DESCRIPTION

Hysol® FP4322 is a high purity liquid epoxy encapsulant designed for semiconductor encapsulation. It is a high flow material which requires a cavity or flow control barrier to prevent excessive flow. Hysol FP4322 is suitable for encapsulation of bare chips mounted to plastic substrates as well as potting of small hybrid circuit modules. Spot encapsulation of bare chips on ceramic substrates is not suggested in most cases.

TYPICAL APPLICATIONS

Semiconductor encapsulation.

PROPERTIES OF UNCURED MATERIAL

Color Black

Filler Content, % (ASTM D2584) 65

Specific Gravity @25°C, (77°F)

(ASTM D1475) 1.69

Shelf Life @-40°C (-40°F), months 9

Typical Value

Viscosity @ 25°C, (77°F)

(ITM2A) (ASTM D2393)

Brookfield RVF

Spindle 7, Speed 2, Cp 92,500

Spindle 7, Speed 20, Cp 52,500

PHYSICAL PROPERTIES, CURED MATERIAL

Color Black

Coefficient of Thermal Expansion, in/in/°C

(ASTM D3386)

(40°-120°C) 30 x 10-6

Linear Shrinkage, %(ASTM D2566) .43

Density, gm/cc (ASTM D792) 1.7

Glass Transition, (Tg), °C, (ASTM D3386) 160

Hardness, Shore D (ASTM D2240) 97

Moisture Absorption, % (ASTM D570)

Immersion @ 100°C, 8 hrs 0.25

Extractable Ionic Content (ITM107B)

Chloride (Cl-), ppm 25

Potassium (K+), ppm 25

Sodium 25

Cured Electrical Properties

25°C

K D

1kHz 3.18 0.005

10kHz 3.15 0.006

100kHz 3.04 0.11

Volume Resistivity 6.2 x 1014

Surface Resistivity 1.6 x 1014

K = Dielectric constant by ASTM D150

D = Dissipation Factor by ASTM D150

Vol. Res.= Volume Resistivity in ohm-cm by ASTM D257

Surf.Res.= Surface Resistivity in ohm by ASTM D257

Handling

Pot Life @ 25°C, 77°F, days, 1

(ITM10T), time to double in viscosity

Gel Time @ 121°C, (250°F), minutes,

(ITM10N) 11

Shelf life at room temperature is approximately 2 days. Product may be stored at –40°C for greater than 6 months. Frozen packages must be thawed before use. Warm at room temperature until no longer cool to the touch (normally 20-60 minutes). Do not thaw in an oven or water bath. For best results FP4322 should be dispensed onto a substrate warmed to approximately 90°C. This will help minimize air entrapment under bonding wire.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or their strong oxidizing materials

Cure Schedule

Recommended Cure 2-3 hours @ 170°C or

3-6 hours @ 150°C

Alternate Cure 1 hour @ 125°C plus

(Low Stress) 4 hours @ 150°C

(Designed for packages which are effected by high levels of stress.)

A two-step cure will minimize stress and warpage on large substrates. Curing below 140°C is not recommended. User should gel devices immediately after dispensing to prevent moisture degradation of ultimate cure properties. Use suggested cure schedules as general guidelines; other cure schedules may yield satisfactory results.

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4322 TDS (22.7 KB, 117 次)

近日公司和美国赫能正在洽谈合作的事情，他们公司的老板Harry Arnon推荐了一篇关于胶粘剂市场的文章，抽空看了一下，公司的同事将其翻译成中文，与大家共享之。点击查看原文。 翻译的文章在英文后面：

The Global Formulated Adhesives Market

by Minesh Kusumgar

January 1, 2011

Regional Overviews

Enlarge this picture Figure 1. Adhesive Consumption by Region ($ Billion)

The Asia-Pacific region is the largest consumer of formulated adhesives; it achieved 40% of the 2009 volume and 34% of the dollars. Regional volume was up slightly in 2009 compared to the prior year, while the sales value was slightly lower. China is the largest consumer in Asia-Pacific with 53% of the volume and 49% of the value. Chinese adhesive consumption was up 6% in 2009 as the domestic economy expanded, despite weak export demand for its manufactured products. A robust 9% annual rate of growth is forecast for adhesives in China.

Japan, the second-largest market for adhesives in the region, took 16% of the 2009 volume and one-fifth of the dollars. Volume in Japan declined significantly compared to 2008, and lackluster growth is forecast. India is a smaller user of adhesives, with 6% of the regional volume and 5% of the value. Like China, it is one of the few countries in the world to have experienced modest adhesive growth in 2009. Adhesives in India are projected to expand 11% per year through 2014.

Europe is the second-largest regional consumer of formulated adhesives, with 30% of the world’s volume and 32% of the value in 2009. Europe had been the leader in adhesive dollars prior to 2009. The sharp decline in European consumption allowed the Asia-Pacific region to capture the lead, which is projected to widen in future years. A 3% annual growth rate is forecast for European adhesives, with Eastern European countries expanding somewhat faster than Western Europe. European Union members consumed about 93% of the adhesive dollars.

North America took 24% of the global adhesive volume in 2009 and 27% of the dollars. As was the case in Europe, the market declined significantly from 2008. The U.S. consumed nearly 90% of the regional total, with the rest about equally split between Canada and Mexico. A modest 3% annual rate of growth is forecast for North American adhesive volume. South and Central American countries consumed 5% of the global adhesive volume and dollars in 2009. Brazil is the leading regional consumer with 57% of the value. Brazil weathered the global recession better than most, with adhesive volume only down 2% in 2009. South and Central American adhesives are projected to advance 5% annually through 2014.

