今天在家看了这篇《Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers》文章， 这是将表面贴装胶粘剂开发另一种用途的设想，其中使用的胶粘剂产品都是乐泰的牌号，分别是LOCTITE 3509、3615和3621，其中3509官网没有找到技术资料，后面两种都是用于SMT贴片用途的，但是很在国内市场不是特别常见。 感兴趣的朋友可以到博文末尾下载查看之！

Prawin Paulraj* & Brian K. Paul

*Corresponding author address:

7871 SW 173^rd Pl.

Beaverton,OR97007

Phone: 503-550-5690

Fax: 503-627-5538

E-mail: paulraj_prawin@yahoo.com

Abstract

This paper reports the feasibility of using surface mount adhesives to produce low temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses that eliminate channel laminae, resulting in approximately 50% material savings over traditional methods. An assembly process using adhesive dispense and cure is outlined to produce leak-free devices. Optimal fill ratios were determined to be between 1.1 and 1.25. Bond strength investigation reveals robustness to surface conditions and a bond strength of 5.5-8.5 MPa using a 3X safety factor.  Dimensional characterization reveals a two sigma (95%) post-bonded channel height tolerance under 10% after bonding.  Patterning tolerance and surface roughness of the laminae faying surfaces were found to have a significant influence on the final post-bonded channel height. Leakage and burst pressure testing on several samples has established confidence that adhesive bonding can produce leak-free joints.  Operating pressures up to 413 kPa have been satisfied equating to tensile pressure on bond joints of 1.9 MPa.  Higher operating pressures can be accommodated by increasing the bond area of devices.

Keywords: Adhesive bonding, microchannel array, microlamination, low temperature heat exchanger.

1.      Introduction

Microchannel process technology (MPT) is the use of microchannel arrays for the bulk processing of mass and energy.  Although MPT devices can be on the order of meters in dimension, MPT devices include critical microchannel dimensions ranging from 100 µm to several mm [1].  One of the major advantages of MPT is the high surface area to volume ratios compared to conventional fluidic technology.  These ratios allow accelerated rates of heat and mass transfer within microchannels due to shorter diffusional distances.  Consequently, microchannels provide the ability to reduce the size and weight of energy and chemical systems [2].  Applications of MPT include portable heat exchange, distributed climate control, solvent separation, fuel processing, and at-home hemodialysis among others [1]; [3].

One growing area for MPT application is low-temperature thermal management, such as the cooling of consumer electronics.  The improved performance and shrinking dimensions of integrated circuits have resulted in the need to dissipate ever-increasing amounts of power. Today, microprocessors require heat dissipation of 50-75W for standard applications, and well in excess of 100W for enthusiast and gamer applications. While the thermal dissipation requirements of microprocessors have steadily increased, the maximum allowable temperature of these devices has remained relatively steady around 65-85°C, limited by many factors including ergonomics and safety.  Due to these limits, several researchers have shown that the theoretical maximum for air cooling of electronic components is in the range of 100 -130 W [4]; [5].

Traditional strategies for increasing heat dissipation have centered on reducing the thermal resistance of the heat sink assembly by increasing the convective surface area through finned surfaces and the use of fans to increase the convective heat transfer coefficient.  However, increases in surface area are usually accompanied by increases in mass and cost. Alternatively, microchannel arrays provide a means of increasing surface area per unit mass, while increasing convective heat transfer coefficients [6].

To further reduce thermal resistance, the ideal microchannel heat sink would be made of a high thermal conductivity material. Copper has the highest thermal conductivity among engineering materials, and has been extensively used for both passive and active heat sinks including microchannel heat exchangers for the cooling of laser diode arrays [7]; [8]. Aluminum alloys offer several advantages over copper alloys as a heat exchanger material. While the thermal conductivity of aluminum is not as good as copper (though comparable), aluminum alloys are light-weight (almost 3x lighter than copper) and are lower in material cost.  Aluminum also forms a very stable and tenacious oxide that is resistant to surface corrosion.  For these reasons, 300X series aluminum alloys are widely used in the traditional heat exchanger industry. Aluminum microchannel heat exchangers have not been reported for application in the electronics industry.  This is largely due to challenges associated with bonding of aluminum microchannel arrays.

Beyond the electronics industry, other low temperature heat exchanger applications require low thermal conductivity materials such as stainless steel. In some heat exchanger applications, such as regenerators within heat engines, low thermal conductivity metals such as stainless steel are actually desirable [9]. For a given microchannel heat exchanger, it has been shown that an optimal thermal conductivity exists that minimizes axial conductive transfer down microchannel fins without significantly penalizing conductive heat transfer across the fin in the thickness direction [10].  Maranzana et al. [10] also showed that in low-temperature (below 100°C) countercurrent microchannel heat exchanger applications, a stainless steel heat exchanger can be as much as 20% more efficient than a copper one.

