《UV adhesive formulated for microelectronic assembly applications》：
ENGINEERED MATERIAL SYSTEMS
ENGINEERED MATERIAL SYSTEMS 535-10M-45 UV Cured Epoxy Adhesive material contains a secondary thermal cure initiator that cures as low as 90C for shadowed areas. Formulated for disk drive, camera module, optoelectronic and circuit assembly applications, product is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Material eliminates any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly. This non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-10M-45 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony.
《UV adhesive formulated for microelectronic assembly applications》：
ENGINEERED MATERIAL SYSTEMS 535-10M-45 UV Cured Epoxy Adhesive material contains a secondary thermal cure initiator that cures as low as 90C for shadowed areas. Formulated for disk drive, camera module, optoelectronic and circuit assembly applications, product is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. Material eliminates any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly. This non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-10M-45 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony.