众所周知，常见胶粘剂一般分为丙烯酸系列、环氧系列、有机硅系列、氰基丙烯酸系列、聚氨酯系列等等。而不同类型的胶粘剂在某些方面都有着各自的特性，例如需要耐温的话一般有机硅会比较有优势，强度要求比较高的话环氧一般会比较有优势，而如果对弹性要求的话有机硅、聚氨酯又会更有优势。 现在其实很多体系都是可以相互改性而来弥补原有体系的不足，但这样一般也会需要付出较高的成本。最近公司在和美国赫能合作，从他们的一份资料里面找到了一个简易的对比表，大家可以参考一下。他们这份表主要是针对他们公司的产品，有些方面是比较片面的，例如他里面提到环氧需要双组分混合设备等等，其实早就有单组分热固化的环氧了。还有其它的一些与实际差异比较大的地方，就不一一表述了。 请参看下表：
| Adhesive Category | ||||
| Performance Considerations | Acrylics | Cyanoacrylates | Epoxies | Silicones |
| Benefits | Good impactresistance/flexbility | Excellent adhesion to rubber or plastics | Wide rangeof formulations | Excellent termperatureresistance |
| Limitations | Primer required | Low solvent resistance | Mixing required | Low strength |
| Temperature Resistance Typical for the category | -65°F to 300°F | -65°F to 180°F | -65°F to 180°F | -65°F to 400°F |
| Highest Temperature Resistance | 400°F | 250°F | 275°F | 600°F |
| Environmental Resistance | ||||
| Polar Solvents (ex, H20, Ethylene Glycol, IPA, Acetone) | Good | Poor | Very Good | Good |
| Non-Polar Solvents (ex, Motor Oil, Toluene, Gasoline, ATF) | Very Good | Good | Excellent | Poor |
| Adhesion to Substrates | ||||
| Metals | Excellent | Very Good | Excellent | Good |
| Plastics | Fair | Excellent | Fair | Fair |
| Glass | Excellent | Poor | Excellent | Very Good |
| Rubber | Poor | Very Good | Fair | Good |
| Wood | Good | Good | Very Good | Fair |
| Overlapping Shear Strength | High | High | High | Low |
| Peel Strength | Medium | Low | Medium | Medium |
| Tensile Strength | High | High | High | Low |
| Elongation/Flexibility | Medium | Low | Low | Very High |
| Hardness | Semi-Rigid | Rigid | Rigid | Soft |
| Process Considerations | ||||
| Number of Components | 2 | 1 | 2 | 1 |
| Cure Temperature | Room Temp. | Room Temp. | Room Temp. | Room Temp. |
| Fixture Time | ||||
| Average | 10 mins | 60 secs | 35 mins | 25 mins |
| Fastest | 30 secs | 10 secs | 3-5 mins | 10 mins |
| Full Cure Time | 24 hours | 24 hours | 12 – 24 hours | 24 hours |
| Gap Fill | ||||
| Ideal | 0.002″ – .004″ | 0.001″ – 0.003″ | 0.004″ – 0.006″ | 0.004″ – 0.006″ |
| Maximum | 0.040″ | 0.010″ | 0.125″ | 0.240″ |
| Dispensing/Mixing Equipment Required | No | No | Yes | No |
| Light Cure Versions Available? | Yes | Yes | Yes | Yes |
《【扒一扒】日本高纯球形硅微粉材料生产商》： 作为一种无机非金属矿物功能性粉体材料，硅微粉广泛应用于电子材料、电工绝缘材料、胶黏剂、特种陶瓷、精密铸造、油漆涂料、油墨、硅橡胶等领域。 目前，世界上只有中国、日本、韩国、美国等少数国家具备硅微粉生产能力... 全文 ?