Figure 1 shows adhesive dollar consumption by region in 2008 and 2009, as well as the 2014 forecast.

End Use Review

Enlarge this picture Figure 2. Adhesive Consumption by End Use, 2009. ($20.6 Billion Total)

Pressure-sensitive products are the largest adhesive end use, representing 28% of the global volume in 2009 and 25% of the value. Applications include tapes, labels, decals and a host of other specialty products. Over 45 billion m2 of product is adhesive-coated, with tapes comprising over 60% of the total. Two-thirds of the adhesive value is produced in-house by pressure-sensitive product manufacturers. Pressure-sensitive adhesives are forecast to grow 5% annually through 2014, with emerging economies (China, India, Brazil, etc.) expanding faster.

Packaging is the second-largest end use, with 22% of the volume and 18% of the dollars in 2009. Global volume was down only slightly from the prior year and a 4% annual rate of increase is forecast. Flexible packaging is a higher value segment that represents one-quarter of the packaging adhesive dollars in 2009. Construction was the third-largest adhesive outlet in 2009, with 16% of the volume and 10% of the dollars. Construction adhesive applications include ceramic tile and flooring installation, pipe cements, roofing, wall coverings, etc. Volume was down more than 10% compared to 2008, as activity declined significantly in the mature economies.

Woodworking is the fourth-largest end use, taking 11% of the 2009 volume and 8% of the dollars. Wood furniture is a leading application, and global production suffered the effects of the recession. The automotive industry is the fifth-largest end use in dollars, with a 6% share despite representing only 2% of the dollars. Adhesives consumed by car and truck manufacturers are included, as well as those used in the aftermarket. Global vehicle production was 61 million units in 2009, which was down 13% compared to 2008. Steep declines occurred in Europe and North America. In contrast, production in Asia-Pacific remained about the same as output surged in China. Some 810 million vehicles are on the world’s roads, with adhesives used by both the professional and consumer. Excluded from automotive adhesives are windshield sealants, a nearly $600 million market in 2009, as well as several other sealant types.

The five largest adhesive applications took 80% of the adhesive volume in 2009 and two-thirds of the value. Figure 2 shows adhesive consumption by end use in dollars for 2009. Electronics, bookbinding, and aerospace are larger end uses in the “other” category.

Adhesive Technologies

Enlarge this picture Figure 3. Adhesive Consumption by Technology, 2009 ($20.6 Billion Total)

Figure 3 summarizes the four major adhesive technologies in value for 2009. Water-based adhesives are the leading type, with $6.7 billion consumed (33% of the global adhesive sales dollars). Water-based adhesives are generally lower in cost and they represented over one-half of the 2009 pounds.

Solvent-based technology is second in dollars, with its $5.7 billion (28%) of the value. Hot-melts were third, representing one-fifth of the dollars, with packaging and disposable products leading outlets. The 100% reactive category was slightly behind hot-melts in dollars, with a 19% share. These products are generally the highest priced adhesives, and they captured only 4% of the volume. Epoxy, polyurethane, cyanoacrylate, anaerobic, structural acrylic, etc. products are included.

Adhesive Types

Enlarge this picture Figure 4. Adhesives Consumption by Type, 2009 ($20.6 Billion Total)

Adhesives employ a host of polymer types in their formulation. Sales of the leading adhesives by polymer type in 2009 are shown in Figure 4. Acrylics are topmost, with their $3.6 billion in sales representing a 17% share. Acrylic emulsion-based formulations were 72% of the dollars and solvent-based acrylics accounted for 23%. Smaller amounts of structural acrylics and radiation-cured hot-melts are used. Water-based polyvinyl acetate (PVAC) and vinyl acetate-ethylene (VAE) adhesives comprised 14% of the adhesive dollars. Woodworking and packaging are the larger outlets.

Polyurethane adhesives were 12% of the sales and are formulated using each of the four major technologies. Solvent-based formulations were one-half of the polyurethane dollars, with flexible packaging and footwear the largest applications. The 100% reactive polyurethanes were about one-third of the dollars, with flexible packaging and automotive its major outlets. Hot-melt polyurethanes were 10% of the sales and water-based formulations another 7%.

Ethylene-vinyl acetate (EVA) and polyethylene hot-melts were 9% of the adhesive dollars in 2009, as were styrenic block copolymer hot-melts. Packaging is the major user of EVA and polyethylene hot-melts. Some 95% of the styrenic block copolymer adhesives are used in pressure-sensitive products and disposable products (diapers and other).

Epoxy adhesives are used in several higher dollar value end uses, which include the electronic, aerospace and automotive industries. Polychloroprene adhesives are largely solvent-based, although water-based versions have gained share in recent years. Footwear, woodworking and construction are the larger outlets. Larger dollar value adhesives included in “other” are cyanoacrylate, anaerobic, rubber, starch and dextrin, polyester, and polyamide.