In the context of low temperature heat exchange, it is desirable to find fabrication methods that can be applied to many materials. Fabrication methods used for microchannel arrays are based on microchannel lamination [1], or microlamination architectures involving the patterning, registration and bonding of thin foils of metal called laminae.  Lamina patterning generally includes either surface machining, through cutting or forming processes.  Once patterned, the laminae are registered relative to each other and bonded together in a stack to make a monolithic device. Typical patterning and bonding steps for microlaminated components are chemical etching and diffusion bonding.  The objective of this paper is to introduce a microlamination architecture capable of meeting the requirements for low temperature heat exchanger applications across a wide variety of materials.

很久没看纯英文的学术文章，看完这篇还真花了不少时间，呵呵！ 感兴趣的朋友可以下载看看：

  Metal-Microchannel-Lamination (185.5 KB, 15 次)
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近日有个做音圈的客户使用乐泰3106做中心胶用途，据反映感觉粘接力不太够而且觉得硬度也不够。 给其推荐了两款产品重新尝试，在乐泰官网下载了这份TDS资料，摘录如下，感兴趣的朋友可以去下载PDF版本：

PRODUCT DESCRIPTION
LOCTITE® 3106™ provides the following product
characteristics:
Technology Acrylic
Chemical Type Acrylated urethane
Appearance (uncured) Transparent liquidLMS
Components One component – requires no mixing
Viscosity Medium, thixotropic
Cure Ultraviolet (UV)/ visible light
Cure Benefit Production – high speed curing
Application Bonding
Flexibility Enhances load bearing & shock
absorbing characteristics of the bond
area.
LOCTITE® 3106™ is primarily designed for bonding rigid or
flexible PVC to polycarbonate where large gap filling
capabilities and flexible joints are desired. The product has
shown excellent adhesion to a wide variety of substrates
including glass, many plastics and most metals. The thixotropic
nature of LOCTITE® 3106™ reduces the migration of liquid
product after application to the substrate.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.08
Refractive Index 1.48
Flash Point – See MSDS
Viscosity, Brookfield – RVT, 25 °C, mPa·s (cP):
Spindle 4, speed 20 rpm 3,500 to 7,500LMS
TYPICAL CURING PERFORMANCE
LOCTITE® 3106™ can be cured by exposure to UV and/or
visible light of sufficient intensity. To obtain full cure on
surfaces exposed to air, radiation @ 220 to 260 nm is also
required. The speed of cure will depend upon the UV intensity
and spectral distribution of the light source, the exposure time
and the light transmittance of the substrates.
Stress Cracking
Liquid adhesive is applied to a polycarbonate bar 6.4 cm by
13 mm by 3 mm which is then flexed to induce a known stress
level.
Stress Cracking, ASTM D 3929, minutes:
7 N/mm² stress on bar >15
12 N/mm² stress on bar 13 to 14

Fixture Time
Fixture time is defined as the time to develop a shear strength
of 0.1 N/mm².
UV Fixture Time, Glass microscope slides, seconds:
Black light, Zeta® 7500 light source:
6 mW/cm², measured @ 365 nm ≤15LMS
UV Fixture Time, Polycarbonate to PVC, seconds:
Metal halide bulb, Zeta® 7400:
30 mW/cm², measured @ 365 nm, <5
Electrodeless, H & V bulbs:
50 mW/cm², measured @ 365 nm, <5
Electrodeless, D bulb:
50 mW/cm², measured @ 365 nm, <5
Depth of Cure vs. Irradiance (365 nm)
The graph below shows the increase in depth of cure with time
at 50mW/cm² – 100mW/cm² as measured from the thickness
of the cured pellet formed in a 15mm diameter PTFE die.
Note: When exposed to a V Bulb at irradiances of 50 and 100
mW/cm² for 30 seconds, a depth of cure greater than 13 mm
was achieved. The performance for medium pressure Hg will
be similar to Electrodeless system, H bulb

TYPICAL PROPERTIES OF CURED MATERIAL
Cured @ 30 mW/cm², measured @ 365 nm, for 80 seconds using
a glass filtered metal halide light source
Physical Properties:
Shore Hardness, ISO 868, Durometer D 53
Refractive Index 1.5
Water Absorption, ISO 62, %:
2 hours in boiling water 3.18
Elongation, at break, ISO 527-3, % 250
Tensile Modulus, ISO 527-3 N/mm² 255
(psi) (37,000)
Tensile Strength, at break, ISO 527-3 N/mm² 18.6
(psi) (2,700)
Electrical Properties:
Surface Resistivity, IEC 60093, Ω∙cm 9.2×1014
Volume Resistivity, IEC 60093, Ω·cm 7.7×1014
Dielectric Breakdown Strength, , kV/mm 26
Dielectric Constant / Dissipation Factor, IEC 60250:
100-Hz 5.17 / 0.04
1-kHz 5.01 / 0.02
1-MHz 4.61 / 0.04
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured @ 30 mW/cm², measured @ 365 nm, for 80 seconds using
a metal halide light source, (samples with 0.5 mm gap).
Lap Shear Strength, ISO 4587:
Polycarbonate N/mm² *5.2
(psi) (750)
* substrate failure

