• Eliminates post-reflow dispenses
and cure steps
• Improves mechanical reliability of
hand-held devices
Cure Reflow
Application Cornerfill
Typical Assembly
Applications
Chip scale packages and BGA
3508™ reworkable cornerfill is designed to cure during pb-free
reflow while allowing self-alignment of IC components. It can
be pre-applied to the board at the corners of the pad site
using a standard SMA dispenser.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate,@ 25 °C mPa∙s (cP) 50,000
Specific Gravity @ 25 °C 1.24
Pot Life @ 25ºC, days >30
Shelf Life @ 2 to 8°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
Pb-free solder reflow profile @ 245°C
(3 hours @ 180°C for Tg testing)
The above cure profile is a guideline recommendation. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion , ppm/°C:
Below Tg 55
Above Tg 175
Glass Transition Temperature (Tg) by TMA, °C 115
Shore Hardness, Durometer D 71
Storage Modulus, 25°C, GPa 2.48
Tensile Modulus N/mm² 1,130
(psi) (163,892)
Tensile Strength N/mm² 56.5
(psi) (8,190)

GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 to 8°C. Storage below 2°C or greater
than 8°C can adversely affect product properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Do not return products to refrigerated storage; any surplus
product should be discarded.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Henkel Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from
domination of patents owned by others or as a license under
any Henkel Corporation patents that may cover such
processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent
applications.

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