在多年销售的不断增长后，胶粘剂需求量在2009年的全球萧条中下跌5% 。2009年，全球GDP下降约1%，工业产品下跌近3% 。预计2009年胶粘剂的消耗量是166亿磅（206亿美元）。随着全球经济的复苏，预计到2014年，胶粘剂的需求量将达到4.5%的年增长率。在欧洲和北美的成熟经济体的缓慢增长的同时，新兴经济体的增长将非常强健。预计在欧盟和北美每人超过$12的胶水需求量，在中国、印度、巴西将降至每户不足$3。

地区概述

Figure 1. Adhesive Consumption by Region($ Billion)

亚太地区是预计胶粘剂的最大消费体；其消耗量在2009年达到总量的40%，总消费金额的34% 。当2009年的总销售额轻微下降时，该地区消耗量较上年却有轻微上涨。中国拥有53%的消耗量，占总销售额的49%，是亚太地区最大的胶水消费者。尽管对其产品的出口需求量偏弱，但中国胶水的消耗量在2009年的国内经济扩张中仍然增长6% 。预计中国胶粘剂需求量将有9% 的稳健增长量。

日本，该地区胶粘剂的第二大需求量国家，占2009年总消耗量的16%，占总销售额的1/5。相比2008年，日本需求量大幅度降低，前景预计不佳。印度为胶水小用户，占地区用量的6%，总销售额的5% 。中国是全球仅有的几个在2009年胶水用量有些微增长的国家之一。印度的胶水用量预计在2014年达到11%的年增长率。

欧洲是预计胶水的第二大消费地区，2009年占世界总需求量的30%，总销售额的32% 。2009年之前，欧洲是胶水销售额的领跑者。欧洲胶水消耗量的大幅下跌使得亚太地区可以趁机追赶，预期在未来几年内扩展销量以获取领跑地位。预计欧洲胶水将有3%的年增长率，东欧国家增长速度略大于西欧国家。欧盟成员约占欧洲总胶水销量的93% 。

北美在2009年占全球胶水用量的24%，总销售额的27% 。与欧洲市场一样，北美市场大幅较2008年大幅下跌。美国消耗量达到整个地区近90%，余下的需求量由加拿大和墨西哥均分。预计北美的胶水需求量将有3%的缓慢增长。2009年，南美和中部国家消耗量占全球消耗量和销售额的5% 。巴西是该地区的领跑者，占总量的57%。在2009年的全球经济萧条中，巴西比大多数国家更经得起风霜，胶水需求量仅下降了2% 。预计南美和中美洲在2014年的胶水需求量将达到5%的年增长率。

图1标示了2008-2009年地区的胶水销售额，以及2014年的预计销售额。

最终用途概述

Figure 2. Adhesive Consumption by End Use, 2009. ($20.6 Billion Total)

压敏产品是胶水的最大应用点，占2009年全球总量的28%，总销售额的25% 。应用包括：胶带、标签、贴花纸，以及许多其他特有产品。超过450亿产品需要涂胶，包括胶带在内，占总量比例超过60% 。2/3的胶水销售量是由压敏产品生产商在室内生产的。随着新兴经济体（中国、印度、巴西等）的快速扩张，预计2014年压敏胶粘剂将达到5%的年增长率。

包装是胶水终端用途的第二大应用点，在2009年，占总销售量的22%，总销售额的18% 。全球需求量较前年仅轻微下调，预计将有4%的年增长率。软包装是高产值部分，在2009年占包装用品胶水销售量的1/4.结构胶属于包装用胶第三大胶水需求点，占2009年总需求量的16%，总销售额的10% 。结构胶应用包括瓷砖和地板的安装、管道粘接、房顶及墙面涂胶等。结构胶在成熟经济体中的需求量大幅下跌。相比2008年，需求量下跌了不只10%。

木工艺是终端用途的第四大模块，占2009年总需求量的11%，总销售额的8%。木制家具是领头应用点；全球生产也受到了经济萧条的影响。汽车工业是终端应用的第五大模块，占全球需求量的6%，全球销售额的2% 。该模块包括汽车、卡车生产商的胶水消耗量，已经用于售后的消耗量。2009年，全球的交通工具产品达到6100万单位，相比2008年下降了13%。欧洲、北美地区遭受急剧下降。相反，亚太地区与中国同样保持大批量产量。大概8.1亿的交通工具已投入到世界的道路上，意味着胶水在被专业生产及非专业用户同时使用着。不包括从汽车挡风玻璃密封胶，在2009年有近6亿美元的市场，以及其他一些类型的密封胶。

这五个最大的胶粘剂应用点占据了2009年胶水需求量的80%，占销售额的2/3。图2标示了2009年终端应用的胶水消耗量（美元）。电子、装订，及航天是更大的另一类终端应用点。

胶水技术

Figure 3. Adhesive Consumption by Technology, 2009($20.6 Billion Total)

图3总结了2009年销量的4个主要胶粘剂技术。水基粘合剂是领头类，达67亿美元的消耗量（全球胶水销售量的33%）。水基粘合剂通常价格较低，占2009年英镑销售的一半以上。

溶剂型技术是销售额中的第二大技术，达57亿美元的销售量（占28%）。热熔型占第三，占总销售额的1/5，包括包装及一次性产品领先的行业。100%的活性类占比微次于热熔型，占19%份额。这些产品通常是价格最高的，只占取了总量的4%。包括环氧树脂、聚氨酯甲酸乙酯、厌氧胶、结构丙烯酸树脂等产品。

胶水类型

Figure 4. Adhesives Consumption by Type, 2009($20.6 Billion Total)

胶水的配方中，有许多是聚合型产物。图4中列出了2009年销售领先的聚合型胶水。丙烯酸酯占首位销售，达到36亿美元，占17%份额。丙烯酸酯乳液型配方占该份额的72%，溶剂型丙烯酸酯占23%。结构型丙烯酸酯和辐射固化热熔型的使用量占更少的份额。水性乙烯聚醋酸酯(PVAC)和乙烯醋酸乙烯酯(VAE)粘合剂占占该份额的14%。木工艺和包装行业有更大的市场前景。

