现在想做太阳能浆料的太多了，当然太阳能浆料有利润，而大家都是趋利的，所以一切似乎都很正常。可最基本的传统浆料都没做好或者就没搞过浆料就来搞技术升级奇快的太阳能浆料，想以此一改颓势而发大财我之未解。
太阳能浆料已发展了10年，一个轮回了。到现在可以说里面的变化那些早搞的人都找的差不多了，性能完全倒了极限。而这个时候众多的老师、风投公司、铝粉厂、电池厂、有资金的、有市场的、什么似乎都有而实际没有的等等都大手笔的要做铝浆、正银。在5年前你做，那时候铝浆里面的变化还很多，还有很多性能提升的空间，你研究搞一下也许会有不同于那些先期搞的突破，你也许还可以赚些钱，五年前的价格可是在700左右的。可现在别人都已穷尽了变化，可以说是在找变化之外的变化，而你却是要才开始研究才开始找变化，等你找完了变化，别人变化之外的变化也就找到了，你怎么和别人比，我之未解。
浆料名副其实的“然”，而“然”住了这么多人，实难解也。

到目前为止传统的浆料那种浆料都没有如太阳能浆料和基体有多种相互作用，提高开压、降低复合、提高长波响应等而浆料最基本的性能当然也都要具备，而这几种相互作用的变化只有多年的沉淀才能体会其中微妙的变化，后来者你先花时间慢慢体会吧。
电池却是有许多新技术，但都是基于以前技术的基础的，所以相应所需要的浆料也是基于以前的或者说以前一直做的才更清楚新技术需要什么样的浆料。
后来者慢慢找变化吧，找清了再说。

去年整理了关于胶粘剂粘度的文章，参看《胶粘术语—粘度（黏度Viscosity ）》，不过近日又碰到有客户咨询胶粘剂的情况，其中一项指标是粘度在80dpa.s左右。初看到dpa.s这个单位还是一位又是客户的笔误，因为最常见的单位是mpa.s或者cps或者是pa.s。不过去网上查了一下，原来dpa.s也是其中的一个单位。在查询的过程中又看到了一个粘度的单位poise，其实在《胶粘术语—粘度（黏度Viscosity ）》里面有关于poise的解释：“黏度的基本单位为 ”poise”。我们定义一材料在剪力为1 达因每平方公分、剪速为1 sec-1 下的黏度为100 poise。测量黏度时，你可能会遭遇到黏度的单位为 “Pa˙s” 或 “mPa˙s” 的情况，此为国际标准系统，且有时较被公制命名所接受。1Pa˙s 等于10 poise；1 mPa˙s 等于1 cp”，关于此几个单位的换算关系如下：

dpa.s 是decipascal-seconds 的缩写，是粘度单位

dpa.s单位一般用于高粘度表示，1dPa.s=100cps ,

1Pa.s=1000 cps,

1 m Pa.s=1 cps,

10dPa.s=1Pa.s

P(poise),cP(centi poise),

Pa.s(pascal-seconds),dPa.s(decipascal-seconds),

mPa.s(millipascal-seconds)

Pa.s=1000cP=1000mPa.s=10P=10dPa.s

其实关于这几个单位里面的P有些应该是小写，有些应该是大写，有时候是帕斯卡的英文缩写，有时是poise的缩写，查了一下poise的因为释义为平衡的意思。 全文 »

今天收到一位客户咨询一款黑色的环氧胶的需求咨询，其中有一个新的要求和参数是第一次碰见，客户要求该胶水的“od值大于3”。 这个参数还是我第一次碰到，开始我还以为是客户的笔误，但后来到网上上查询了一下，倒还真有OD值这样的一个专业术语，摘录如下：

OD值

OD是optical density（光密度）的缩写，表示被检测物吸收掉的光密度，是检测方法里的专有名词，检测单位用OD值表示，1OD＝1og（1／trans），其中trans为检测物的透光值。

光通过被检测物，前后的能量差异即是被检测物吸收掉的能量，特定波长下，同一种被检测物的浓度与被吸收的能量成定量关系。

检测单位用OD值表示， OD是optical density（光密度）的缩写，表示被检测物吸收掉的光密度， OD＝1og（1／trans），其中trans为检测物的透光值。

检测结果是阴，其中有个OD值为0.001，C.O（临界值）0.1500。

OD值>C.O（临界值）为阳性

OD值<C.O（临界值）为阴性

补充：在乙肝六项中抗-HBe、抗-HBc。

OD值＞Cut-off为阴性，OD值≤ Cut-off为阳性

从这里的定义和网上找到的资料来看，这个参数往往是用在乙肝检测及其他生化检测项目上面，似乎和胶粘剂没啥直接关系，类似的测试方式似乎也不适用于胶粘剂。后来又找到了一段更详细的解释，但也是用于生化方面的： 全文 »

Product Description

Hernon ReAct 727 is a tough acrylic adhesive designed primarily for securing of ceramic permanent magnet segments in motor magnet bonding applications. This adhesive has also found wide acceptance in a variety of structural bonding applications due to its versatile performance capabilities.

ReAct 727 has demonstrated the ability to provide high tensile strength while maintaining excellent product flexibility. This results in tough, durable bonds with outstanding impact and peel resistance. This tough acrylic is a single component, room temperature curing adhesive which is used in conjunction with Hernon EF Activator 56.

Product Benefits

Improved Reliability

• • High impact and shock resistance
• • Temperature resistance: -40 to 300°F (-40 to 149°C)
• • Good gap filling properties.
• • Excellent adhesion to a variety of surfaces.
• • Consistent rate of cure from 60 to 100°F (16 to 38°C)
• • Consistent bond strength 全文 »

Product Description

Hernon Dissipator 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap.

