PRODUCT DESCRIPTION
LOCTITE® 3108™ provides the following product characteristics:
Technology Acrylic
Chemical Type Acrylated urethane
Appearance (uncured) Translucent colorless liquidLMS
Components One component – requires no mixing
Viscosity Medium
Cure Ultraviolet (UV) light
Cure Benefit Production – high speed curing
Application Bonding
Flexibility Enhances load bearing & shock absorbing characteristics of the bond area.

LOCTITE® 3108™ is designed primarly for potting and sealing glass to metal joints that must withstand thermal cycling and environmental exposure. The product has shown excellent capabilities in bonding dissimilar rigid substrates.

TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity@ 25 °C 1.08
Flash Point – See MSDS
Viscosity, Brookfield – RVT, 25 °C, mPa·s (cP):
Spindle 4, speed 20 rpm 3,600 to 6,600LMS

TYPICAL CURING PERFORMANCE
LOCTITE® 3108™ can be cured by exposure to UV light at 365nm. Surface cure is enhanced by exposure to UV light in the 220 to 260 nm range. Cure rate and ultimate depth of cure depend on light intensity, spectral distribution of the light source, exposure time and light transmittance of the substrate through which the light must pass.

Fixture Time
Fixture time is defined as the time to develop a shear strength of 0.1 N/mm².
UV Fixture Time, Glass, seconds:
Medium Pressure Hg Arc bulb, Zeta® 7200 light source: 50 mW/cm², measured @ 365 nm ≤15LMS
Electrodeless, D bulb: 100 mW/cm², measured @ 365 nm 7

 

Depth of Cure vs. Irradiance (365 nm)

The graphs below show the increase in depth of cure with time at 50 mW/cm² and 100 mW/cm² as measured from the

thickness of the cured test piece.

TYPICAL PROPERTIES OF CURED MATERIAL

Cured @ 100 mW/cm², for 30 seconds using an Electrodeless

system, D bulb

Physical Properties:

Shore Hardness, ISO 868, Durometer A ≥72LMS

Water Absorption, ISO 62, %:

2 hours in boiling water 4.9

Elongation, at break, ISO 527-3, % 330

Tensile Modulus, ISO 527-3 N/mm² 18.6

(psi) (2,670)

Tensile Strength, at break, ISO

527-3

N/mm² 7.91

(psi) (1,135)

UV Depth of Cure, mm:

Cured @ 100 mW/cm², measured @

365 nm,

for 15 seconds

≥1.6LMS

Electrical Properties:

Surface Resistivity, IEC 60093, Ω∙cm 7.84×1014

Volume Resistivity, IEC 60093, Ω·cm 1.06×1014

Dielectric Breakdown Strength,

IEC 60243-1, kV/mm

37

Dielectric Constant / Dissipation Factor, IEC 60250:

100-Hz 7.47 / 0.19

1-kHz 6.8 / 0.07

1-MHz 5.59 / 0.05

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

Cured @ 100 mW/cm², measured @ 365 nm, for 30 seconds using

an Electrodeless system, D bulb, (samples with 0.127 mm gap)

Block Shear Strength, ISO 13445:

Glass to Glass N/mm² 4.2

(psi) (610)

Glass to Steel N/mm² 3.5

(psi) (510)

Glass to Aluminum N/mm² 3.1

(psi) (445)

Cured @ 100 mW/cm², measured @ 365 nm, for 30 secondsusing a

medium pressure Hg Arc bulb, Zeta® 7200 light source

Block Shear Strength, ISO 13445:

Polycarbonate to

Polycarbonate

N/mm² ≥5.5LMS

(psi) (≥797)

TYPICAL ENVIRONMENTAL RESISTANCE

Cured @ 100 mW/cm², measured @ 365 nm, for 30 seconds using

an Electrodeless system, D bulb

Block Shear Strength, ISO 13445:

Polycarbonate:

0.127 mm gap

Chemical/Solvent Resistance

Aged under conditions indicated and tested @ 22 °C.

% of initial strength

Environment °C 100 h 500 h 1000 h

Water immersion 22 75 40 45

Heat/humidity 95% RH 38 80 100 100

Salt fog 35 65 55 60

GENERAL INFORMATION

This product is not recommended for use in pure oxygen

and/or oxygen rich systems and should not be selected as

a sealant for chlorine or other strong oxidizing materials

For safe handling information on this product, consult the

Material Safety Data Sheet (MSDS).

Directions for use:

1. This product is light sensitive; exposure to daylight, UV

light and artificial lighting should be kept to a minimum

during storage and handling.

2. The product should be dispensed from applicators with

black feedlines.

3. For best performance bond surfaces should be clean and

free from grease.

4. Cure rate is dependent on lamp intensity, distance from

light source, depth of cure needed or bondline gap and

light transmittance of the substrate through which the

radiation must pass.

5. Cooling should be provided for temperature sensitive

substrates such as thermoplastics.

6. Plastic grades should be checked for risk of stress

cracking when exposed to liquid adhesive.

7. Excess uncured adhesive can be wiped away with organic

solvent (e.g. Acetone).

8. Bonds should be allowed to cool before subjecting to any

service loads.

Loctite Material SpecificationLMS

LMS dated July-3, 2003. Test reports for each batch are

available for the indicated properties. LMS test reports include

selected QC test parameters considered appropriate to

specifications for customer use. Additionally, comprehensive

controls are in place to assure product quality and

consistency. Special customer specification requirements may

be coordinated through Henkel Quality.

Storage

Store product in the unopened container in a dry location.

Storage information may be indicated on the product container

labeling.

Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or

greater than 8 °C can adversely affect product properties.

Material removed from containers may be contaminated during

use. Do not return product to the original container. Henkel

Corporation cannot assume responsibility for product which

has been contaminated or stored under conditions other than

those previously indicated. If additional information is required,

please contact your local Technical Service Center or

Customer Service Representative.

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

μm / 25.4 = mil

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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