聚氨基甲酸乙酯粘合剂占销售额的12%，可用4个主要技术中的任何一个来配置。溶剂型配方占聚氨基甲酸乙酯销售额的一半，最常用于软包装和鞋产品。所有的活性聚氨基甲酸乙酯占总销售额的1/3，主要应用于软包装盒汽车业。热熔型聚氨基甲酸乙酯占销售额的10%，水性配方占7% 。

乙烯醋酸乙烯酯(EVA)和聚乙烯热熔型占2009年胶水销售量的9%，与热熔型苯乙烯类嵌段共聚物一致。乙烯醋酸乙烯酯(EVA)和聚乙烯热熔型最常用于包装。大概95%的苯乙烯类嵌段共聚物粘合剂都用于压敏产品和一次性产品。（尿布及其他）

环氧树脂粘合剂用于一些高价值终端产品，包括电子、航天及汽车工业。聚氯丁烯粘合剂多是溶剂型；近年来水性产品也获取了一些市场。主要应用于鞋产品、木工艺及建筑业。在其他行业占更大份额的粘合剂包括：氰基丙烯酸酯胶粘剂、厌氧胶、橡胶、淀粉-糊精粘合剂、聚酯以及聚酰胺。

外部竞争

跨国并购继续改变着胶水供应商的结构。2009年，前20个胶粘剂配方供应商占取了总销售额的47% 。这些公司销售了55%的粘合剂到北美、欧洲、南美及中美洲。他们在亚太地区仅占约1/3，但预计可上升。

很多粘合剂销售商通过销售相关产品增加其销售额，包括密封剂、装订机、结构产品、电子封装、以及包胶化合物、涂层等。尽管这些供应商基于大量终端应用的集中性，大范围的终端应用商、应用点和技术领域仍产生了成千的供应商，并生成了新兴技术盛行的环境。

以上信息基于新调查结果The Global Adhesives Industry(全球粘合剂工业)，作者是Steven Nerlfi, Minesh Kusumgar, and Michael Growney。如需更多信息，可致电：(201)773-0785.  E-mail: nerlfikng@cs.com 或访问网站 www.kusumgar-nerlfigrowney.com .

学习电子胶水这么久了，其实发现自己一直忽略了一个问题，经常听到很多场合说到结构胶以及非结构胶，但还真未认真的去了解过，一个简单的认识就是结构胶对强度要求很高，非结构胶对强度要求低一些，今天有空特意在网上找了一些文章来学习一下，大家共享之：

1、按胶接接头的受力情况可分为结构胶粘剂和非结构胶粘剂。

结构胶粘剂具有较高的胶接强度，其胶接接头能承受较大的负荷，不仅所胶接的接头剪切强度要高，且其不均匀扯离强度也要较高，这样才能使胶接接头经受住冲击、振动、疲劳等各种载荷的考验。此外，这类胶粘剂还必须具有一定的耐热、耐气候等性能．使被胶接的结构部件能在较苛刻的环境下工作。结构胶粘剂的品种很多，从主组成看，用得最多的有改性酚醛树脂、改性环氧树脂、不饱和树脂等胶粘剂。

非结构胶粘剂一般不承受任何较大的载荷，用于胶接受力较小的制件或做定位用。非结构胶粘剂的品种也很多，如聚氨酯、氯丁橡胶、脲醛、淀粉等胶粘剂。

应当指出，在结构和非结构胶粘剂之间，并无严格界限，既无明确强度指标界限，也不能完全按树脂类型来分。例如环氧树脂胶粘剂用一般胺类在室温下固化的配方，只能用于非结构不见的胶接，若将其进行改性，则能成为良好的结构胶粘剂。

2、环氧树脂结构胶粘剂作为结构胶中最主要也是最可靠的产品，随着建筑安全要求的提高重要性越来越为人所知。“神六”发射后，航天器上使用的国产环氧树脂结构胶粘剂又形起国内外高度关注，提供这种材料的蓝星新材料无锡树脂厂专家表示，“神六”飞船的座舱、地板、天线、太阳能电池、仪器舱等重要部位，必须在承受超强高、低温变化和强冲击力的巨大考验后依然紧紧粘连在一起。实现这一要求需求使用性能极好的结构胶粘剂，环氧树脂胶是公认的最佳也是主导使用的结构胶粘剂。环氧树脂本身就是胶粘剂，在应用过程中按工艺及应用要求与环氧固化剂反应，即可完成固化、实现胶粘功能。蓝星新材料无锡树脂厂是我国历次航天发射专用材料提供者，提供的特制环氧树脂性能过硬，它紧密地把飞船各部位的结构粘接在一起，发挥了不可替代的作用。关于航天环氧树脂结构胶粘剂的配方、试验环境、基料品种等都属保密。

环氧树脂结构胶粘剂是指胶接受力结构件的一类胶粘剂。在结构件的连接上，胶接比传统的铆接、螺接、焊接具有更大的优越性。开始使用合成胶粘剂胶接受力结构件大约是在20世纪40年代。当时由于现代工业，特别是航空和其他军事工业发展的需要，而合成高分子工业正处在新兴时期，所以结构胶粘剂得到迅速发展。环氧结构胶粘剂则是其中一个十分重要的品种。

目前国内外对结构胶粘剂的定义、分类和评价标准还没有公认的一致意见。各行业的看法也不尽相同。美国航空结构胶粘剂标准MMM-A-132按不同马赫数的飞行速度对耐热性的要求，将结构胶粘剂分为四种类型，并对其剪切、疲劳、蠕变、老化、T型剥离等强度指标做了具体规定。I型对应的飞行速度为1马赫数以下，规定了室温和82℃的强度指标；Ⅱ型对应的是1～2马赫数，规定了室温及149℃的强度指标；Ⅲ、Ⅳ型对应的是2马赫数以上至3马赫数左右，规定了室温、149℃和260℃的强度指标。后三种类型是超音速飞机用的耐高温结构胶粘剂。

