ROGERS CORP. COOLSPAN TECA film is a thermally and electrically conductive adhesive that is suitable for bonding circuit boards to heavy metal backplanes, heat sinks and housings. The thermosetting, epoxy-based, silver-filled adhesive is a practical alternative to fusion bonding, sweat soldering, press-fit, and other mechanical approaches for attaching circuits to associated structures. Product is supplied in sheet form on a PET carrier and is able to survive lead-free solder processing, while improving chemical resistance and high temperature performance.
《Thermally conductive adhesive bonds circuit boards》：
ROGERS CORP. COOLSPAN TECA film is a thermally and electrically conductive adhesive that is suitable for bonding circuit boards to heavy metal backplanes, heat sinks and housings. The thermosetting, epoxy-based, silver-filled adhesive is a practical alternative to fusion bonding, sweat soldering, press-fit, and other mechanical approaches for attaching circuits to associated structures. Product is supplied in sheet form on a PET carrier and is able to survive lead-free solder processing, while improving chemical resistance and high temperature performance.