TYPICAL ENVIRONMENTAL RESISTANCE
Cured @ 30 mW/cm², measured @ 365 nm, for 80 seconds using
a metal halide light source, (samples with 0.5 mm gap).
Lap Shear Strength, ISO 4587:
Polycarbonate:
0.5 mm gap
Chemical/Solvent Resistance
Aged under conditions indicated and tested @ 22 °C.
% of initial strength
Environment °C 2 h 24 h 170 h
Boiling water 100 * 100 ——– ——–
Water immersion 49 * 100 ——– ——–
Water immersion 87 * 100 ——– ——–
Isopropanol immersion 22 ——– 95 ——–
Heat/humidity 38 ——– ——– * 100
Heat Aging
Lap Shear Strength, ISO 4587, % of initial strength:
Polycarbonate:
Aged @ 71 °C for 170 hours *100
Aged @ 71 °C for 340 hours *100
Aged @ 93 °C for 170 hours *100
Aged @ 93 °C for 340 hours *100
* substrate failure
GENERAL INFORMATION
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Where aqueous washing systems are used to clean the
surfaces before bonding, it is important to check for
compatibility of the washing solution with the adhesive. In
some cases these aqueous washes can affect the cure and
performance of the adhesive.
This product is not normally recommended for use on plastics
(particularly thermoplastic materials where stress cracking of
the plastic could result). Users are recommended to confirm
compatibility of the product with such substrates.
Directions for use
1. This product is light sensitive; exposure to daylight, UV
light and artificial lighting should be kept to a minimum
during storage and handling.
2. The product should be dispensed from applicators with
black feedlines.
3. For best performance bond surfaces should be clean and
free from grease.
4. Cure rate is dependent on lamp intensity, distance from
light source, depth of cure needed or bondline gap and
light transmittance of the substrate through which the
radiation must pass.
5. Recommended intensity for cure in bondline situation is 5
mW/cm² minimum (measured at the bondline) with an
exposure time of 4-5 times the fixture time at the same
intensity.

6. For dry curing of exposed surfaces, higher intensity UV is
required (100 mW/cm²).
7. Cooling should be provided for temperature sensitive
substrates such as thermoplastics.
8. Crystalline and semi-crystalline thermoplastics should be
checked for risk of stress cracking when exposed to liquid
adhesive.
9. Excess adhesive can be wiped away with organic solvent.
10. Bonds should be allowed to cool before subjecting to any
service loads.
Loctite Material SpecificationLMS
LMS dated April-22, 2002. Test reports for each batch are
available for the indicated properties. LMS test reports include
selected QC test parameters considered appropriate to
specifications for customer use. Additionally, comprehensive
controls are in place to assure product quality and
consistency. Special customer specification requirements may
be coordinated through Henkel Quality.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or
greater than 28 °C can adversely affect product properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
μm / 25.4 = mil
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

点击下载PDF文件：

  loctite 3106 TDS (66.4 KB, 6 次)
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最近和一位网友讨论PC管套接时使用硅胶进行密封，PC管出现了裂纹和凹槽的情况，大致探讨如下，其实我也是现学现卖和他一起讨论的，自己也算是增加了一个知识点：

网友： Anndi，不知道您有沒有遇到過這樣的問題：PC管塗了密封膠固化之後出現管體的裂痕和凹槽。此密封膠固化過程中會產生酮胺基。而裂解的產物為一氧化矽、一氧化碳和微量的燃燒不完全的碳化物、氧化金屬和甲醛。我能得到的信息就這些，不知道您對此有什麼看法，麻煩您了。

anndi ： 密封胶缩合型的会产生小分子物质（如醇类、酸类或酮类小分子物质），可能会对材料有腐蚀！但你说的裂解我个人觉得不大可能出现， 这个应该是常温固化的密封胶吧！ 即使是加热固化应该也不会发生裂解的现象