按强度的不同I型又分为三级，规定如下：一级用于主受力结构的胶接，为结构胶粘剂；二级用于次受力结构的胶接，为准结构胶粘剂；三级对剥离强度没有要求，应属于非结构胶粘剂。我国对结构胶粘剂的定义和分类还没有国家标准，通常根据胶接对象受力情况和胶接强度把结构胶粘剂分为高强度、高韧性和中等强度、中等韧性两类：主受力结构用胶的钢一钢抗剪强度≥25MPa，抗拉强度≥33MPa，不均匀扯离强度≥40kN/m。次受力结构用胶的剪切强度17～25Mpa，不均匀扯离强度20～50kN/m。

按照固化温度可把环氧结构胶粘剂分为高温固化、中温固化、室温固化和低温固化四类：高温固化环氧结构胶粘剂的温度、韧性、耐热性等均高，多用于主受力结构的胶接；中温固化环氧结构胶粘剂主要是适应飞机工业的需要而发展起来的胶种，由于铝合金在120℃以上开始出现晶界腐蚀倾向，并随温度的升高而加剧，晶界腐蚀后绿合金的强度和韧性都会下降，因此要求胶接铝合金的胶粘剂的固化条件不超过130℃/4h；室温固化环氧结构胶粘剂的应用更为广泛。在土木建筑领域的应用更为重要，是建筑结构胶粘剂的主要品种之一；低温固化环氧胶粘剂是近几年来为了适应冬季低温施工的需要，开发出的一类新胶种能在0℃，甚至可在-10℃以下施工、固化。

按照耐热性还可把结构胶粘剂分为通用型(≤80℃)、耐高温型(≥150℃)和耐中温型(介与前者之间)3类。

关于环氧结构胶粘剂的特点，专家介绍说，主要是：强度和韧性大，综合性能好，胶接的安全可靠性高。配方设计灵活，可选择性大，能适应各种使用要求。使用工艺简便。环氧结构胶粘剂在航空和宇航工业中大量用于制造蜂窝夹层结构、全胶接钣金结构、复合金属结构(如钢-铝、铝-镁、钢-青铜等)和金属-聚合物复合材料的复合结构。用作机翼蒙皮、机身壁板、人造卫星结构、火箭发动机壳体等。在造船工业中用于螺旋桨与艉轴的胶接，曲轴的胶接。在机械制造工业中用于重型机床丝杆的套镶粘接，其精度和强度均大于整体丝杆。近年来环氧结构胶粘剂的应用在土木建筑中得到快速发展。广泛用于房屋、桥梁、隧道、大坝等的加固、锚固、灌注粘接、修补等方面。

3、建筑胶粘剂，是建筑工程上必不可少的材料，使用范围很广泛。在建筑装饰装修过程中，主要用于板材粘结，墙面预处理，壁纸粘贴，陶瓷墙地砖、各种地板、地毯铺设粘结等方面，增加了防水性、密封性、弹性、抗冲击性等一系列性能，这不仅可以提高建筑装饰质量，增加美观舒适感，还可以改进施工工艺，提高建筑施工效率和质量等，由于使用范围广，故其种类繁多，按粘接强度和用途分类：

a、结构型

（1）建筑结构胶：粘钢胶、植筋胶（锚固胶）、灌注胶、碳纤维加固胶等；

（2）幕墙结构胶：干挂胶、有机硅结构胶；

b、非结构型

（1）粘接性胶黏剂：地板胶、地砖胶、壁纸胶、塑料管道胶、石料胶、竹木胶等；

（2）密封胶：聚硫密封胶、丁基密封胶、有机硅密封胶等。

说到植筋胶（锚固胶），补充几句，我弟弟是在中交二航局武汉研究院，专门从事道路及桥梁的修葺工作，当时他告诉我他们院里每年都要花上百万在胶水上面，而且像类似植筋胶什么的用量非常大，据说用植筋胶把钢筋插入墙体固化后，用拉力机去做拉拔测试，将钢筋拔断了也没能从胶里面拔出来的，可见这种胶的强度是非常大的。另外有一次他们在杭州负责一个项目时，当时他带着几种胶粘剂去北京的某研究所做测试认证报告，据说也花了两三万元，比起我们常见的环保方面的SGS什么的也还真不便宜，呵呵。 不过我后来查了一下做植筋胶的公司，基本上都是一些建筑工程公司，而非胶粘剂公司，估计技术含量相对应该比较有限，就像有些公司自行配置低端的环氧双组分胶差不多。而且差不多每个省都有类似的公司。

最后回到电子胶水，其实这样看来我们目前常见的电子胶粘剂估计都应该属于非结构胶粘剂的范畴，我目前接触到的单组分热固化的环氧树脂胶里面用钢片搭接测试剪切强度，最高的基本也只能做到15MPa了，而且是在粘接面积比较大的情况下。而往往在实际应用中粘接面积都是比较小的，所以基本也很难起到结构胶粘剂的作用了。但是大家看电子胶水的TDS资料中依然也是会有很多强度指标的，但基本都是按ASTM和国标来测试的。特殊用途点会单独列明相应强度的，例如贴片胶就会标识出不同大小元器件如0806、0604、0402的推力数据，而一些固晶胶，也会标识不同大小的晶片的扭力或者推拉力数据。大家可以看看乐泰的贴片红胶或者ablestick的固晶胶的技术资料了解一下。

PRODUCT DESCRIPTION

Hysol® OS2800 is a fast curing, water-white epoxy casting system designed specifically for the encapsulation of seven segment displays. This new system will cure rapidly at temperature above 100°C and can be colored by the addition of specific dye concentrates, AC7113 red, AC7044 green and AC7112 yellow. AC7117 is recommended as a standard diffusant for OS2800.