Dissipator 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature of produces a constant gap of 0.005 in. to 0.006 in. between components.

Product Benefits

No mixing required (eliminates errors in mixing ratio)

Room temperature cure. No heat required

Eliminates screws and rivets for assembly

Eliminates the air space between components

High k factor for heat conductive application 全文 »

DESCRIPTION

Multi-Cure® 984-LVUF is a highly fluorescing, single-component, 100%-solids conformal coating specifically formulated for rapid room-temperature cure when exposed to UV light.  984-LVUF retains high fluorescence after curing.  Thin-layer coatings cure almost instantly to a depth of 7 mils and fluoresce upon exposure to “black” light.  Multi-Cure® 984-LVUF also exhibits adhesion to a variety of metal, ceramic, and glass-filled epoxy surfaces.  984-LVUF is a moderately low-viscosity coating which can be cured by exposure to UV light and secondarily cured with heat for shadowed areas on densely populated circuit boards.  This product is in full compliance with the RoHS Directives 2002/95/EC and 2003/11EC.

Multi-Cure® 984-LVUF is approved to Military Specification MIL-I-46058-C, Type AR, ER, and UR (QPL#576-90).  984-LVUF meets “NSA” hydrolytic stability (reversion) requirements.

Multi-Cure® 984-LVUF is qualified to IPC-CC-830-B.

Multi-Cure® 984-LVUF is UL recognized (UL 746C), rated indoor/outdoor to 120°C, and 94V-0 flame class. 全文 »

Product Description

Hernon Polycure 744 is a single component, 100% solid system formulated for use on printed circuit boards. This coating can be cured in seconds by high intensity UV light. Low heat (10 minutes at 250ºF) can be used for curing the shaded area. The component may be removed for repair using conventional repair methods of abrasion or localized heat. The repaired part may be recoated off-line using an inexpensive UV light.

Product Benefits

• • Easy to use.
• • Cost effective.
• • Single component, no mixing.
• • 100% solid system (no solvents).
• • Short cure cycles.
• • Dual curing mechanism for shaded area.

全文 »

Product Description

Hernon Conformal Coating 739 is formulated to provide high performance and rapid cure. Conformal Coating 739 will provide an excellent bond, high light transmittance and a refractive index similar to glass. Exposure to high intensity UV light will cure the coating to a hard, dry surface.

Product Benefits

• • Easy to use.
• • Cost effective.
• • Single component, no mixing.
• • 100% solid system (no solvents).
• • Short cure cycles.

Typical Properties (Uncured)

Property Value

Resin Modified acrylic

Appearance Clear liquid

Viscosity @ 25ºC, cP 100 to 300

Specific gravity 1.11

Flash point See MSDS 全文 »

Product Description

Hernon Tuffbond 394 is a single component, high temperature resistant, heat activated epoxy. It cures to a high performance thermoset system with excellent adhesion properties to a wide variety of substrates. The rapid curing mechanism of 1.5 minutes at a bondline temperature of 150ºC makes it ideal for production line use. Tuffbond 394 will change from amber-yellow to a reddish brown upon cure.

Bonding the voice coil to the cone has been a challenge for engineers, specifically when the adhesive temperature resistance requirement is above 200ºF (93ºC). Two component epoxy has been most commonly used for this application, but limitations such as mixing ratio, cure speed, potential solidification in equipment and static mixers and the need for equipment flushing solvents have made Tuffbond 394 more practical. 全文 »

最近又接触到很多导电银胶银浆的需求咨询，综合了一下，客户原来使用的基本还是日系企业的产品。关于银浆的市场情况，大家可以参看以前电子胶水论坛版主洋梨果发表的一篇分析报告《国内外导电银粉、银浆、导电胶市场状况》，里面提到的“银粉、银浆料生产厂家主要集中在日本和美国。日本有住友金属、村田制作所，田中贵金属、福田金属、日本昭荣化学、东芝化学、德力化学、日本制铁、同和矿业、藤仓化学、富士化研、京都ELEX、新日本化金、ニホンハニダ株式会社、ナシクス株式会社、美国Ferro、美国Acheson、英国Esl、美国杜邦、美国Goldsmith、英国Johnson metthey、美国metech等”。

近日又碰到了两个日系品牌的导电胶产品，一个其实是大家比较熟悉的味之素公司，即ajinomoto公司，顾名思义这家公司最是做味精起家的，但是在电子胶水厂家比较熟悉的还是它的固化剂产品类似PN-23,PN-40J,PN-H等产品。而听说味之素有胶水产品是三年前富士康有一个项目据说使用的的就是味之素的导电银胶，当时要求的是在小于100度半个小时固化，当时国内也没能找到替代品。前日又有一个客户咨询到此产品的替代产品，我查了一下味之素做胶的公司，应该叫Ajinomoto Fine-Techno Co., Inc.，官方网址是：www.aft-website.com，大家可以上去看看他们的产品线，除了导电胶还有不少其他产品的。摘录如下：“Features：the adhesives of this type cure in 30 minutes at 100degC, unequaled by any other one-component epoxy resin electrically conductive paste. They can be applied to heat-sensitive components. This curing and the other bonding steps can be unified into one process.They cure within one minute in a medium temperature range of 150degC, contributing to an increase in efficiency of production processes through acceleration of curing time”“ Uses：Replacement of solder，Die attaching adhesive，CA-40         CA-45       CA-46…”，可到此链接了解详情：https://www.aft-website.com/en/products/04/CA/。 全文 »