《New adhesive from DELO cures at temperatures as low as 60°C》：
Low stress curing for temperature-sensitive materials
DELO, manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications, now offers a special heat-curing adhesive that cures to full strength in temperatures as low as 60°C. The new DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping of components being bonded, making it ideal for optical packaging applications, where several temperature-sensitive materials are bound together.
Designed for bonding and casting of compact camera modules, electronic assemblies, mobile assemblies as well as infrared LEDs and image sensors that feature micro-optics, DELOMONOPOX LT204 offers low thermal stress and moderate shrinkage during curing.
This multi-purpose, one component adhesive can be processed within 48 hours at room temperature and has excellent adhesion to many plastics, including LCP, PA and PPS, as well as to metals and FR4 composites.
DELOMONOPOX LT204 can be dispensed through needles with a diameter as small as 200 µm, which are common in consumer electronics. DELO’s new adhesive helps the bonding process excel through low energy consumption and high profitability.
Technical Specifications
Low-tension curing at 60°C
48 hour processing time
Storage life: four months at -18°C
For more information contact Matthias Stollberg at Matthias.Stollberg@DELO.de or +49 8193 9900-212.
《New adhesive from DELO cures at temperatures as low as 60°C》：
Low stress curing for temperature-sensitive materials
DELO, manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications, now offers a special heat-curing adhesive that cures to full strength in temperatures as low as 60°C. The new DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping of components being bonded, making it ideal for optical packaging applications, where several temperature-sensitive materials are bound together.
Designed for bonding and casting of compact camera modules, electronic assemblies, mobile assemblies as well as infrared LEDs and image sensors that feature micro-optics, DELOMONOPOX LT204 offers low thermal stress and moderate shrinkage during curing.
This multi-purpose, one component adhesive can be processed within 48 hours at room temperature and has excellent adhesion to many plastics, including LCP, PA and PPS, as well as to metals and FR4 composites.
DELOMONOPOX LT204 can be dispensed through needles with a diameter as small as 200 µm, which are common in consumer electronics. DELO’s new adhesive helps the bonding process excel through low energy consumption and high profitability.
Storage life: four months at -18°C
For more information contact Matthias Stollberg at Matthias.Stollberg@DELO.de or +49 8193 9900-212.