TYPICAL APPLICATIONS

Optoelectronic Liquid Encapsulant

PROPERTIES OF UNCURED MATERIAL

OS2800 OS2800

Part A Part B

Color Clear Blue Clear

Lt. Yellow

Specific Gravity @ 25°C, (77°F) 1.15 1.18

Gm/cc ASTM D1475

Shelf Life @ 25°C, (77°F), months 12 6

Typical Value

Viscosity @ 25°C, (77°F)

ASTM D2393

Brookfield RVF , cP 6,500 225

PHYSICAL PROPERTIES, CURED MATERIAL

OS2800

Color Water-white

Coefficient of Thermal Expansion, in/in/°C

ASTM D3386 70 x 10-6

Glass Transition, T(g),°C 130

Moisture Absorption, % (ASTM D570)

24 hours @ 115°C 1.88

7 days @ 25°C 0.45

Hardness, Shore D, (ASTM D2240) 90

Tensile Strength, psi, (ASTM D790) 10,000

Flexural Strength, psi (ASTM D790) 20,000

Cured Electrical Properties

25°C

K D

100 Hz 3.17 0.006

1 kHz 3.13 0.011

10 kHz 3.05 0.014

100 kHz 2.96 0.012

K = Dielectric constant by ASTM D150

D = Dissipation Factor by ASTM D150

Performance Properties

T-Cycles (55°C-+100°C)

<1% failures 1,000 cycles

Light Transmittance 400 nm 800 nm

Initial 75% 90%

After 500 hours @ 121°C 56% 90%

Handling

(Recommended mix ratio and typical mixed properties)

Mix Ratio, parts by weight* 100/106

Pot Life, Hours 5-6

Initial Mixed Viscosity @ 25°C, cP 1100

*Mix ratio of these materials is fixed by their chemistry. Any attempt to increase or decrease the cure rate by adding more or less hardener will result in degraded materials.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or their strong oxidizing materials

Cure Schedule

(Recommended for optimum properties)

Recommended Cure 4 hours @ 105°C

Note: Larger parts may require 2 hours @ 85°C pre-cure to minimize exotherm. If exotherm temperature exceeds 140°C, severe yellowing will occur. Typical cured properties were determined using the recommended cure schedule. Some differences in properties may occur with the alternate or other cure schedules.

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol OS2800 TDS (32.3 KB, 125 次)

近日在论坛有看到网友咨询胶粘剂的防水等级事宜，其实以前关注比较多的是电子封装和组装的胶粘剂，基本上也比较少涉及， 听得比较多的反而是防火等级，即UL-94V0等认证，而关于防水这一块几乎很少有客户要求。现在比较热门的行业类似LED电源灌封，尤其是用于户外的产品，貌似对这一块都提出了相应的要求，具体可以点击参看此帖。 后来在网上搜寻了一下，找到了关于防水等级的资料，但好像不知针对胶粘剂的，贴在这里大家参考一下：

国际工业标准防水等级IPX的分级标准

国际工业防水等级标准IPX和日本工业防水标准的JIS等级是一致的，共分为0-8的9级，录存于此。

0级 无保护
1级 可以消除垂直落下水滴的有害影响
2级 对与垂直方向在15度以内落下的水滴有防护作用
3级 可以消除与垂直方向在60度的喷雾状水滴的有害影响
4级 可以消除从不同方向飞溅水滴的有害影响
5级 可以消除对各方向喷嘴喷射水流的有害影响
6级 可以消除对各方向喷嘴强力喷射水流的有害影响
7级 顶部距离水面0.15—1米，连续30分钟，性能不受影响，不漏水
8级 顶部距离水面1.5—30米，连续30分钟，性能不受影响，不漏水

防尘等级(第一个X表示)
0：没有保护0：没有保护
1：直径50mm的物体不得完全进入壳内
2：直径12.5mm的物体不得完全进入壳内
3：各垂直面在60度范围内淋水，无有害影响
4：直径1.0mm的物体完全不得进入壳内
5：不能完全防止尘埃进入，但进入的灰尘量不得影响设备的正常运行，不得影响安全。
6：无灰尘进入

防水等级(第二个X表示)
1：垂直方向滴水无有害影响
2：当外壳的各垂直面在15度范围内倾斜时，垂直水滴无有害影响
3：直径2.5mm的物体完全不得进入壳内
4：向外壳各个方向溅水无有害影响
5：向外壳各个方向喷水无有害影响
6：向外壳各个方向强烈喷水无有害影响
7：短时间浸水无影响
8：持续潜水无影响

例：防水盒防水性标示为IP65，表示产品可以完全防止粉尘侵入及可用水冲洗无任何影响

Product Description

Hernon  Dissipator  746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips.

Typical Applications

Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.