网友： 這種密封膠屬於常溫固化類型，在與空氣接觸之後會產生醇類物質，但是PC管與密封膠接觸的部位沒有發現任何腐蝕現象，而是剩餘的管體發生變形而形成凹槽。個人認為是不是pc的內應力所引起的呢？

anndi ： 不打胶没这个现象吗？

网友： 嗯嗯，是的，固話之後才有這個問題，估計是膠和pc發生某種反應而產生的

anndi ： 如果是有机硅胶不应该会有这么大应力的，应该还是你所说的反应产物导致的，用的什么牌号的硅胶？

网友： 我們是台灣***的品牌，我這邊沒有msds

anndi : 哦，你可以自己做个实验试试

网友： 具體怎樣操作呢？

anndi : 如果是你说的现象那就基本可以可肯定是胶的问题，换别的密封胶试试

网友： 我們做過類似的實驗。採用不同品牌的矽膠對pc護欄管進行實驗，都發生了變形；之後，我們採用同一品牌密封膠，換不同品牌的pc管（德國拜耳生產和國內生產），但還是出現了一樣的問題。不過今天發生了一件事情，我們用另外一種膠水，卻發現pc管沒有發生變形

anndi : 另外一种胶水不是有机硅系列吧

网友： 還是有机硅

anndi : 哦，有机硅分脱酸、脱醇、脱酮、脱甲醛等等

网友： 是的

anndi : 你们发生腐蚀的是脱什么的啊？

网友： 脱酮
anndi : 哦，那不腐蚀的呢
网友： 會釋放酮肟基，不腐蝕的是脱醇

anndi : 脱酮肟型的不适用于PC的密封，对铜也有腐蚀的

网友： 明白

anndi : 改用脱醇的好些

网友： 怪不得

anndi :
：）

再次复习一下知识点：

单组分室温硫化硅橡胶的硫化反应是靠空气中的水分来引发的。常用的交链剂是甲基三乙酰氧基硅烷，它的Si-O-C键很易被水解，乙酰氧基与水中的氢基结合成醋酸，而将水中的羟基移至原来的乙酰氧基的位置上，成为三羟基甲基硅烷。三羟基甲基硅烷极不稳定，易与端基为羟基的线型有机硅缩合而成为交链结构。平时，将含有硅醇端基的有机硅生胶与填料、催化剂、交链剂等各种配合剂装入密封的软管中，使用时由容器挤出，借助于空气中的水分而硫化成弹性体， 同时放出低分子物。交链剂除甲基三乙酰氧基硅烷外，还可以是含烷氧基、肟基、胺基、酰胺基、酮基的硅烷。当与烷氧基交链后放出醇，称为脱醇型单组分室温硫化硅橡胶，当与肟基交链后生成肟，称为脱肟型室温硫化硅橡胶、因此，随着交链剂的不同，单组分室温硫化硅橡胶可为脱酸型、脱肟型、脱醇型、脱胺型、脱酰胺型和脱酮型等许多品种。

在网上到处找3541和3542的TDS资料没找到，找到了一份汉高手机组装用胶点彩页，里面也提到了3541和3542，觉得不错，大家可以参考学习一下：

Henkel offers complete engineering services for projects demanding expertise and support beyond the limits of our standard technical services.
As a result, our engineers provide the following value-added services.
• On-site engineering assistance and consultation
• Joint product development programs
• Contract lab services and testing
• Prototype testing
• Custom formulations

Global Capabilities
We are the global technology leader with extensive network to support customers’ value chain.

Design Partnership
Our large experienced team of engineers provide documented design and application support.

Best-in-Class Technical Support
Our professional engineering support empowers our customers to improve their quality and efficiency.

Innovative & Sustainable Solutions
We enable customers’ innovation to meet fast design changes and development with green solutions.

Cost Saving & Reliability
Our superior adhesives and equipment improve productivity, durability and reduce overall cost.

华为网盘下载：http://dl.dbank.com/c0gauebiaa

点击附件下载查看：

  Bonding_Sealing_and_Coating_Solutions_for_Mobile_Devices (1.3 MB, 19 次)
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产品说明
LOCTITE® 410™ 具有下列性能
技术氰基丙烯酸酯
化学类型氰基丙烯酸乙酯
外观(未固化) 黑色液体LMS
组成单组分-无需混合
粘度高
固化方式湿汽固化
应用粘接
主要粘接基材金属, 塑料和橡胶
LOCTITE® 410™ 是橡胶增强型瞬干胶，提高了柔韧性和剥
离强度，增加了抗振动的性能.
固化前的材料特性
比重@ 25 °C 1,1
粘度， Brookfield – RVT, 25 °C, mPa·s (cP):
转子 3, 转速20 rpm 1 700-5 000LMS
闪点 – 见MSDS
典型固化特性一般情况下，材料表面的湿气会引发本产品
的固化反应。尽管本产品在相当短的时间内就可达到完全
实用强度，但是至少要继续固化24小时才能具有完全的耐
化学/溶剂性能。
固化速度与基材的关系
固化速度取决于被粘界的基材，下表表明在22 °C / 50
% 相对湿度的情况下，不同基材的固定时间。试样的剪
切强度达到0.1 N/mm². 所需要的时间。
固定时间, 秒:
钢材 (去脂) 60-120
铝10-30
氯丁橡胶15-25
丁腈橡胶15-25
ABS 20-50
PVC 50-100
聚碳酸酯30-90
酚醛树脂20-60
固化速度与间隙的关系
固化速率取决于粘接间隙。粘接间隙小固化速度快，粘接
间隙增大将降低固化速度.
固化速度与促进剂的关系
粘接间隙过大，致使固化太慢时，在基材表面使用促进剂
可以提高固化速度。但是这样处理会降低粘接的最终强度
。因此建议进行试验以确定实际可达到的性能.