Typical Properties (Uncured)

Property Value

Chemical type Modified acrylic

Appearance White paste

Viscosity at 77ºF (25ºC), Cp  at 2.5 rpm    500,000 to 2,000,000

at 20 rpm     300,000 to 800,000

Specific gravity 1.64

Flash point See MSDS

Typical Properties (Cured)

Physical Properties

Property Value

Coefficient of thermal expansion, ASTM D696 (K-1)    69 x 10-6

Coefficient of thermal conductivity,ASTM C 177, W/(m·K)  0.76

Tensile Strength at break, ISO 527, N/mm² (psi)  12.8 (1,860)

Elongation at break, ISO 527, %   0.92

Young’s Modulus, N/mm² (psi) 2,760 (400,000)

Temperature Range, ºC (ºF) -55 to 150 (-65 to 300)

Electrical Properties

Property Value

Dielectric Strength, IEC 60243-1, kV/mm  26.7

Dielectric Constant   IEC 60250 @ 100 Hz  6.49

1kHz    5.87

1 MHz  5.23

Dissipation Factor  IEC 60250  @ 100 Hz  0.10

1 kHz   0.04

10 kHz  0.03

Volume Resistivity, Ω·cm, IEC 60093   1.3 × 1012

Surface Resistivity, Ω, IEC 60093      5.1 × 1013

Typical Curing Performance

Dissipator 746, when used with Hernon EFActivator 63, fixtures at room temperature in less than five minutes.

Typical Cured Performance

Cured for 24 hours @ 22ºC.

Steel lap-shear specimens (EF Activator 63 applied to one surface), Shear Strength, ISO 4587

Property Value    Shear Strength, N/mm² (psi) ≥ 6.9 (≥ 1000)

Typical Environmental Resistance

Cured for 72 hours @ 22ºC.

steel lap-shear specimens (EF Activator 63 applied to one surface), Shear Strength, ISO 4587

Chemical/Solvent Resistance

Aged under conditions indicated for 720 hours and  tested at 22ºC.

Chemical/Solvent Temp (ºC) % of Initial Strength

Air              87          140

Water           87           75

Freon TF         87          85

Thermal Cycle Resistance

Bonded aluminum to epoxyglass lapshears cured 72hours using EF Activator 63 on 1 side were subjected to thermal cycling of 15ºC to 100ºC with a ramp time of 30 minutes. No loss in strength occurred after 1,000 hours of cycle time.

General Information

For safe handling information on this product, consult the Material Safety Data Sheet (MSDS).

Directions for use

1. For best performance bond surfaces should be clean and free from grease.

2. Use applicator to apply the activator to the surface to be bonded.

3. After the solvent evaporates, the active ingredients will appear wet, and will remain active for up to 2 hours after application. Contamination of the surface before bonding should be prevented.

4. Apply adhesive to the unactivated surface.

5. Secure the assembly, and wait for the adhesive to fixture (approximately 5 minutes) before any further handling. Full cure occurs in 4 to 12 hours.

6. The amount of adhesive applied to the part or heat sink should be limited to the amount necessary to fill the bond and just enough to give a small fillet.

7. The dispensing or application of the adhesive should be done as to minimize air entrapment within the bondline.

Device Removal/Repair

Components or devices with this thermally conductive adhesive can be removed while hot using heat from a hot air jet. Bond strength decreases at approximately 65ºC to 93ºC allowing components to be removed with lower shear forces. Method of removal/repair should be specifically determined due to the variety of components or devices bonding behavior.

Storage

Dissipator 746 should be stored in a cool, dry location in unopened containers at a temperature between 46ºF to 82ºF (8ºC to 28ºC) unless otherwise labeled. Optimal storage is at the lower half of this temperature range. To prevent contamination of unused material, do not return any material to its original container.

Dispensing Equipment

Hernon offers a complete line of semi and fully automated dispensing equipment. Contact Hernon Sales for additional information.

These suggestions and data are based on information we believe to be reliable and accurate, but no guarantee of their accuracy is made. HERNON MANUFACTURING, INC. shall not be liable for any damage, loss or injury, direct or consequential arising out of the use or the inability to use the product. In every case, we urge and recommend that purchasers, before using any product in full scale production, make their own tests to determine whether the product is of satisfactory quality and suitability for their operations, and the user assumes all risk and liability whatsoever, in connection therewith. Hernon’s Quality Management System for the design and manufacture of high performance adhesives and sealants is registered to the ISO 9001 Quality Standard.

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  Hernon Dissipator 746 (96.4 KB, 88 次)

PRODUCT DESCRIPTION

384™ provides the following product characteristics:

Technology：Acrylic

Chemical Type： Modified acrylic

Appearance (uncured) ：White to off-white pasteLMS

Components： One component – requires no mixing

Viscosity： High

Cure ：Activator

Cure Benefit ：Room temperature cure

Application： Bonding

Strength ：Medium

384™ is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and service repair. In high pot applications this product should be limited to a maximum of 500 volts. Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity@ 25 °C 1.64

Flash Point – See MSDS

Viscosity, Brookfield – HBT, 25 °C, mPa•s (cP):

Spindle TE, speed 2.5 rpm, Helipath 500,000 to 2,250,000LMS

Spindle TE, speed 20 rpm, Helipath 300,000 to 800,000LMS

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion, ISO 11359-2, K-1  69×10-6

Coefficient of Thermal Conductivity, ISO 8302, W/(m•K) 0.757

Elongation, at break, ISO 527-3, % 0.9

Tensile Strength, at break, ISO 527-3 N/mm² 13    (psi) (1,800)

Young’s Modulus N/mm² 2,800  (psi) (400,000)

Electrical Properties:

Volume Resistivity, IEC 60093, Ω•cm 1.3×1012

Surface Resistivity, IEC 60093, Ω 5.1×1013

Dielectric Breakdown Strength, IEC 60243-1, kV/mm 26.7

Dielectric Constant / Dissipation Factor, IEC 60250:

100-Hz 6.48 / 0.1

1-kHz 5.86 / 0.04

1-MHz 5.22 / 0.03

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

Cured for 24 hours @ 22 °C, Activator 7387™ on 1 side

Lap Shear Strength, ISO 4587: Steel N/mm² ≥5.2LMS (psi) (≥754)

TYPICAL ENVIRONMENTAL RESISTANCE

Cured for 72 hours @ 22 °C, Activator 7387™ on 1 side Lap Shear Strength, ISO 4587:Steel

Chemical/Solvent Resistance

Aged under conditions indicated and tested @ 22 °C.