固化后材料典型性能
后24小时 @ 22 °C
物理性能:
热膨胀系数 ISO 11359-2, K-1 80×10-6
导热系数, ISO 8302, W/(m·K) 0,1
玻璃转化温度, ASTM E 228, °C 120
电性能:
介电常数/损失, IEC 60250:
0,05-kHz 2,3 / <0,02
1-kHz 2,3 / <0,02
1 000-kHz 2,3 / <0,02
体积电阻率, IEC 60093, ·cm 10×1015
介电强度, IEC 60243-1, kV/mm 25
固化后材料特性
胶粘剂性能
24小时后 @ 22 °C
剪切强度, ISO 4587:
钢材(喷砂) N/mm² 22
(psi) (3 190)
铝 (蚀刻) N/mm² 15
(psi) (2 175)
ABS N/mm² >6
(psi) (>870)
PVC N/mm² >6
(psi) (>870)
聚碳酸酯 N/mm² >5
(psi) (>725)
酚醛树脂 N/mm² 10
(psi) (1 450)
氯丁橡胶 N/mm² >10
(psi) (>1 450)
丁腈橡胶 N/mm² >10
(psi) (>1 450)
抗拉强度, ISO 6922:
钢材(喷砂) N/mm² 18,5
(psi) (2 680)
后48小时 @ 22 °C
剪切强度, ISO 4587:
钢材(喷砂) N/mm² ≥15,8
(psi) (≥2 290)
65 °C时固化12小时， 之后@ 22 °C进行4小时固化
剪切强度, ISO 4587:
钢材(喷砂) N/mm² ≥19,3LMS
(psi) (≥2 800)

典型环境抵抗性能
1周后 @ 22 °C
剪切强度, ISO 4587:
低碳钢(喷砂)
热强度
在测试温度下进行强度测试
% 强度
温度（°C）
100
75
50
25
0
0 60 80 100 120
老化强度
在测试温度下进行老化,在22 °C进行测试
% 初始强度
时间
150
125
100
75
50
25
0
24 100 500 1000 5000
80 °C
100 °C
耐化学品/溶剂测试
在下列条件下进行老化，在22 °C进行测试.
初始粘结强度的剩有率%
环境°C 100 h 500 h 1000 h
机油(MIL-L-46152) 40 85 85 85
汽油22 90 70 70
异丙醇22 75 75 75
工业甲基化酒精22 95 95 80
1,1,1 三氯乙烷22 80 70 50
氟立昂 TA 22 90 90 85
热/湿95% RH 40 100 100 100
注意事项
本产品不宜在纯氧与（或）富氧环境中使用，不能作为氯
气或其它强氧化性物质的密封材料使用。
有关本产品的安全注意事项，请查阅乐泰的材料安全数据
资料(MSDS).

使用指南
1. 要想获得最好的粘接性能，被粘接的材料表面应当干
净，无油脂.
2. 本产品最适合较小间隙 (0.05 mm)的粘接.
3. 多余的胶粘剂可用乐泰清洗剂，硝基甲烷或丙酮溶解
.
乐泰材料说明LMS
LMS于6月-13, 2001. 每一批号产品都有测试报告
。LMS测试报告中含有一些对客户有用的质检测试参数
。此外，我们也通过多种质量控制，确保产品质量的一致
性。特殊客户的要求可以由汉高乐泰质量中心负责协调。
贮存条件
产品贮存于未开封的原包装内存放在阴凉干燥处。贮存方
法在产品外包装上有所标注。
理想贮存条件: 2 °C to 8 °C. 如将该产品贮存在低
于2 °C或高于8 °C 的温度条件下，可能会影响产品性
能.
被取出包装盒外使用的产品有可能在使用中受到污染。为
避免污染未用胶液，不要将任何胶液倒回原包装内。本公
司将不会对已受到污染的或上面已提及的贮存方法不恰当
的产品负责。如需更多信息，请与当地的乐泰公司技术服
务部或客户服务部联系。
单位换算
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
μm / 25.4 = mil
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
说明
本文中所含的各种数据仅供参考，并被认为是可靠的。对
于任何人采用我们无法控制的方法得到的结果，我们恕不
负责。自行决定把本产品用在本文中提及的生产方法上
，及采取本文中提及的措施来防止产品在贮存和使用过程
中可能发生的损失和人身伤害都是用户自己的责任。鉴于
汉高乐泰公司明确声明对所有因销售乐泰产品或特定场合
下使用乐泰产品而出现的所有问题，包括针对某一特殊用
途的可商品化和适用性的问题，不承担责任。汉高乐泰公
司明确声明对任何必然的或意外损失包括利润方面的损失
都不承担责任。本文中所论述的各种生产工艺或化学成分
都不能被理解为这些专利可以被其他人随便使用和拥有或
被理解为得到了包括这些生产工艺和化学成分的汉高公司
的专利许可证。建议用户每次在正式使用前都要根据本文
提供的数据先做实验。本产品受美国、外国专利或专利应
用的保护。

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最近一个客户在评估一款耐高温的电机胶水，他们日本客户推荐了这款产品，我在网上查看了一下，属于单组分热固化环氧胶粘剂，而且此产品似乎也用于喇叭粘接等其他用途。他们的官网上列举了不少型号，EP138也是其中一种，但是似乎没有能找到其tds资料，倒是从一个朋友那里拿到了一份MSDS资料。放在文章末尾大家可以下载查看！其官网提供的资料如下：
Epoxy resin adhesive refers to the adhesive which cures chemicals containing epoxy group with amines and acid anhydride.

Features

1. Reactive adhesive
2. Solventless
3. No gas produced during curing process
4. Excellent adhesive strength
5. Excellent heat and chemicals resistance
6. Small shrinkage by curing
7. Small creep under load
8. Excellent durability
9. Superb insulation

PRODUCT DESCRIPTION
ABLEBOND 2030SC provides the following product
characteristics:
Technology Proprietary Hybrid Chemistry
Appearance Silver
Cure Heat cure
pH 4.5
Product Benefits • Snap curable
• Low stress
Application Die attach
Filler Type Silver
Key Substrates Most metals
ABLEBOND 2030SC die attach adhesive has been formulated
for use in high throughput die attach applications. This material
is designed to minimize stress and resulting warpage between
dissimilar surfaces. It can be used in a variety of package sizes
.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm) 4.6
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP):
Speed 5 rpm 11,600
Work Life @ 25°C, hours 24
Shelf Life @ -40°C (from date of manufacture), year 1
TYPICAL CURING PERFORMANCE
Cure Schedule
90 seconds @ 110°C
Alternative Cure Schedule
10 seconds @ 150°C
Weight Loss on Cure
10 x 10 mm Si die on glass slide, % 0.4
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on customers'
experience and their application requirements, as well as customer
curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Thermal Conductivity, W/mK 2.3

Tensile Modulus, DMTA :
@ -65 °C N/mm² 6,200
(psi) (900,000)
@ 25 °C N/mm² 3,300
(psi) (480,000)
@ 150 °C N/mm² 350
(psi) (50,000)
@ 250 °C N/mm² 450
(psi) (65,000)
Extractable Ionic Content, @ 100°C ppm:
Chloride (Cl-) <20
Sodium (Na+) <30
Potassium (K+) <5
Weight Loss After Cure, %:
16 hours Isothermal @ 125ºC 0.41
Ramp to 230ºC 0.5
Electrical Properties:
Volume Resistivity, ohms-cm:
cured 90 seconds @ 110ºC 0.0002
Bond Joint Resistance, ohms:
cured 90 seconds @ 110ºC, Cu/Cu, 25μm Bondline 0.008
TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength vs Substrate:
2 X 2 mm die, kg-f,
Die on Substrate: @ RT
Si die on Pd 1.90
Au die on SS 2.24
Au die on Au 2.11
Die Shear Strength vs Die Shear Temperature:
3 X 3 mm Si die, kg-f,
cured 90 seconds @ 110ºC
Substrate @25°C @150°C @200°C
PBGA-FR4 1.90 0.96 0.87
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
THAWING:
1. Allow container to reach room temperature before use.
2. After removing from the freezer, set the syringes to stand
vertically while thawing.
3. Refer to the Syringe Thaw time chart for the thaw time
recommendation.
4. DO NOT open the container before contents reach 25°C
temperature. Any moisture that collects on the thawed
container should be removed prior to opening the
container.

5. DO NOT re-freeze. Once thawed to -40°C, the adhesive
should not be re-frozen.
Temperature, °C
Syringe Thaw Time, Minutes
30
20
10
0
-10
-20
-30
-40
0 10 20 30 40 50
1cc
3cc 10cc 30cc
DIRECTIONS FOR USE
1. Thawed adhesive should be immediately placed on
dispense equipment for use.
2. If the adhesive is transferred to a final dispensing
reservoir, care must be exercised to avoid entrapment of
contaminants and/or air into the adhesive.
3. Adhesive must be completely used within the products
recommended work life of 24 hours.
4. Silver-resin separation may occur if the adhesive is left
out at 25°C beyond the recommended work life.
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C or
greater than minus (-)40 °C can adversely affect product
properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Henkel Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from
domination of patents owned by others or as a license under
any Henkel Corporation patents that may cover such
processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent
applications.