% of initial strength  Environment °C 720 h

Air 87 140

Water 87 75

Freon TF 87 85

Thermal Cycle Resistance

Bonded aluminum to epoxy glass lap shears cured 72 hours using Activator 7387™ on 1 side were subjected to thermal cycling of 15°C to 100°C with a ramp time of 30 minutes. No loss in strength occurred after 1,000 hours of cycle time.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet (MSDS).

Directions for use

1. For best performance bond surfaces should be clean and free from grease.

2. Use applicator to apply the activator to the surface to be bonded.

3. After the solvent evaporates, the active ingredients will appear wet, and will remain active for up to 2 hours after application. Contamination of the surface before bonding should be prevented.

4. Apply adhesive to the un activated surface.

5. Secure the assembly, and wait for the adhesive to fixture (approximately 5 minutes) before any further handling. Full cure occurs in 4 – 24 hours.

6. The amount of adhesive applied to the part or heat sink should be limited to the amount necessary to fill the bond and just enough to give a small fillet.

7. The dispensing or application of the adhesive should be done as to minimize air entrapment within the bondline.

Device Removal/Repair

Components or devices bonded with 384™ can be removed while hot using heat from a hot air jet. Bond strength decreases at approximately 65 °C to 93 °C allowing components to be removed with lower shear forces. Method of removal/repair should be specifically determined due to the

variety of components or devices bonding behavior.

Loctite Material SpecificationLMS

LMS dated October-24, 2003. Test reports for each batch are available for the indicated properties. LMS test reports include selected QC test parameters considered appropriate to specifications for customer use. Additionally, comprehensive controls are in place to assure product quality and consistency. Special customer specification requirements may be coordinated through Henkel Quality.

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than 8 °C can adversely affect product properties. Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

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  loctite 384 TDS (60.6 KB, 95 次)

今日有人提到loctite 3703的替代品问题，据说是用于四角邦定用途的。翻墙下载了一份TDS技术资料来学习了一下。

从资料显示此款产品是Acrylated urethane聚氨酯丙烯酸酯类型的，可由紫外线及可见光进行固化，尤其适用于软硬PVC和polycarbonate的粘接，资料显示此产品具有一定的触变性，但没有标识触变指数是多少。从资料显示并没有专门用于四角邦定，我印象中乐泰用于四角邦定的胶是另外几个型号，有些还是热固化的而不是紫外线固化的。

下面摘录一些数据如下：

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  loctite 3703 TDS (62.6 KB, 320 次)

大年初八开工，没什么紧急的事情要处理，在网上找到了汉高公司新发行的《汉高电子部 电子组装解决方案》，去年曾找到过此份资料的英文版《Henkel Electronics Assembly Solutions》，大约6~7M，今天很偶然的找到了一份中文版，但文件却有大概60M。这里面基本上涵盖了汉高电子胶粘剂所有的行业和相关型号，有兴趣的朋友可以下载学习一下，下面简要的列明一下目录：

组装市场解决方案
汽车电子设备 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 – 7
消费与工业电子设备. . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 9
国防和航空电子设备. . . . . . . . . . . . . . . . . . . . . . . . 10 – 11
手持式通信和计算设备. . . . . . . . . . . . . . . . . . . . . . 12 – 13
绿色和便携式能源 (GAPE) . . . . . . . . . . . . . . . . . . . . . . . 14
LED照明 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
医疗电子设备 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 – 17
射频识别 (RFID) . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 – 19
无线电信设施 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 – 21
组装材料
粘合剂. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 – 31
显示器材料 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 – 35
油墨和涂料 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 – 37
微电子灌封材料(CSP底部填充剂). . . . . . . . . . . . . . . 38 – 39
微电子灌封材料(COB包封材料) . . . . . . . . . . . . . . . . 40 – 42
线路板保护 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 – 51
焊接材料. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 – 57
贴片胶 (Chipbonder™). . . . . . . . . . . . . . . . . . . . . . . 58 – 59
导热材料. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 – 63
附录 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
索引 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 – 68

Assembly Market Solutions
Automotive Electronics 6 – 7
Consumer & Industrial Electronics 8 – 9
Defense & Aerospace Electronics . 10 – 11
Handheld Communications & Computing 12 – 13
Green and Portable Energy (GAPE) . 14
LED Lighting 15
Medical Electronics . 16 – 17
Radio Frequency Identification (RFID) 18 – 19
Wireless DataCom Infrastructure 20 – 21
Assembly Materials
Adhesives . 22 – 31
Display Materials . 32 – 35
Inks & Coatings . 36 – 37
Micro-Encapsulants (CSP Underfills) 38 – 39
Micro-Encapsulants (COB Encapsulants) . . . . . .40 – 42
PCB Protection 43 – 51
Solder Materials 52 – 57
Surface Mount Adhesives (Chipbonder™) 58 – 59
Thermal Management Materials 60 – 63
Appendix 64
Index . 65 – 68

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  汉高电子用胶彩页 (4.7 MB, 49 次)
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