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PRODUCT DESCRIPTION
3508™ provides the following product characteristics:
Technology Epoxy
Appearance Black
Components One component
Product Benefits • Reworkable
• Pb-free applications
• Eliminates post-reflow dispenses
and cure steps
• Improves mechanical reliability of
hand-held devices
Cure Reflow
Application Cornerfill
Typical Assembly
Applications
Chip scale packages and BGA
3508™ reworkable cornerfill is designed to cure during pb-free
reflow while allowing self-alignment of IC components. It can
be pre-applied to the board at the corners of the pad site
using a standard SMA dispenser.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate,@ 25 °C mPa∙s (cP) 50,000
Specific Gravity @ 25 °C 1.24
Pot Life @ 25ºC, days >30
Shelf Life @ 2 to 8°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
Pb-free solder reflow profile @ 245°C
(3 hours @ 180°C for Tg testing)
The above cure profile is a guideline recommendation. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion , ppm/°C:
Below Tg 55
Above Tg 175
Glass Transition Temperature (Tg) by TMA, °C 115
Shore Hardness, Durometer D 71
Storage Modulus, 25°C, GPa 2.48
Tensile Modulus N/mm² 1,130
(psi) (163,892)
Tensile Strength N/mm² 56.5
(psi) (8,190)

GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 to 8°C. Storage below 2°C or greater
than 8°C can adversely affect product properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Do not return products to refrigerated storage; any surplus
product should be discarded.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Henkel Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from
domination of patents owned by others or as a license under
any Henkel Corporation patents that may cover such
processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent
applications.

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PRODUCT DESCRIPTION
ABLEBOND 8380B provides the following product
characteristics:
Technology Epoxy
Appearance Silver
Cure Heat cure
Product Benefits • Electrically conductive
• Fast cure at low temperatures
• Low resin bleed
Application Die attach
Filler Type Silver
Typical Package
Application
Charge Couple Device (CCD)
ABLEBOND 8380B adhesive is designed for medium die
attach applications.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm) 2.0
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP):
Speed 5 rpm 10,000
Work Life @ 25°C, hours 48
Shelf Life @ -40°C (from date of manufacture), year 1
TYPICAL CURING PERFORMANCE
Cure Schedule
15 minutes @ 150°C
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on customers'
experience and their application requirements, as well as customer
curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Electrical Properties:
Volume Resistivity, ohms-cm 0.0002
TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm , psi,
cured 15 minutes @ 150ºC
Substrate
Ag/Cu Leadframe 1400

GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
THAWING:
1. Allow container to reach room temperature before use.
2. After removing from the freezer, set the syringes to stand
vertically while thawing.
3. Refer to the Syringe Thaw time chart for the thaw time
recommendation.
4. DO NOT open the container before contents reach 25°C
temperature. Any moisture that collects on the thawed
container should be removed prior to opening the
container.
5. DO NOT re-freeze. Once thawed to -40°C, the adhesive
should not be re-frozen.
Temperature, °C
Syringe Thaw Time, Minutes
30
20
10
0
-10
-20
-30
-40
0 10 20 30 40 50
1cc
3cc 10cc 30cc
DIRECTIONS FOR USE
1. Thawed adhesive should be immediately placed on
dispense equipment for use.
2. If the adhesive is transferred to a final dispensing
reservoir, care must be exercised to avoid entrapment of
contaminants and/or air into the adhesive.
3. Adhesive must be completely used within the products
recommended work life of 24 hours.
4. Silver-resin separation may occur if the adhesive is left
out at 25°C beyond the recommended work life.
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.

Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C or
greater than minus (-)40 °C can adversely affect product
properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Henkel Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from
domination of patents owned by others or as a license under
any Henkel Corporation patents that may cover such
processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent
applications.

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接触胶水也这么久了，还没认真总结过点胶针头的信息，在之前碰到不少关于针头的差异对胶水提出的要求，比较典型的就是以前的一种低温固化胶水在27G的针头下使用时经常出现堵针头的情况，换大一些的针头问题就不大了。 这里类似27G指的是针头的规格，而且不同规格的产品颜色也有差异，但这个似乎只是行业内约定俗成的标准，并没有强制性要求，在网上找了一些点胶设备厂商对针头的说明，分享之：

点胶针头，分为卡口针头，不锈钢针头，毛刷针头，铁氟龙针头，螺旋塑座针头，多管针头，超长不锈钢针头，不锈钢针管，弯嘴针头，TT斜式针头，PP扰性针头等。均为精工所制，所有不锈钢管皆采用独特工艺，精密抛光无毛边，可实现出胶精确，杜绝拉丝，双螺旋锁紧及大面积旋转设计，不仅使配合更安全而且拆卸更容易。

点胶针头规格表

到EFD的官网上也找了一些关于针头的资讯，摘录如下：

原文链接：http://www.nordson.com/zh-cn/divisions/efd/products/dispense-tips/Pages/Tip-Styles.aspx

http://www.nordson.com/en-us/divisions/efd/products/Documents/product-part-numbers/part_numbers.html#colorcode

通用针头
具有纯聚丙烯 SafetyLok™ 针座的钝化的不锈钢针头可以处理多种流体和点胶应用。

针头的长度有 1/4”、1/2”、1” 和 1-1/2”几种， 内部半径范围在 0.060” 至 0.004”之间。

TT斜式针头

平滑流TT斜式针头为粘度偏高的流体提供快速平滑的应用，尤其是粘度高的或颗粒填充物质，如环氧树脂、RTV 硅树脂以及钎焊软膏。

该种针头有两种结构：

• 挠性半透明针头包含用于保护 UV 敏感性流体的光阻粘合剂
• 钢硬的不透明针头保护光敏感流体，有助于保证在自动点胶工艺中准确地定位

挠性针头

挠性针头可旋转轴伸入较难进入的区域，且不会划伤精密的工作表面。必要时可改变尺寸和角度。
弯角针头

弯角不锈钢针头有弯曲成 45º 和 90º 两种的类型。

毛刷针头

用于涂抹胶和油脂。有软刷毛和硬刷毛两种类型。

斜角针头

斜角针头有助于针头插入精密的表面间隙之间。当使用低黏度流体或者需要微小胶点的时候可以使用更小的针头。

防静电安全要求

专为在电子、磁盘驱动器、光盘以及SMT的生产工艺中点涂胶粘剂和环氧树脂而设计。

MicroDot 针头

屏蔽 UV光的针距为 1/4″ 的不锈钢针头用于光纤、医疗、磁盘驱动和其他应用中，这些应用中需要极其小 而精确的胶点。

扁平针头

用于高浓度流体（如焊锡膏、密封剂和环氧树脂）等的扁平状涂布。

铁氟龙衬里针头

当涂抹低粘度流体时，不锈钢轴内的 Teflon® 衬板能够防止丙烯酸树脂基粘结剂（顺干胶）的阻塞。

铁氟龙涂敷针头

用于光学媒介应用。快速、干净的切断减少了浸锡和滴落现象。

Dispense Tips

Color Coding For Tips Sizes
Color		Gauge	Inner Diameter		Outer Diameter
			mm	inch	mm	inch
	Olive	14	1.54	.060	1.83	.072
	Amber	15	1.36	.053	1.65	.065
	Grey	16	1.19	.047	n/a	n/a
	Green	18	0.84	.033	1.27	.050
	Pink	20	0.61	.024	0.91	.036
	Purple	21	0.51	.020	0.82	.032
	Blue	22	0.41	.016	0.72	.028
	Orange	23	0.33	.013	0.65	.025
	Red	25	0.25	.010	0.52	.020
	Clear	27	0.20	.008	0.42	.016
	Lavender	30	0.15	.006	0.31	.012
	Yellow	32	0.10	.004	0.24	.009

Precision Stainless Steel Tips (50 per box)
Gauge	6.35 mm (0.25″)	12.7 mm (0.50″)	25.4 mm (1.0″)	38.1 mm (1.50″)	45° bend/ 12.7 mm (0.50″)	90° bend/ 12.7 mm (0.50″)	45° bend/ 38.1 mm (1.50″)	Color
14	7018029	7018043	7018032	7018035	7018044	7018045	7016906	Olive
15	7018056	7018068	7018059	7018062	7018069	7018070	n/a	Amber
18	7018107	7018122	7018110	7018113	7018123	7018124	7016908	Green
20	7018163	7018178	7018166	7018169	7018179	7018180	n/a	Pink
21	7005005	7018233	7018222	7018225	7018234	7018235	7016910	Purple
22	7018260	7018272	7018263	7018266	7018273	7018274	n/a	Blue
23	7018302	7018314	7018305	7018308	7018315	7018316	n/a	Orange
25	7018333	7018345	7018336	7018339	7018346	7018347	n/a	Red
27	7018395	7005008	n/a	n/a	7018404	7018405	n/a	Clear
30	7018424	7018433	n/a	n/a	7018434	7018435	n/a	Lavender
32	7018462	n/a	n/a	n/a	n/a	n/a	n/a	Yellow